MCIMX6S4AVM08AB - i.MX6 Solo 800MHz ARM Cortex-A9 MPU | NXP
Teilenummer: MCIMX6S4AVM08AB ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $36.31 | $36,31 |
| 10 | $32.45 | $324,50 |
| 100 | $28.92 | $2.892,00 |
| 500 | $25.78 | $12.890,00 |
| 1.000 | $22.4 | $22.400,00 |
MCIMX6S4AVM08AB Übersicht
An applications processor (AP) is a system-on-chip (SoC) class of microprocessor designed to run high-level operating systems (Linux, Android, Windows Embedded) and execute the bulk of user-facing workloads in an embedded system. Architecturally, an AP combines one or more CPU cores with on-chip SRAM/DRAM controllers, a graphics processing unit (GPU), hardware accelerators for media codecs, and a multi-standard fabric of peripheral interfaces. Within the broader semiconductor taxonomy, the i.MX6S belongs to the applications processor family, which sits above general-purpose microcontrollers (MCU) in integration and processing capacity, and below desktop CPUs in raw performance.
Key features of the MCIMX6S4AVM08AB include a single Cortex-A9 core at 800 MHz with 32 KB L1 instruction cache and 32 KB L1 data cache per core, plus a 512 KB unified L2 cache. The integrated GC880 GPU supports OpenGL ES 2.0 and OpenVG 1.1, while the VPU handles H.264 BP, MPEG-4, H.263, and MJPEG decoding up to 1080p30. Two MIPI-CSI camera ports, one 24-bit parallel RGB LCD interface up to WXGA (1366x768), and PCIe 2.0 (one x1 lane) make the silicon particularly suited to multimedia human-machine interface (HMI) designs.
Process technology is 40 nm low-power CMOS from NXP/Freescale, paired with multi-voltage domains (1.8 V/2.5 V/2.8 V/3.15 V) managed by the on-chip Smart Speed Technology (SST) power-management controller. The 624-pin MAPBGA 21x21 mm package exposes 32-bit DDR3/LPDDR2 memory controller, two SD3.0/MMC4.4 ports, three USB 2.0 controllers (one OTG with PHY), and a 10/100/1000 Ethernet MAC, with peripheral bandwidth exceeding 4 GB/s aggregate.
Typical applications include industrial human-machine interface (HMI) panels, point-of-sale terminals, portable medical imaging, smart-home gateways, single-board computers (SBC) and embedded Linux development kits, e-readers, and automotive infotainment entry-level head units. The device's combination of integrated GPU plus hardware video decode at 1080p30 makes it a practical choice for fanless, low-power multimedia designs.
Designers should plan a 6-layer PCB minimum for the DDR3 routing, allocate the 21x21 mm BGA fanout with 0.8 mm pitch, and follow NXP reference designs for PMIC sequencing (PFET family PF3000/PF3001 companion). For multimedia workloads, ensure the VPU clock is configured for the target frame rate; for Linux/Android BSP support, use NXP's i.MX 6 BSP and U-Boot bootloader validated on the i.MX 6Solo SABRE-SD platform.
This page synthesizes verified distributor pricing, datasheet extracts, and same-family NXP i.MX6 alternatives in a single place, complementing NXP's i.MX 6Solo reference manual with curated design notes and cross-reference links not found in a single manufacturer document.
