MC9S12XDT512CAG - 16-bit 80MHz 512KB Flash MCU | NXP
Teilenummer: MC9S12XDT512CAG ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $101.22 | $101,22 |
| 10 | $96.5 | $965,00 |
| 100 | $92.1 | $9.210,00 |
| 500 | $88.4 | $44.200,00 |
| 1.000 | $85 | $85.000,00 |
MC9S12XDT512CAG Übersicht
A microcontroller unit (MCU) is a single-chip embedded processor that integrates a CPU core, program memory, data memory, and peripheral functions such as timers, communication interfaces, and analog-to-digital converters on one die. Within the semiconductor hierarchy, the MC9S12XDT512CAG belongs to the 16-bit microcontroller class, part of the broader family of embedded processors used in automotive and industrial control systems, sitting above simple 8-bit MCUs and below 32-bit application processors.
Key features include the enhanced HCS12X CPU core, upward compatible with the HCS12 instruction set, which preserves code compatibility and programmer's model for legacy HCS12 designs. The XGATE co-processor architecture of the S12XD family offloads interrupt handling and communication tasks, letting the main CPU achieve 32-bit-class throughput with 16-bit efficiency. The device integrates 119 general-purpose I/O lines, a 16-channel 10-bit ADC, and multiple serial interfaces including CAN, SCI, and SPI, targeting automotive multiplexing networks.
The S12XD family architecture combines a CISC-style CPU12X core with an interrupt dispatch mechanism that reduces latency, which is why NXP positioned it as delivering 32-bit performance with 16-bit advantages. Flash program memory of 512 KB supports large application images typical of body control modules, gateways, and instrument clusters. The supply voltage of 2.35 V to 2.75 V (2.5 V nominal class) reflects the core supply regulation approach used across this generation of S12X devices.
Typical applications include automotive body electronics, gateway modules, industrial automation controllers, and motor management systems where CAN networking and deterministic interrupt response are required.
When designing with this MCU, confirm current lifecycle status: NXP lists the part as NRND (Not Recommended for New Designs), so new designs should evaluate the S12XE successors or migrate to 32-bit alternatives.
This page synthesizes distributor pricing, pin-compatible family alternatives, and practical design notes not consolidated in the manufacturer datasheet.
Drop-in-Alternativen für MC9S12XDT512CAG – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MC9S12XDT512CAG (gleiche Bauform und Footprint) – abweichend in Operating Temperature, Package, Core, Timers, ADC.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MC9S12XDP512CAG
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MC9S12XDT512MAA
✅ Drop-In✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →MC9S12XDT256CAG
✅ Drop-In✓ Auf Lager
$17.4 / Stück
Datenblatt ansehen →MC9S12XEP768CAG
✅ Drop-In✓ Auf Lager
$19.85 / Stück
Datenblatt ansehen →MC9S12XEQ384CAG
✅ Drop-In✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →S912XET512BMAGR
✅ Drop-In✓ Auf Lager
$6.6 / Stück
Datenblatt ansehen →MC9S12XEQ512MAL
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MC9S12XDT512CAG Grenzwerte & elektrische Eigenschaften
| Core Processor | HCS12X (CPU12X) |
| Core Size | 16-bit |
| Speed | 80 MHz |
| Program Memory Type | FLASH |
| Program Memory Size | 512 KB (512K x 8) |
| Versorgungsspannung | 2.35 V to 2.75 V |
| I/O Count | 119 |
| Gehäuse | 144-LQFP (20x20 mm) |
| Montageart | Surface Mount |
| Architecture | HCS12X (CISC, upward compatible with HCS12) |
| Family Series | 9S12X (S12XD) |
| Technology | CMOS |
| Target Application | Automotive multiplexing |
| Life Cycle Stage | ACTIVE (per datasheet listings); NRND per NXP product page |
MC9S12XDT512CAG 144-lqfp (20x20 mm) Pinbelegungsleitfaden
Pinbelegung für MC9S12XDT512CAG (144-lqfp (20x20 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für MC9S12XDT512CAG.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
MC9S12XDT512CAG ist geeignet für 6 Anwendungs: Automotive Body Control Modules, Automotive Gateway Modules, Industrial Automation Controllers, Instrument Clusters, Motor Management and Control Units, Legacy System Maintenance and Repair.
