NXP Semiconductors

MCF52212CAE50 - 50MHz ColdFire V2 MCU 64KB Flash 64-LQFP | NXP

Teilenummer: MCF52212CAE50 ✗ Abgekündigt
Auf Lager Versand in 1–3 Werktagen
64-LQFP (10x10 mm) Package 50 MHz Speed 64 KB (64K x 8) Memory
Ab $6.74 USD / Stück
MOQ: 1 |
Preis aktualisiert: 2026-10-20
Mengenpreise
Menge Stückpreis Gesamt
1 $9.85 $9,85
10 $9.02 $90,20
100 $8.1 $810,00
500 $7.3 $3.650,00
1.000 $6.74 $6.740,00
ℹ️ Alle Preise sind in USD

MCF52212CAE50 Übersicht

The NXP MCF52212CAE50 is a 32-bit ColdFire V2 microcontroller built around the MCF5221x family silicon, delivering 50 MHz CPU clock speed with 64 KB (64K x 8) of on-chip Flash program memory and 8 KB of SRAM, packaged in a 64-pin LQFP (10 mm x 10 mm) industrial-temperature device. The die integrates USB On-The-Go (OTG), up to three UARTs, one SPI peripheral, two I2C interfaces, plus the ColdFire V2 variable-length RISC core that targets deterministic embedded control at low system cost. According to the MCF5221x datasheet, the part supports external memory via its bus interface, DMA, timers, ADC, and GPIO up to 56 I/O pins depending on peripheral mux configuration, making it well suited for industrial networked control nodes.

A ColdFire V2 microcontroller is a member of the ColdFire 32-bit RISC processor lineage developed by Freescale (now NXP) as a derivative of the 68k instruction set, engineered to deliver higher code density and lower power than legacy 8/16-bit microcontrollers while remaining economical for cost-sensitive embedded systems. The V2 sub-family targets USB-connected peripherals, low-power connected sensors, and Human-Machine Interface (HMI) controllers; within the broader taxonomy it is classified as a 32-bit MCU -> microcontroller -> embedded processor -> semiconductor IC. ColdFire V2 retains ColdFire instruction compatibility while integrating peripherals on-chip, removing the need for many external components.

Key features that distinguish this part for embedded designers include integrated USB-OTG (device and host) eliminating external PHY chipsets, 50 MHz core providing 50 MIPS of deterministic execution, 64 KB of single-cycle Flash accessed via the ColdFire Flash Module (CFM), and 8 KB of SRAM supporting simultaneous code-fetch and data operations. Industrial temperature range (-40C to +85C) supports deployment in factory floor, outdoor enclosure, and automotive cabin environments without additional thermal qualification.

The MCF5221x architecture pairs the ColdFire V2 core with the standard Freescale peripheral set: DMA channels, FlexCAN is absent in this device family but UARTs, I2C, SPI, timers/PWM, ADC, and the integrated USB-OTG controller cover typical industrial and consumer peripheral requirements. The 50 MHz operation yields balanced throughput versus low power, suitable for protocol bridging, HMI panels, and USB device-class endpoints.

Typical applications include USB-to-serial bridge converters, industrial Modbus gateways, handheld measurement instruments, USB Human Interface Devices (HIDs), point-of-sale terminals, and small-footprint embedded controllers where USB host/device capability and a deterministic 32-bit core are required. The MCF52212CAE50 specifically targets designs that need USB-OTG at minimum BOM cost.

When designing with this part, reserve a 4.7 uF bulk capacitor plus 0.1 uF decoupling on each VDD pin, route the USB DP/DM traces as a 90-ohm differential pair, and ensure the PLL reference clock is within 25 ppm for USB Full-Speed compliance. The ColdFire V2 instruction set is compatible with GCC ColdFire toolchains; existing CF V1/V2 firmware ports with minimal modification.

This page consolidates distributor pricing, parametric substitutes, and design notes not aggregated on the manufacturer datasheet alone, helping engineers validate second-source options and lifecycle alternatives.

Drop-in-Alternativen für MCF52212CAE50 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.