Drop-in-Alternativen für MCIMX6S4AVM08AB – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MCIMX6S4AVM08AB (gleiche Bauform und Footprint) – abweichend in GPU, Memory Interface, Package.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MCIMX6S5EVM10AB
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MCIMX6S4AVM08AC
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MCIMX6S5DVM10AB
✅ Drop-In✓ Auf Lager
$33.85 / Stück
Datenblatt ansehen →MCIMX6S6AVM08ABR
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MCIMX6S7DVK10AB
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MCIMX6S4AVM08AB Grenzwerte & elektrische Eigenschaften
| Part Number | MCIMX6S4AVM08AB |
| Core Processor | ARM Cortex-A9 |
| Number of Cores | 1 |
| Bus Width | 32-bit |
| Speed | 800 MHz |
| Series | i.MX 6Solo |
| Gehäuse | 624-MAPBGA (21x21 mm, 0.8 mm pitch) |
| Versorgungsspannung | 1.8 V / 2.5 V / 2.8 V / 3.15 V |
| L1 Instruction Cache | 32 KB |
| L1 Data Cache | 32 KB |
| L2 Cache | 512 KB unified |
| GPU | GC880 3D + 2D (OpenGL ES 2.0, OpenVG 1.1) |
| Video Decoder (VPU) | H.264 BP / MPEG-4 / H.263 / MJPEG, up to 1080p30 |
| Memory Interface | 32-bit DDR3 / LPDDR2 |
| Display Interface | 24-bit parallel RGB LCD up to WXGA (1366x768) |
| Camera Interface | 2x MIPI-CSI |
| USB | 3x USB 2.0 (1x OTG with PHY) |
| PCIe | 1x PCIe 2.0 (x1 lane) |
| Ethernet | 10/100/1000 MAC |
| SD/MMC | 2x SD3.0 / MMC4.4 |
| Betriebstemperatur | -40C to +125C (automotive) |
| MSL-Level | 3 (168 hours) |
| RoHS-Status | Compliant |
MCIMX6S4AVM08AB 624-mapbga (21x21 mm, 0.8 mm pitch) Pinbelegungsleitfaden
Pinbelegung für MCIMX6S4AVM08AB (624-mapbga (21x21 mm, 0.8 mm pitch)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für MCIMX6S4AVM08AB.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
MCIMX6S4AVM08AB ist geeignet für 6 Anwendungs: Industrial Human-Machine Interface (HMI) Panels, Point-of-Sale (POS) Terminals, Portable Medical Imaging Devices, Smart-Home Gateways and Hubs, Single-Board Computers and Embedded Linux Dev Kits, Automotive Entry-Level Infotainment Head Units.
Industrial Human-Machine Interface (HMI) Panels
The MCIMX6S4AVM08AB's integrated GC880 GPU and 24-bit parallel RGB LCD controller up to WXGA (1366x768) resolution make it well-suited for industrial HMI panels running Qt/Embedded or Linux with WebKit-based UIs. The 800 MHz Cortex-A9 delivers sufficient headroom for responsive touch UI rendering, while the hardware VPU handles instructional video playback without burdening the CPU. NXP's validated Linux BSP and long-term kernel support (LTS through 2026+) reduce software risk. Compared to a discrete MCU + external GPU approach, the 6Solo integrates display, touch, and connectivity in a single 624-MAPBGA, simplifying 6-layer PCB stack design. Typical HMI panels are rated -20C to +70C, well inside the AB suffix's -40C to +125C automotive envelope.
Empfohlen
Point-of-Sale (POS) Terminals
The MCIMX6S4AVM08AB fits retail POS terminals because it integrates the LCD controller, touch I/F, secure element SPI interface, Ethernet MAC for back-office sync, and a 1080p30 VPU for digital signage playback on the customer-facing display. The single Cortex-A9 at 800 MHz runs Linux/Java POS stacks comfortably while the GC880 GPU accelerates barcode/QR overlay rendering. NXP's hardware crypto accelerator (CAAM) supports PCI-PTS point-of-transaction security requirements. Drop-in replacement to the 1 GHz MCIMX6S5EVM10AB enables the same PCB to span entry and mid-tier SKUs, with thermal headroom for fanless enclosures at moderate ambient temperatures.
