MPC5554MVR132 vs SPC5553MVR132 Vergleich

Detaillierter Direktvergleich von MPC5554MVR132 von NXP Semiconductors und SPC5553MVR132 von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
MPC5554MVR132 MPC5554MVR132 - 32-bit Qorivva MCU, 132MHz, 2MB Flash | NXP

MPC5554MVR132 - 32-bit Qorivva MCU, 132MHz, 2MB Flash | NXP

MPC5554MVR132 Nrnd
NXP Semiconductors
SPC5553MVR132 SPC5553MVR132 - 32-bit PowerPC MCU, 132MHz, 1.5MB Flash | NXP

SPC5553MVR132 - 32-bit PowerPC MCU, 132MHz, 1.5MB Flash | NXP

SPC5553MVR132 ✓ Aktiv

Spezifikationsvergleich

Parameter MPC5554MVR132 SPC5553MVR132
Marke NXP Semiconductors NXP Semiconductors
Kategorie Microcontrollers Microcontrollers
Lebenszyklusstatus NRND Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $27,25 $61,25
Core Architecture Power Architecture e200z6 —
CPU Core 32-bit, single-core —
Maximum Operating Frequency 132 MHz —
Flash Memory Size 2 MB (2M x 8) —
SRAM Size 64 KB —
Instruction Cache / Data Cache 64 KB unified —
Gehäuse 416-ball TE-PBGA (27 x 27 mm, 1 mm pitch) —
Montageart Surface Mount Surface Mount
Supply Voltage (Core) [DATA_NEEDED: core voltage range] —
Supply Voltage (I/O) 3.3 V (typical) —
Betriebstemperaturbereich -40 C to +125 C (junction) —
CAN Controllers 2 x FlexCAN 2.0B, 64 message buffers each —
ADC Channels Up to 40 channels, 12-bit SAR —
eTPU Channels 64 channels (Enhanced Time Processing Unit) —
DSPI Modules 3 x DSPI (Deserial/Serial Peripheral Interface) —
External Bus Interface 16-bit / 32-bit bus, supports SDRAM, SRAM, Flash up to 16 MB —
MMU / FPU MMU present; FPU (single-precision) per e200z6 core —
RoHS-Status Compliant —
MSL-Level 3 (per JEDEC J-STD-020) —
Manufacturer — NXP Semiconductors (formerly Freescale)
Series — MPC55xx Qorivva
Core — e200z6 Power Architecture, 32-bit, single-issue
CPU Frequency — 132 MHz
Program Memory (Flash) — 1.5 MB (1.5M x 8)
RAM Size — 64 KB (64K x 8)
Number of I/O — 220
Gehäuse / Bauform — 416-BBGA (27 mm x 27 mm)
Oscillator Type — External
Versorgungsspannung — 1.8 V / 2.5 V / 3.3 V / 5 V (mixed I/O)
Betriebstemperatur — -40 C to +125 C (automotive grade)
Packaging — Tray
Connectivity — 2x CAN 2.0B, 2x FlexRay, SPI, SCI, I2C
Peripherals — eTPU, eDMA, 12-bit SAR ADC, EBI

Datenblätter & Ressourcen

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