MC9S12XDP512MAG vs MC9S12H256VPVE Vergleich

Detaillierter Direktvergleich von MC9S12XDP512MAG von NXP Semiconductors und MC9S12H256VPVE von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
MC9S12XDP512MAG MC9S12XDP512MAG - 16-bit 80MHz 512KB Flash MCU | NXP

MC9S12XDP512MAG - 16-bit 80MHz 512KB Flash MCU | NXP

MC9S12XDP512MAG Nrnd
NXP Semiconductors
MC9S12H256VPVE MC9S12H256VPVE - 16-bit 50MHz HCS12 MCU 256KB Flash LQFP-112 | NXP

MC9S12H256VPVE - 16-bit 50MHz HCS12 MCU 256KB Flash LQFP-112 | NXP

MC9S12H256VPVE ✓ Aktiv

Spezifikationsvergleich

Parameter MC9S12XDP512MAG MC9S12H256VPVE
Marke NXP Semiconductors NXP Semiconductors
Kategorie Microcontrollers Microcontrollers
Lebenszyklusstatus NRND Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $0,00 $17,25
Core Processor HCS12X (16-bit CISC) —
Core Size 16-bit —
Maximale Taktfrequenz 80 MHz —
Flash Memory Size 512 KB (512K x 8) —
Versorgungsspannung 2.5 V / 5 V —
Gehäuse 144-LQFP (20x20 mm) 112-LQFP (20 x 20 mm)
Montageart Surface Mount Surface Mount
Terminal Form Gull Wing —
Package Shape Square (LFQFP) —
ADC Resolution 10-bit —
Temperature Grade Automotive —
Qualification AEC-Q100 —
Instruction Set Compatibility Upward compatible with HCS12 —
External Bus Interface Yes (144-pin LQFP option) —
Target Application Domain Automotive multiplexing —
Lebenszyklusstatus NRND (Not Recommended for New Designs) —
Core — HCS12 (16-bit)
Maximum CPU Frequency — 50 MHz
Program Flash Memory — 256 KB (256K x 8)
On-chip RAM — 12 KB
On-chip EEPROM — 4 KB
Operating Voltage — 4.5 V to 5.5 V (regulated internally to 2.5 V core)
Betriebstemperatur — -40 °C to +105 °C
CAN Modules (msCAN) — 2 x CAN 2.0A/B
SCI (UART) Modules — 2
SPI Modules — 2
IIC (I²C) Modules — 1
A/D Converter — 10-bit, 8/16 channels
Enhanced Capture Timer — 16-bit, 8 channels
PWM Channels — 8 x 8-bit or 4 x 16-bit
General-Purpose I/O — Up to 91 pins
Debug Interface — Background Debug Mode (BDM)
Low-Power Modes — STOP, PSEIP pseudofrozen
RoHS-Status — Compliant

Datenblätter & Ressourcen

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