MK64FN1M0VLL12 vs MK24FN1M0VLL12R Vergleich

Detaillierter Direktvergleich von MK64FN1M0VLL12 von NXP Semiconductors und MK24FN1M0VLL12R von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
MK64FN1M0VLL12 MK64FN1M0VLL12 - K64 120MHz Cortex-M4F MCU 1MB Flash | NXP

MK64FN1M0VLL12 - K64 120MHz Cortex-M4F MCU 1MB Flash | NXP

MK64FN1M0VLL12 ✓ Aktiv
NXP Semiconductors
MK24FN1M0VLL12R MK24FN1M0VLL12R - 120MHz Cortex-M4 K24 MCU, 1MB Flash, USB | NXP

MK24FN1M0VLL12R - 120MHz Cortex-M4 K24 MCU, 1MB Flash, USB | NXP

MK24FN1M0VLL12R ✓ Aktiv

Spezifikationsvergleich

Parameter MK64FN1M0VLL12 MK24FN1M0VLL12R
Marke NXP Semiconductors NXP Semiconductors
Kategorie Microcontrollers Microcontrollers
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $7,95 $10,80
Manufacturer NXP Semiconductors —
Series Kinetis K64 —
Core Processor ARM Cortex-M4F (with FPU and DSP) —
Core Size 32-bit —
Maximum CPU Frequency 120 MHz 120 MHz
Program Memory Size 1 MB (1M x 8) Flash —
RAM Size 256 KB SRAM —
Flash Memory Type FTFE - Non-Flex (4 KB sector, 8-byte phrase) —
Supply Voltage (VDD) 1.71 V to 3.6 V (1.8 V / 2.5 V / 3.3 V rails) —
Betriebstemperaturbereich -40 C to +105 C (industrial) —
Gehäuse / Bauform 100-LQFP, 14x14 mm, 0.5 mm pitch —
Montageart Surface Mount Surface Mount
USB USB 2.0 Full-Speed OTG, on-chip FS transceiver USB 2.0 Full-Speed OTG with on-chip transceiver
Ethernet 10/100 Mbps MAC, MII / RMII interface —
Hardware Cryptography AES-128/256, DES/3DES, SHA-1/256, RSA, TRNG —
ADC 16-bit SAR, up to 2x 16-ch (peripherals vary by die) 16-bit SAR ADC
DAC 12-bit 12-bit DAC
GPIO [DATA_NEEDED: GPIO count for this LQFP-100 mask] —
Low-Power Modes Run / Wait / Stop / VLPR / VLPS / LLS / VLLS0/1/3 with RTC retention —
RoHS-Status Compliant —
MSL-Level 3 (per JEDEC J-STD-020) 3 (168 hours)
Core — ARM Cortex-M4F with FPU, MPU, DSP extensions
Program Flash — 1 MB (1M x 8)
SRAM — 256 KB
CAN — 2 x CAN 2.0B
SPI — 3 modules
I2C — 3 modules
UART — 4 modules
Versorgungsspannung — 1.71 V to 3.6 V
Betriebstemperatur — -40C to +105C
Gehäuse — 100-LQFP (14 x 14 mm)
Run Current — 250 uA/MHz (typical)
Stop Current — <340 nA (typical)
Wake-up Time — 4.5 us from Stop mode

Datenblätter & Ressourcen

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