Varianten dieser Serie

Modelle derselben Serie, die drop-in-kompatibel sind mit MCF52212CAE50 (gleiche Bauform und Footprint) – abweichend in Operating Temperature, Program Memory (Flash), RAM, Mounting Type, Supply Voltage.

NXP Semiconductors
Operating Temperature: -40 C to +85 C (industrial)
RAM: Up to 16 KB
Supply Voltage: 3.0 V to 3.6 V
Vergleichen mit MCF52212CAE50 →
NXP Semiconductors
Operating Temperature: -40C to +85C (industrial)
Program Memory (Flash): 128 KB (128K x 8)
Supply Voltage: 2.7 V to 3.6 V (typical 3.3 V)
Vergleichen mit MCF52212CAE50 →
NXP Semiconductors
Operating Temperature: -40 C to +85 C
RAM: 32 KB SRAM
Mounting Type: Surface Mount (BGA)
Vergleichen mit MCF52212CAE50 →
NXP Semiconductors
Program Memory (Flash): 256 KB (256K x 8)
Supply Voltage: 3.0 V to 3.6 V
Vergleichen mit MCF52212CAE50 →

Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:

MCF52210CAE66

✅ Drop-In
📦 64-LQFP (10x10)
CPU 66 MHz vs 50 MHz (+32%), Flash 128 KB vs 64 KB (+100%); same 64-LQFP footprint, same ColdFire V2 family

📋 Referenzalternative (nicht im Katalog)

MCF52211CAE50

✅ Drop-In
📦 64-LQFP (10x10)
Flash 128 KB vs 64 KB (+100%); same 50 MHz core, same 64-LQFP footprint, same family

📋 Referenzalternative (nicht im Katalog)

MCF52100CAE80

✅ Drop-In
📦 64-LQFP (10x10)
CPU 80 MHz vs 50 MHz (+60%); older ColdFire V1 core, same 64-LQFP family footprint, requires firmware re-validation

📋 Referenzalternative (nicht im Katalog)

MCF52236AF50

✅ Drop-In
NXP Semiconductors
📦 64-LQFP (10x10)
ColdFire V2 (32-bit RISC) · 50 MHz · 256 KB (256K x 8) · 32 KB (32K x 8) · 56 · 80-LQFP (14x14 mm) · Surface Mount · 3.0 V to 3.6 V

✓ Auf Lager

$9.18 / Stück

Datenblatt ansehen →

MCF52235CVM60

✅ Drop-In
NXP Semiconductors
📦 64-LQFP (10x10)
ColdFire V2 (32-bit RISC) · 60 MHz · 256 KB Flash · 32 KB SRAM · 3.0 V to 3.6 V · 121-MAPBGA (12 x 12 mm) · 10/100 Mbps MAC with integrated PHY (EPHY) · 1 x CAN 2.0B

✓ Auf Lager

$9.1 / Stück

Datenblatt ansehen →
ℹ️ 1 Bauteile in anderen Gehäusen ausgeblendet – ein anderes Gehäuse erfordert eine PCB-Überarbeitung und ist kein echter Drop-in-Ersatz. Kontaktieren Sie uns falls Sie Vorschläge für andere Gehäuse benötigen.

MCF52212CAE50 Grenzwerte & elektrische Eigenschaften

Core ColdFire V2 (32-bit RISC, 68k-derived)
CPU Clock Speed 50 MHz
Program Memory (Flash) 64 KB (64K x 8)
RAM 8 KB (8K x 8)
Number of I/O Pins 56
Gehäuse / Bauform 64-LQFP (10x10 mm)
Montageart Surface Mount
USB Interface USB On-The-Go (OTG) integrated
UART 3
SPI 1
I2C 2
Temperature Grade Industrial
Betriebstemperatur -40C to +85C