Empfohlen
Portable Medical Imaging Devices
The MCIMX6S4AVM08AB serves portable ultrasound and patient-monitoring displays where MIPI-CSI camera interfaces handle image-sensor input and the WXGA LCD controller drives diagnostic preview screens. Hardware VPU decoding at 1080p30 enables smooth playback of recorded procedures for clinician review. NXP's long-term kernel support and verified Linux BSP ease FDA 510(k) software documentation. The 624-MAPBGA 21x21 mm with 0.8 mm pitch allows compact handheld enclosures. Compared to lower-end MCUs, the 6Solo's gigabit Ethernet MAC supports DICOM transfer rates without an external PHY SoC, reducing BOM and PCB area.
Empfohlen
Smart-Home Gateways and Hubs
Smart-home gateways aggregate Zigbee, Z-Wave, BLE, and Wi-Fi radios - the MCIMX6S4AVM08AB serves as the Linux host processor running OpenWrt or a custom hub stack. Its gigabit Ethernet MAC uplinks to the home router, USB 2.0 ports connect to sub-GHz radio dongles, and the PCIe 2.0 x1 lane accepts a Wi-Fi 5/6 M.2 card. At 800 MHz, the 6Solo runs Node.js/MQTT brokers and cloud-agent software without throttling. The hardware crypto accelerator (CAAM) accelerates TLS handshakes for secure cloud connectivity. Compared to a Raspberry Pi-class SBC, an i.MX 6Solo design offers industrial temperature grade and 10-year lifecycle support preferred by installers.
Empfohlen
Single-Board Computers and Embedded Linux Dev Kits
The MCIMX6S4AVM08AB forms the heart of NXP's i.MX 6Solo SABRE-SD reference platform, a community-favored SBC for Linux/Android development. Hobbyists and engineers use it to prototype Linux distributions, run machine-learning inference at the edge via NXP's eIQ toolkit, and validate multimedia HMI concepts before committing to ASIC. With U-Boot, Yocto/OpenEmbedded, and Debian mainline support, the 6Solo is a stepping stone to production i.MX 8 designs. Its 624-MAPBGA is challenging to hand-solder, so QFP-style carrier boards or module form factors (SoM) are recommended for prototyping. The 800 MHz clock is generous for headless server workloads and modest GUI rendering.
Empfohlen
Automotive Entry-Level Infotainment Head Units
The MCIMX6S4AVM08AB's 'AB' suffix denotes the automotive -40C to +125C temperature grade, qualifying it for entry-level infotainment head units, instrument clusters, and HVAC control modules. The integrated VPU decodes H.264/MPEG-4 streams from rear-seat entertainment sources; the GC880 GPU renders navigation maps; dual MIPI-CSI interfaces accept surround-view camera inputs. NXP's automotive-grade BSP includes AUTOSAR MCAL layers for OEM integration. Compared to the consumer-grade MCIMX6S4AVM08AC, the AB version survives under-dash thermal stress and complies with AEC-Q100 reliability expectations for non-safety-critical automotive ECUs.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MCIMX6S4AVM08AB – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MCIMX6S5EVM10AB | MCIMX6S4AVM08AC | MCIMX6S5DVM10AB | MCIMX6S6AVM08ABR | MCIMX6S7DVK10AB |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 624-MAPBGA (21x21) | 624-MAPBGA (21x21) - same | 624-MAPBGA (21x21) - same | 624-MAPBGA (21x21) - same | 624-MAPBGA (21x21) - same | 624-MAPBGA (21x21) - same |
| CPU Speed | 800 MHz | 1000 MHz | 800 MHz (same) | 1000 MHz | 800 MHz | 1000 MHz |
| Number of Cores | 1 (Solo) | 1 (Solo) | 1 (Solo) | 1 (Solo) | 1 (Solo) | 1 (Solo) |
| Temperature Grade | Automotive -40C to +125C | Automotive -40C to +125C | Consumer 0C to +95C | Automotive -40C to +125C | Automotive -40C to +125C | Automotive -40C to +125C |
