MPC562MZP56 vs MPC566MZP56 Vergleich
Detaillierter Direktvergleich von MPC562MZP56 von NXP Semiconductors und MPC566MZP56 von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MPC562MZP56 - PowerPC 32-Bit 56MHz MCU, ROMless | NXP
MPC562MZP56 ⚠ Letzte BestellmöglichkeitNXP Semiconductors
MPC566MZP56 - 32-Bit PowerPC MCU 1MB Flash 56MHz | NXP
MPC566MZP56 ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | MPC562MZP56 | MPC566MZP56 |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Letzte Kaufgelegenheit | Letzte Kaufgelegenheit |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $35,40 | $24,50 |
| Core Architecture | PowerPC MPC5xx | PowerPC MPC5xx (Power Architecture) |
| Datenbusbreite | 32 bit | 32-bit |
| Maximale Taktfrequenz | 56 MHz | — |
| Program Memory Type | ROMless (external memory required) | — |
| RAM Size | 32 Kbyte (32K x 8) | 36 KB |
| Number of I/O Lines | 64 | — |
| ADC Channels | 32 | — |
| Oscillator Type | External | External |
| Gehäuse | 388-PBGA (27 x 27 mm) | — |
| Montageart | Surface Mount | Surface Mount (BGA) |
| Versorgungsspannung | [DATA_NEEDED: supply voltage] | 2.6 V / 5 V |
| Betriebstemperatur | [DATA_NEEDED: operating temperature] | -40C to +125C (automotive grade) |
| Code Compression | Yes (reduces program memory by up to 50%) | Burst Code Compression (BCC) - approx. 40% performance gain over MPC565 |
| Intermodule Bus (IMB) | Yes (common peripheral backbone) | — |
| RoHS-Status | [DATA_NEEDED: RoHS status] | — |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| MSL-Level | [DATA_NEEDED: MSL level] | — |
| Communication Peripherals | CAN, serial interfaces [DATA_NEEDED: full list] | — |
| Core Frequency | — | 56 MHz |
| Program Memory Size | — | 1 MB (1M x 8) Flash |
| Number of I/O | — | 56 |
| Gehäuse / Bauform | — | 388-PBGA (27x27 mm) |
| Floating Point Unit | — | Dual precision FPU |
| Packaging | — | Tray |
| Automotive Qualification | — | AEC-Q100 |