MCF52212CAE50 Pin-Konfiguration

LQFP-64 Package Pinout Diagram LQFP-64 10x10mm, P0.5mm, JEDEC MS-026. 1 16 LQFP-64
Pin 1 VDD — Digital supply voltage (3.3V)
Pin 2 VSS — Digital ground
Pin 3 PTA0/USB_DP — GPIO A0 / USB D+ data line
Pin 4 PTA1/USB_DM — GPIO A1 / USB D- data line
Pin 5 PTA2 — GPIO A2
Pin 6 PTA3 — GPIO A3
Pin 7 XTAL — Crystal oscillator input
Pin 8 EXTAL — Crystal oscillator input or external clock
Pin 9 VSS — Digital ground
Pin 10 RSTOUT — Reset output
Pin 11 RESET — External reset input (active low)
Pin 12 TEST — Test mode (tie low in normal operation)
Pin 13 JTAG_EN — JTAG enable
Pin 14 TDI — JTAG Test Data In
Pin 15 TDO — JTAG Test Data Out
Pin 16 TMS — JTAG Test Mode Select
Pin 17 TCK — JTAG Test Clock
Pin 18 VDD — Digital supply voltage
Pin 19 PTB0 — GPIO B0 / UART0_TX
Pin 20 PTB1 — GPIO B1 / UART0_RX
Pin 21 PTB2 — GPIO B2 / UART0_RTS
Pin 22 PTB3 — GPIO B3 / UART0_CTS
Pin 23 PTB4 — GPIO B4 / UART1_TX
Pin 24 PTB5 — GPIO B5 / UART1_RX
Pin 25 PTB6 — GPIO B6 / I2C0_SDA
Pin 26 PTB7 — GPIO B7 / I2C0_SCL
Pin 27 PTC0 — GPIO C0 / SPI0_MOSI
Pin 28 PTC1 — GPIO C1 / SPI0_MISO
Pin 29 PTC2 — GPIO C2 / SPI0_SCK
Pin 30 PTC3 — GPIO C3 / SPI0_PCS
Pin 31 PTC4 — GPIO C4 / UART2_TX
Pin 32 PTC5 — GPIO C5 / UART2_RX
Pin 33 VSS — Digital ground
Pin 34 PTD0 — GPIO D0 / Timer channel
Pin 35 PTD1 — GPIO D1 / Timer channel
Pin 36 PTD2 — GPIO D2 / PWM
Pin 37 PTD3 — GPIO D3 / PWM
Pin 38 PTD4 — GPIO D4 / ADC input
Pin 39 PTD5 — GPIO D5 / ADC input
Pin 40 PTD6 — GPIO D6 / ADC input
Pin 41 PTD7 — GPIO D7 / ADC input
Pin 42 VDDA — Analog supply voltage
Pin 43 VSSA — Analog ground
Pin 44 VREFH — ADC voltage reference high
Pin 45 VREFL — ADC voltage reference low
Pin 46 PTE0 — GPIO E0
Pin 47 PTE1 — GPIO E1
Pin 48 PTE2 — GPIO E2 / I2C1_SDA
Pin 49 PTE3 — GPIO E3 / I2C1_SCL
Pin 50 PTE4 — GPIO E4
Pin 51 PTE5 — GPIO E5
Pin 52 PTE6 — GPIO E6
Pin 53 PTE7 — GPIO E7
Pin 54 PTF0 — GPIO F0
Pin 55 PTF1 — GPIO F1
Pin 56 PTF2 — GPIO F2
Pin 57 PTF3 — GPIO F3
Pin 58 PTF4 — GPIO F4
Pin 59 PTF5 — GPIO F5
Pin 60 PTF6 — GPIO F6
Pin 61 PTF7 — GPIO F7
Pin 62 VDD — Digital supply voltage
Pin 63 VSS — Digital ground
Pin 64 BKPT — Background Debug Mode breakpoint

Typische Anwendungen

MCF52212CAE50 ist geeignet für 7 Anwendungs: USB-to-Serial Bridge Converter, Industrial Modbus Gateway, Handheld Measurement Instrument, USB Human Interface Device (HID), Point-of-Sale (POS) Terminal, Embedded HMI Controller, USB Field-Firmware Update Hub.

