MC9S12XEP768CAG vs MC9S12XDT512CAG Vergleich
Detaillierter Direktvergleich von MC9S12XEP768CAG von NXP Semiconductors und MC9S12XDT512CAG von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MC9S12XEP768CAG - 16-Bit HCS12X MCU 768KB Flash 144-LQFP | NXP
MC9S12XEP768CAG ✓ AktivSpezifikationsvergleich
| Parameter | MC9S12XEP768CAG | MC9S12XDT512CAG |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Aktiv | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $19,85 | $85,00 |
| Core | HCS12X (16-bit) with XGATE co-processor | — |
| Maximum CPU Frequency | 50 MHz | — |
| Program Flash | 768 KB (768K x 8) with ECC | — |
| SRAM | 32 KB | — |
| Data Flash | [DATA_NEEDED: Data Flash size] | — |
| Operating Voltage | 1.8V / 2.8V / 5V | — |
| Supply Voltage Range | [DATA_NEEDED: full VIN min/max range] | — |
| Betriebstemperatur | -40C to +85C (automotive grade) | [DATA_NEEDED: operating temperature range] |
| CAN Modules | 4 x msCAN (CAN 2.0A/B) | — |
| ADC | 2 x 10-bit ADC, up to 24 channels | — |
| PWM Channels | Up to 8 channels | — |
| SCI / LIN | 2 x SCI (LIN-capable) | — |
| SPI | 3 x SPI | — |
| Timers | 8-channel 16-bit timer with capture/compare | — |
| Debug Interface | JTAG and BDM | — |
| Gehäuse | 144-LQFP (20x20 mm) | 144-LQFP (20x20 mm) |
| Montageart | Surface Mount | Surface Mount |
| MSL-Level | [DATA_NEEDED: MSL level] | — |
| RoHS-Status | Compliant | — |
| Core Processor | — | HCS12X (CPU12X) |
| Core Size | — | 16-bit |
| Speed | — | 80 MHz |
| Program Memory Type | — | FLASH |
| Program Memory Size | — | 512 KB (512K x 8) |
| Versorgungsspannung | — | 2.35 V to 2.75 V |
| I/O Count | — | 119 |
| Architecture | — | HCS12X (CISC, upward compatible with HCS12) |
| Family Series | — | 9S12X (S12XD) |
| Technology | — | CMOS |
| Target Application | — | Automotive multiplexing |
| Life Cycle Stage | — | ACTIVE (per datasheet listings); NRND per NXP product page |
| Connectivity | — | CAN, SCI, SPI, I2C [DATA_NEEDED: exact peripheral count] |
| ADC Resolution | — | [DATA_NEEDED: ADC resolution] |
| RAM Size | — | [DATA_NEEDED: RAM size] |
| EEPROM Size | — | [DATA_NEEDED: EEPROM size] |