Automotive Body Control Modules
The MC9S12XDT512CAG fits body control modules because it combines an 80 MHz HCS12X core, 512 KB Flash, 119 I/O lines, and multiple CAN channels in one 144-LQFP device, covering the lamp, door, and seat-load driving plus network gateway duties a BCM demands. In a typical topology the MCU reads switch and sensor inputs through its analog and digital ports, drives loads via external high-side drivers, and bridges low-speed and high-speed CAN segments on-chip. The XGATE-class interrupt offload keeps lamp PWM timing deterministic while the main CPU runs diagnostics. The main trade-off is that the part is NRND, so BCM programs should pair immediate builds with a qualification plan on the S912XET512BMAGR, which shares the same 144-LQFP footprint.
Empfohlen
Automotive Gateway Modules
Gateway modules route frames between multiple CAN buses and diagnostic channels, and the MC9S12XDT512CAG suits this role with its on-chip CAN controllers, 80 MHz core for fast frame filtering and translation, and 512 KB Flash for protocol stacks and OTA-style bootloaders. The enhanced indexed addressing and interrupt queue of the HCS12X core reduce ISR latency, keeping worst-case forwarding delay predictable at network saturation. Designs typically use the SCI interface for UDS diagnostics over K-Line and SPI for external CAN-FD or LIN expansion. Because the XD family is NRND, gateways with long service lifetimes should validate the pin-compatible MC9S12XEP768CAG, whose 768 KB Flash also adds margin for growing diagnostic stacks, before committing the layout to production.
Empfohlen
Industrial Automation Controllers
In industrial controllers, the MC9S12XDT512CAG offers deterministic 16-bit control with 80 MHz execution, 119 I/O lines for relay, sensor, and encoder interfacing, and enough Flash for fieldbus protocol firmware and data logging. Its upward HCS12 compatibility protects decades of proven control code, which matters in machinery with long certification cycles. Typical designs use the 10-bit ADC class inputs for analog sensor acquisition, timer channels for PWM outputs to actuators, and SCI/SPI links to HMIs. The core supply window of 2.35 V to 2.75 V is managed by on-board regulators in NXP reference designs. Industrial users should note the NRND status and stock last-time-buy quantities, or design in the footprint-compatible S912XET512BMAGR to keep the PCB unchanged across generations.
Empfohlen
Instrument Clusters
Automotive instrument clusters need simultaneous stepper-motor gauge driving, LCD control, backlight PWM, CAN reception, and warning-chime generation, all of which map well onto the MC9S12XDT512CAG's timer resources, 119 I/O lines, and 512 KB Flash for graphics and diagnostics. The 80 MHz clock gives headroom for smooth gauge pointer motion algorithms, while interrupt co-dispatch keeps CAN message servicing from jittering the display update loop. Clusters also benefit from the family's EMC-hardened I/O design used across the S12X automotive portfolio. For cluster programs starting today, the NRND marking makes the XE-generation S912XET512BMAGR the recommended drop-in, since it preserves the 144-LQFP land pattern while offering a current-production silicon roadmap and improved EMC characterization data.
Empfohlen
Motor Management and Control Units
Motor management units for window lifts, wipers, pumps, and HVAC blowers use the MC9S12XDT512CAG for its combination of PWM timer channels, 10-bit ADC inputs for current and position feedback, and CAN connectivity for vehicle network commands. The 80 MHz HCS12X core executes PI control loops and stall detection algorithms with margin, and 512 KB Flash stores autolearning routines plus fault logs. Its HCS12 lineage means existing motor-control firmware libraries port with minimal change, shortening development cycles. Designs typically pair the MCU with external H-bridge or high-side driver ICs on the SPI bus. The 2.35 V to 2.75 V core supply simplifies integration with 5 V automotive electrical systems through standard S12X power architectures. NRND status favors the S912XET512BMAGR for new motor-control platforms.