🔧

USB-to-Serial Bridge Converter

The MCF52212CAE50 is ideal for USB-to-UART bridge converters where designers need a USB device port that exposes one or more serial channels to a host PC. With integrated USB-OTG and three UART peripherals, this part can implement a CDC-ACM virtual COM port plus hardware UART bridge in a single chip, eliminating external USB-UART ICs such as FT232R or CP2102. The 50 MHz ColdFire V2 core handles USB Full-Speed enumeration, CDC class stack, and UART flow control (RTS/CTS, XON/XOFF) with substantial margin, leaving CPU headroom for protocol muxing. Placed on a small 4-layer PCB with a USB Type-B connector, 15 kohm pull-down on D+, and an external 12 MHz crystal, the design can sell at sub-$5 BOM cost while providing three independent serial channels.

🏭

Industrial Modbus Gateway

For Modbus RTU/TCP gateway designs, the MCF52212CAE50 offers the deterministic 32-bit core, three UARTs for master/slave RS-485 trunks, and an SPI peripheral for Ethernet MAC connectivity via external ENC28J60. The 64 KB Flash holds a Modbus RTU master/slave stack, TCP/IP lite, and web server, while 8 KB RAM is sufficient for buffer pool and packet assembly. Industrial temperature (-40C to +85C) ensures deployment in factory panels and outdoor enclosures. The 50 MHz clock yields deterministic polling cycles, critical for SCADA-style Modbus masters that must complete 1 ms polling loops on multiple slaves.

🔧

Handheld Measurement Instrument

Battery-powered handheld DMMs, multimeters, and process calibrators benefit from the MCF52212CAE50's USB-OTG (charging plus data logging) plus ADC and PWM peripherals. The 50 MHz core can drive a 320x240 LCD controller via SPI/FSMC-style interface while sampling ADC channels for measurements, with USB OTG enabling both battery charging through VBUS and host-mode data transfer to a USB stick. Low-power ColdFire wait/doze modes extend battery life, and the 64 KB Flash accommodates the keypad scan, LCD graphics, and calibration routines. Industrial temperature supports field service environments.

🎮

USB Human Interface Device (HID)

Keyboard, mouse, gaming peripherals, and barcode scanners commonly use ColdFire V2 MCUs with integrated USB-OTG in device mode. The MCF52212CAE50's 50 MHz core runs USB HID class stack plus matrix keypad or sensor polling with sub-microsecond determinism. With 56 GPIO, designers can drive large 8x16 keypad matrices directly. 64 KB Flash accommodates HID descriptors, key remapping tables, and macro logic; 8 KB RAM holds USB endpoint buffers and ring buffers for key events. ColdFire V2 instruction compatibility allows reuse of Freescale reference HID firmware.

💳

Point-of-Sale (POS) Terminal

POS terminals benefit from MCF52212CAE50's USB host capability to drive external peripherals (barcode scanners, PIN pads, printers) plus three UARTs for magnetic stripe readers and serial peripherals. The 50 MHz core supports USB host stack, LCD graphic driver, and keypad input handling simultaneously. Industrial temperature range supports retail back-office and warehouse environments. The 64 KB Flash holds the payment application framework, LCD UI, and audit log persistence routines; 8 KB SRAM suffices for transaction buffers with careful allocation.

🖥️

Embedded HMI Controller

For small Human-Machine Interface controllers in industrial automation, the MCF52212CAE50 integrates USB-OTG (for HMI configuration upload), three UARTs (for PLC serial communication), SPI (for LCD display), and I2C (for capacitive touch). The 50 MHz core drives a 4.3-inch TFT LCD via SPI with reasonable frame rate, while simultaneously handling Modbus RTU communication with the PLC. 56 GPIO support matrix keypads and LED indicators directly. Industrial temperature and reliable Flash qualify for factory automation control panel applications.

💾

USB Field-Firmware Update Hub

Designers building USB-attached firmware programmers or in-system programming hubs use MCF52212CAE50 to host USB mass storage while controlling BDM/SPI/JTAG programming of target MCUs. The ColdFire V2's deterministic 50 MHz operation ensures stable BDM communication with target devices. Integrated USB-OTG supports both host role (USB stick with firmware images) and device role (programming tool from PC). The 64 KB Flash holds multiple firmware images and a FAT file system parser, while 8 KB SRAM suffices for buffer management.

