MCF52235CVM60 vs MCF52212CAE50 Vergleich
Detaillierter Direktvergleich von MCF52235CVM60 von NXP Semiconductors und MCF52212CAE50 von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MCF52235CVM60 - 32-bit ColdFire V2 MCU, 256KB Flash, 60MHz | NXP
MCF52235CVM60 NrndNXP Semiconductors
MCF52212CAE50 - 50MHz ColdFire V2 MCU 64KB Flash 64-LQFP | NXP
MCF52212CAE50 NrndSpezifikationsvergleich
| Parameter | MCF52235CVM60 | MCF52212CAE50 |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | NRND | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $9,10 | $6,74 |
| Core Architecture | ColdFire V2 (32-bit RISC) | — |
| Core Frequency | 60 MHz | — |
| Program Memory | 256 KB Flash | — |
| RAM | 32 KB SRAM | 8 KB (8K x 8) |
| Versorgungsspannung | 3.0 V to 3.6 V | — |
| Gehäuse | 121-MAPBGA (12 x 12 mm) | — |
| Ethernet | 10/100 Mbps MAC with integrated PHY (EPHY) | — |
| CAN | 1 x CAN 2.0B | — |
| UART | 3 x UART | 3 |
| I2C | 2 x I2C | 2 |
| SPI | 1 x QSPI | 1 |
| DMA | 4-channel DMA | — |
| Betriebstemperatur | -40 C to +85 C | -40C to +85C |
| Montageart | Surface Mount (BGA) | Surface Mount |
| RoHS-Status | Compliant | [DATA_NEEDED: RoHS status] |
| Lebenszyklusstatus | NRND (Not Recommended for New Designs) | — |
| Core | — | ColdFire V2 (32-bit RISC, 68k-derived) |
| CPU Clock Speed | — | 50 MHz |
| Program Memory (Flash) | — | 64 KB (64K x 8) |
| Number of I/O Pins | — | 56 |
| Gehäuse / Bauform | — | 64-LQFP (10x10 mm) |
| USB Interface | — | USB On-The-Go (OTG) integrated |
| Temperature Grade | — | Industrial |
| Lead Free | — | [DATA_NEEDED: lead free] |