Empfohlen
Legacy System Maintenance and Repair
A large installed base of automotive ECUs and industrial controllers built on the S12XD family depends on the MC9S12XDT512CAG for service replacements and remanufacturing. With 2,526 units in stock at independent distributors as of October 2026 and DigiKey shipping same-day, maintenance buyers can source verified original parts today, though NRND means no new factory production. Repair shops should verify date codes and request traceability from independent channels. Where stock dries up, the pin-compatible MC9S12XDP512CAG with identical 512 KB Flash and 80 MHz rating provides a same-footprint substitute, while the MC9S12XDT512MAA ordering variant offers another sourcing path for the identical die. XAIPART stocks multiple S12X family MPNs to support mixed repair inventories.
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Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MC9S12XDT512CAG – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MC9S12XDP512CAG | MC9S12XDT512MAA | MC9S12XDT256CAG | MC9S12XEP768CAG | S912XET512BMAGR |
|---|---|---|---|---|---|---|
| Package | 144-LQFP (20x20 mm) | 144-LQFP (20x20) - same | 144-LQFP (20x20) - same | 144-LQFP (20x20) - same | 144-LQFP (20x20) - same | 144-LQFP (20x20) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core / Speed | HCS12X 16-bit, 80 MHz | HCS12X 16-bit, 80 MHz | HCS12X 16-bit, 80 MHz | HCS12X 16-bit, 80 MHz | S12XE 16-bit, 50 MHz-class bus | S12XE 16-bit, 50 MHz-class bus |
| Flash Memory | 512 KB | 512 KB | 512 KB | 256 KB | 768 KB | 512 KB |
Wichtigste Unterscheidungsmerkmale
- Highest Flash density in the XD family variant class (vs. MC9S12XDT256CAG)
- Faster core clock than the XE successor generation (vs. MC9S12XEQ512MAL)
- Same 512 KB capacity with a current production path (vs. S912XET512BMAGR)
Designhinweise
NXP lists the MC9S12XDT512CAG as NRND on its official product page, even though third-party specification databases still show 'ACTIVE' lifecycle. Never use the NRND part in a new design without a documented exit strategy: secure a last-time-buy quantity sized to the product lifetime plus service spares, and pre-qualify the pin-compatible S912XET512BMAGR (S12XE, same 144-LQFP footprint) so the PCB can absorb a second-source build without re-layout. Ignoring this dual-path plan is the single most common sourcing failure on S12XD platforms.
The specified supply window of 2.35 V to 2.75 V refers to the regulated core supply class of the S12XD generation; the device family relies on an internal regulator fed from the 5 V automotive rail through dedicated VDD/VSS and VDDR pin pairs. Follow the S12XD hardware design guide (available on the NXP MC9S12XDT512CAG product page) for decoupling: place low-ESR capacitors on every VDDx/VSSx pin pair and keep the VDDA/VSSA analog pair isolated with an RC filter from the digital rail to preserve ADC accuracy on the 16-channel analog port.
For the 144-LQFP (20x20 mm) footprint, use 0.5 mm pitch escape routing with at least two ground vias per quadrant of the exposed center area for thermal relief and EMC. Keep the CAN transceiver placement within 20 mm of the MCU CAN pins and route the crystal loop short and guarded. Estimated: at 80 MHz with heavily switched I/O, keep trace stubs under 30 mm on SPI and timer outputs to limit ringing; add 22-33 ohm series resistors on long lines as a low-cost damping measure. These values are design estimates, not datasheet limits.
Compliance-Informationen
Compliance data was not present in the provided verified web data. The C in the ordering MPN indicates a lead-free/compliance option code per NXP convention, but explicit RoHS/REACH status must be confirmed on the NXP product page environmental section.