What is the operating frequency of the MCF52212CAE50?
The MCF52212CAE50 runs the ColdFire V2 core at 50 MHz, delivering approximately 50 MIPS of deterministic execution throughput. According to the MCF5221x datasheet, this clock is sourced from an on-chip PLL fed by an external crystal or oscillator and must remain within 25 ppm tolerance to meet USB Full-Speed specifications. All peripheral clocks are derived from this master frequency through configurable prescalers.
How much Flash and RAM does MCF52212CAE50 have?
The MCF52212CAE50 integrates 64 KB (64K x 8) of on-chip Flash program memory and 8 KB (8K x 8) of SRAM. The Flash is accessed via the ColdFire Flash Module (CFM) supporting in-application programming and security lock bits. The 8 KB SRAM is sufficient for most USB-class stacks and protocol buffers but may require external SRAM expansion in heavy packet-processing designs.
Does MCF52212CAE50 include USB On-The-Go?
Yes, the MCF52212CAE50 includes a fully integrated USB On-The-Go (OTG) controller supporting both device and host roles. The OTG transceiver is integrated on-chip, requiring only external 15 kohm pull-down resistors on D+ and D- to the corresponding 5V-tolerant rail. This eliminates the need for an external USB PHY and reduces BOM by 2-3 ICs in typical designs.
What package is MCF52212CAE50 and how many I/O pins does it have?
The MCF52212CAE50 ships in a 64-pin LQFP (LFQFP, Low-profile Fine-pitch QFP) measuring 10 mm x 10 mm with 0.5 mm pitch. According to the datasheet, up to 56 pins are available as general-purpose I/O; the remainder are reserved for power, ground, JTAG, and analog reference. The package is surface-mount and supports standard reflow soldering profiles per IPC/JEDEC J-STD-020.
Is MCF52212CAE50 still in production or end of life?
According to the NXP product page, MCF52212CAE50 is classified as End of Life (EOL) and is listed in the NXP PCN/EOL notice. Last-time-buy opportunities may be available through NXP authorized distributors and from authorized aftermarket suppliers such as Rochester Electronics. Engineers designing new products should evaluate current NXP ColdFire+ Kinetis replacements or pin-compatible substitutes documented in the alternatives section.
What is the difference between MCF52212CAE50 and MCF52210CAE66?
The MCF52212CAE50 operates at 50 MHz with 64 KB Flash, while the MCF52210CAE66 operates at 66 MHz with 128 KB Flash. Both share the same ColdFire V2 architecture, integrated USB-OTG, and 64-LQFP package footprint (pin-compatible for many variants). Choose MCF52210CAE66 when you need higher throughput or larger code space; choose MCF52212CAE50 when its 50 MHz/64 KB envelope matches your bill of materials.
Where can I download the MCF52212CAE50 datasheet PDF?
The official MCF5221x datasheet is hosted on NXP.com at the MCF52210 documentation URL, which covers the entire MCF5221x family including MCF52212CAE50. According to the NXP product page, the datasheet, reference manual (ColdFire V2 family), and application notes are all available through the NXP document library. Registered users may also download errata documents and the ColdFire flash programmer support package.
Where to buy MCF52212CAE50 online?
As of 2026-10-20, MCF52212CAE50 is available from authorized distributors including Rochester Electronics (aftermarket specialist for EOL NXP silicon), DigiKey, Mouser, and LCSC Electronics at approximately $6.04-$9.85 USD per unit depending on quantity. Lead time varies from stock to 6-12 weeks given the EOL status; quotation is recommended for production volumes. Authorized distributors provide traceability certificates and original-component provenance.