| Silicon Revision | i.MX 6Solo rev 1.1 | i.MX 6Solo rev 1.1 | i.MX 6Solo rev 1.1 | i.MX 6Solo rev 1.2 (CAAM) | i.MX 6Solo rev 1.1 | i.MX 6Solo rev 1.2 |
| Lifecycle Status | NRND | NRND | NRND | Active | Active | Active |
| Packaging Form | Tray | Tray | Tray | Tray | Tape & Reel | Tray |
Wichtigste Unterscheidungsmerkmale
- Integrated GC880 GPU with hardware VPU at 624-MAPBGA price point (vs. i.MX 6ULL)
- Gigabit Ethernet MAC on-chip (vs. i.MX 7Dual)
- Dual MIPI-CSI camera interfaces (vs. MCIMX6S4AVM08AC (consumer grade))
Designhinweise
The 624-MAPBGA 21x21 mm package with 0.8 mm pitch requires a minimum 6-layer PCB stack-up to fan out the BGA and route the 32-bit DDR3 memory interface. Use the NXP SABRE-SD reference design as the baseline for layer stack and via geometry. Place DDR3 chips on the back side directly behind the i.MX 6S BGA to minimize trace lengths, and use length-matched routing within 25 mil tolerance for DDR3 signals. Decoupling: place 100 nF X7R ceramic capacitors within 1 mm of every VDD pin and bulk 22 uF tantalum on the regulator outputs.
The MCIMX6S4AVM08AB requires multi-rail sequencing managed by the PF3000 or PF3001 companion PMIC. Power-up order is typically VDD_SOC_IN -> VDD_ARM_IN -> VDD_SOC -> VDDPU -> VDDHIGH. Power-down is reverse. Estimated: at 800 MHz with GC880 active, core power is approximately 1.2 W typical and 1.8 W peak; with VPU decoding 1080p30 H.264, add approximately 0.4 W. The 'AB' suffix's -40C to +125C junction rating means derating should target TJ_max <= 110C for 10-year reliability in automotive deployments.
At 800 MHz full CPU + GPU + VPU load, the 624-MAPBGA junction-to-ambient thermal resistance (theta_JA) on a 6-layer JEDEC board is approximately 18 C/W. With 2.5 W dissipation, junction rises 45C above ambient. For enclosed industrial HMI enclosures at 50C ambient, supply a thermal pad or copper heat-spreader lid to keep Tj below 105C. Estimate: required theta_JA for Tj <= 110C at 2.5 W and 70C ambient is (110-70)/2.5 = 16 C/W, achievable with 4-layer board + thermal vias under the package center pad.
Route the two MIPI-CSI lanes as 100 ohm differential pairs with intra-pair skew under 5 ps and maximum length 15 cm. Keep MIPI lanes away from switching power inductors and PWM traces; surround with continuous ground pour. The 24-bit parallel RGB LCD bus should be length-matched within +/- 200 mil across all data lines and clock pair to meet the WXGA timing budget. The PCIe x1 lane requires AC-coupling capacitors and 85 ohm differential impedance - follow NXP's PCIe routing guidelines in the Hardware Reference Manual.
Do not assume the AB and AC temperature-grade suffixes are interchangeable - the AB suffix is qualified for -40C to +125C automotive, while AC is consumer 0C to +95C. Dropping an AB onto a consumer design wastes cost; substituting an AC into an automotive design violates reliability specs. Also note that i.MX 6Solo, 6DualLite, and 6DualPlus share the same 624-MAPBGA 21x21 mm footprint but differ in ballout - verify ball assignments against the specific datasheet before PCB reuse. The NRND status means NXP is no longer recommending this part for new designs; for greenfield work, evaluate i.MX 6ULL (lower cost) or i.MX 8M (modern software support).
Compliance-Informationen
AB suffix denotes automotive -40C to +125C temperature grade and AEC-Q100 reliability qualification. RoHS and REACH compliance confirmed by NXP product page and Rochester Electronics listing (REACH Unaffected, HTSUS 8542.31.0001). Halogen-free status not stated in verified web data.
