MCIMX6S4AVM08AB vs MCIMX6S5DVM10AB Vergleich
Detaillierter Direktvergleich von MCIMX6S4AVM08AB von NXP Semiconductors und MCIMX6S5DVM10AB von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | MCIMX6S4AVM08AB | MCIMX6S5DVM10AB |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | NRND | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $22,40 | $33,85 |
| Part Number | MCIMX6S4AVM08AB | — |
| Core Processor | ARM Cortex-A9 | — |
| Number of Cores | 1 | 1 |
| Bus Width | 32-bit | — |
| Speed | 800 MHz | — |
| Series | i.MX 6Solo | — |
| Gehäuse | 624-MAPBGA (21x21 mm, 0.8 mm pitch) | 624-MAPBGA 21x21 mm, 0.8 mm pitch |
| Versorgungsspannung | 1.8 V / 2.5 V / 2.8 V / 3.15 V | — |
| L1 Instruction Cache | 32 KB | — |
| L1 Data Cache | 32 KB | — |
| L2 Cache | 512 KB unified | 512 KB unified |
| GPU | GC880 3D + 2D (OpenGL ES 2.0, OpenVG 1.1) | Vivante GC880 (3D) + GC320 (2D) |
| Video Decoder (VPU) | H.264 BP / MPEG-4 / H.263 / MJPEG, up to 1080p30 | — |
| Memory Interface | 32-bit DDR3 / LPDDR2 | LPDDR2, DDR3, DDR3L (16/32-bit) |
| Display Interface | 24-bit parallel RGB LCD up to WXGA (1366x768) | — |
| Camera Interface | 2x MIPI-CSI | — |
| USB | 3x USB 2.0 (1x OTG with PHY) | — |
| PCIe | 1x PCIe 2.0 (x1 lane) | — |
| Ethernet | 10/100/1000 MAC | — |
| SD/MMC | 2x SD3.0 / MMC4.4 | — |
| Betriebstemperatur | -40C to +125C (automotive) | — |
| MSL-Level | 3 (168 hours) | — |
| RoHS-Status | Compliant | Compliant |
| Core Architecture | — | ARM Cortex-A9 (32-bit) |
| Maximum CPU Frequency | — | 1.0 GHz |
| L1 Cache (I + D per core) | — | 32 KB + 32 KB |
| NEON SIMD Engine | — | Yes |
| Hardware FPU | — | VFPv3 |
| Image Processing Unit (IPU) | — | IPUv3C, two units |
| Display Controller | — | Dual-display up to WXGA, EPDC for e-paper |
| Operating Temperature (TJ) | — | 0C to +95C (commercial) |
| Process Technology | — | 40 nm CMOS |
| Moisture Sensitivity Level | — | MSL3 |