What is the lead time for MCF52212CAE50?
Lead time for MCF52212CAE50 varies by distributor and order quantity. Authorized aftermarket suppliers such as Rochester Electronics typically hold inventory with same-day shipping for small quantities, while larger orders may require 8-12 weeks as parts are sourced from decommissioned NXP production batches. As of 2026-10-20, DigiKey and Mouser list the part with quoted lead time; verify with the distributor before placing volume orders.
How do I program the MCF52212CAE50 Flash memory?
Flash programming for MCF52212CAE50 is supported through the Background Debug Mode (BDM) interface using Freescale/NXP ColdFire flash programmer tools (e.g., P&E Multilink, CF Flasher). According to the MCF5221x reference manual, the ColdFire Flash Module (CFM) supports in-application programming via the ColdFire CPU plus a security mechanism preventing unauthorized code reads. The BDM interface is brought out on dedicated JTAG pins on the 64-LQFP package.
Is MCF52212CAE50 pin-compatible with MCF52235?
Yes, the MCF52212CAE50 and MCF52235 share the same 64-LQFP (10x10 mm) package footprint and largely pin-compatible peripheral pinouts, but with differences in peripheral mix and memory mapping. According to Freescale/NXP migration documentation, both are members of the MCF5221x/MCF5223x ColdFire V2 families. Designers migrating between them should validate peripheral and interrupt vector assignments in firmware rather than assuming drop-in compatibility at the register level.
What is the best drop-in replacement for MCF52212CAE50?
The best drop-in replacement for MCF52212CAE50 in the same 64-LQFP package is the MCF52210CAE66 within the same MCF5221x family, providing 66 MHz CPU clock and 128 KB Flash, or the MCF52211CAE50 at 50 MHz with 128 KB Flash. Both share the same 64-LQFP pinout and ColdFire V2 toolchain compatibility, allowing PCB reuse. For new designs, consider migrating to NXP Kinetis E series ARM Cortex-M microcontrollers which offer USB-OTG at lower power.
Can Kinetis microcontroller replace MCF52212CAE50?
NXP Kinetis microcontrollers such as the MK22FN1M0AVLK12 (ARM Cortex-M4 at 120 MHz) and S912XEQ512J2MAA can functionally replace MCF52212CAE50 in new designs, offering USB-OTG, comparable UART/SPI/I2C peripherals, and significantly higher performance. However, Kinetis devices are NOT pin-compatible drop-in replacements - they require PCB redesign, firmware rewrite (ColdFire V2 to ARM Cortex-M), and re-qualification of any USB-class stack. Kinetis migration is recommended only for new product designs.
What is the operating temperature range of MCF52212CAE50?
The MCF52212CAE50 industrial-temperature device operates from -40C to +85C ambient. According to the MCF5221x datasheet, this temperature range covers factory floor, outdoor enclosure, and consumer-grade embedded applications but does not extend to the full automotive -40C to +125C Grade-1 range. For automotive cabin applications, an AEC-Q100 qualified variant or Kinetis automotive-grade MCU is required.
What tools are compatible with MCF52212CAE50?
The MCF52212CAE50 is supported by Freescale/NXP CodeWarrior for ColdFire (legacy), GCC ColdFire toolchains, Eclipse-based MCU Eclipse plugins, and flash programming tools such as P&E Multilink and CF Flasher. The ColdFire V2 instruction set is compatible with all ColdFire V1/V2 firmware ports. As of 2026-10-20, the latest official NXP toolchain recommendation is the MCUXpresso IDE for newer Kinetis parts; legacy CodeWarrior remains available for ColdFire development.

Technische Referenzdaten für MCF52212CAE50 – Vergleich, Designhinweise und Compliance-Informationen.

Auswahlhilfe

Choose MCF52212CAE50 when designing a cost-sensitive USB-OTG embedded controller that needs the ColdFire V2 instruction set, 50 MHz performance, and 64 KB Flash within the 64-LQFP (10x10) footprint. Migrate to MCF52210CAE66 if you need 66 MHz CPU or 128 KB Flash while preserving pin compatibility. Migrate to MCF52211CAE50 if you need 128 KB Flash but not higher CPU speed. Consider MCF52236AF50 if your design needs FlexCAN for industrial networking. For new designs on a current NIC family, evaluate NXP Kinetis E series (e.g., MK22FN1M0AVLK12) for ARM Cortex-M4 performance and active NXP lifecycle, but be aware Kinetis requires full PCB and firmware redesign.

Vergleich mit Alternativen

Parameter Dieses Produkt MCF52210CAE66 MCF52211CAE50 MCF52100CAE80 MCF52236AF50 MCF52235
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package 64-LQFP (10x10 mm) 64-LQFP (10x10 mm) - same 64-LQFP (10x10 mm) - same 64-LQFP (10x10 mm) - same 64-LQFP (10x10 mm) - same 64-LQFP (10x10 mm) - same
Core ColdFire V2 ColdFire V2 ColdFire V2 ColdFire V1 ColdFire V2 ColdFire V2
USB-OTG Yes (integrated) Yes (integrated) Yes (integrated) Yes (integrated) Yes (integrated) Yes (integrated)

Wichtigste Unterscheidungsmerkmale

  • USB-OTG integrated on-chip (vs. MCF52100CAE80)
  • Industrial temperature -40C to +85C (vs. MCF52210CAE66)
  • Cost-optimized 64 KB Flash variant (vs. MCF52211CAE50)

Designhinweise

Place a 4.7 uF bulk decoupling capacitor plus a 0.1 uF ceramic capacitor on each VDD/VDDA pin pair, located within 5 mm of the MCU pin. The internal USB-OTG transceiver draws additional transient current during USB Full-Speed packet transmission, so a low-ESR bulk cap on VDDUSB is also recommended. Power-on reset behavior is governed by the internal POR circuit; ensure VDD rises monotonically with no extended dwell below 2.7V.

Route the USB DP/DM pair as a 90-ohm differential trace with 4 mm maximum length mismatch, and place a 15 kohm pull-down resistor on each line tied to ground for USB host-mode detection. The 12 MHz crystal reference (XTAL/EXTAL pins) must be within 25 ppm tolerance for USB Full-Speed compliance; route the crystal traces short and symmetric, with ground plane isolation from switching signals. Keep JTAG traces (TDI, TDO, TMS, TCK) away from USB and clock signals.

The ColdFire V2 BDM (Background Debug Mode) interface requires the BKPT pin to be pulled high during reset to enter BDM mode, or low for normal operation. Floating the BKPT pin can cause unpredictable debug-session connection failures. The TEST pin must be tied to VSS for normal operation; floating or tying to VDD puts the part in factory test mode, which can disrupt USB PHY behavior. Always validate crystal oscillator startup at minimum and maximum VDD across the -40C to +85C temperature range.

For designs using the SPI peripheral to drive an LCD controller, keep SPI clock traces shorter than 50 mm and add a 33-ohm series resistor near the MCF52212CAE50 SCK output to dampen reflections. The I2C lines require 4.7 kohm pull-ups to VDD per the I2C specification; do not use 10 kohm pull-ups when multiple slave devices are on the bus. For ADC sampling, add a 100 nF ceramic on VREFH pin, and ensure VSSA shares a clean ground plane separate from switching digital return currents.

Compliance-Informationen

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Qualified
Bleifrei
Unknown
Halogenfrei
Unknown
Konfliktmineralien
Unknown

RoHS/REACH/lead-free status not explicitly stated in the verified web data; refer to the NXP product page PCN/EOL notice for the most recent compliance documentation. The part is not AEC-Q100 qualified (industrial temperature only).

Daten verifiziert am: 2026-10-20 – Daten geprüft und kuratiert vom Bauteil-Engineering-Team von XAIPART

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Verwandte Bauteile & Begriffe

NXP Semiconductors Freescale Semiconductor MCF52212CAE50 MCF52210CAE66 MCF52211CAE50 MCF52100CAE80 MCF52236AF50 MCF52235 ColdFire V2 ColdFire V1 microcontroller MCU 32-bit RISC USB On-The-Go USB OTG 64-LQFP LQFP-64 LQFP UART SPI I2C Flash memory SRAM RoHS JTAG BDM Background Debug Mode industrial temperature grade embedded microcontroller Kinetis ARM Cortex-M
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