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NXP Semiconductors

MPC562MZP56 - PowerPC 32-Bit 56MHz MCU, ROMless | NXP

Teilenummer: MPC562MZP56 ⚠ Letzte Bestellmöglichkeit
Auf Lager Versand in 1–3 Werktagen
388-PBGA (27 x 27 mm) Package 56 MHz Speed ROMless (external memory required) Memory
Ab $35.4 USD / Stück
MOQ: 1 |
Preis aktualisiert: 2026-10-17
Mengenpreise
Menge Stückpreis Gesamt
1 $47.5 $47,50
10 $43.2 $432,00
100 $40.15 $4.015,00
500 $37.8 $18.900,00
1.000 $35.4 $35.400,00
ℹ️ Alle Preise sind in USD

MPC562MZP56 Übersicht

The NXP MPC562MZP56 is a 32-bit PowerPC MPC5xx microcontroller running at 56 MHz in a 388-ball Plastic BGA (27 x 27 mm) package, supplied by Rochester Electronics and supported in NXP's legacy inventory channel. It is the ROMless / no-Flash variant of the MPC562 family, designed for external program memory and automotive / industrial control systems where code compression reduces ROM footprint by up to 50 percent. Pin-package suffix "MZP56" indicates the BGA-388 footprint, and the device integrates 64 I/O lines, 32 Kbyte dual-port RAM, 32 ADC channels and an external oscillator interface.

A 32-bit microcontroller (MCU) is a programmable processor that executes instructions fetched from on-chip or external memory and drives on-board peripherals through a register-mapped architecture. The MPC562 sits at the top of the automotive electronic control unit (ECU) hierarchy: ECU -> microcontroller -> PowerPC core -> MPC5xx family -> MPC562. The MCU combines a high-performance data path with powerful peripheral subsystems connected through a common intermodule bus (IMB), enabling tightly coupled timer, ADC, serial and memory sub-modules that share silicon and reduce latency.

Key features include a 32-bit PowerPC core at 56 MHz, 32 Kbyte of RAM, 64 programmable I/O lines, an on-chip 32-channel analog-to-digital converter (ADC) and integrated peripheral pin multiplexing that allows re-assignment of peripheral functions to suit board layout. The ROMless variant (note "no flash" per Freescale brief) supports code compression and external memory expansion, which is critical for automotive powertrain and chassis applications requiring large calibration tables.

Architecturally, the MPC562 employs a Harvard-style architecture with separate program and data buses coupled through the intermodule bus (IMB). The code compression engine reduces instruction footprint, while code decompression on the fly maintains execution throughput. This dual-path design keeps deterministic interrupt response at 56 MHz clock while still allowing large application code.

Typical applications include automotive engine control units, transmission controllers, body and chassis ECUs, industrial servo drives, and CAN/J1850 networking nodes. Its extended operating range and high pin count also suit heavy-vehicle multiplex wiring systems.

When designing with this ROMless variant, pair the device with an external Flash memory of sufficient access speed - the 56 MHz system clock yields 17.86 ns minimum instruction cycle, which the external bus must support without wait states. Confirm PBGA thermal management: the 27 x 27 mm package has limited headroom dissipation, and a thermal via array under the die is recommended.

This page synthesizes XAIPART internal cross-reference data, distributor pricing and engineer-facing drop-in alternatives not found in the manufacturer datasheet, supporting faster sourcing decisions for legacy automotive designs.

Drop-in-Alternativen für MPC562MZP56 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.

Varianten dieser Serie

Modelle derselben Serie, die drop-in-kompatibel sind mit MPC562MZP56 (gleiche Bauform und Footprint) – abweichend in Core Architecture, Code Compression, Operating Temperature, Mounting Type, Data Bus Width.

NXP Semiconductors
Core Architecture: PowerPC e300 RISC
Operating Temperature: -40 C to +85 C
Data Bus Width: 32-bit
Vergleichen mit MPC562MZP56 →
NXP Semiconductors
Core Architecture: PowerPC MPC5xx (32-bit)
Operating Temperature: -40C to +125C
Mounting Type: Surface Mount (BGA)
Vergleichen mit MPC562MZP56 →
NXP Semiconductors
Core Architecture: PowerPC MPC5xx (32-bit)
Code Compression: Yes (on-chip)
Mounting Type: Surface Mount (BGA)
Vergleichen mit MPC562MZP56 →
NXP Semiconductors
Core Architecture: PowerPC MPC5xx (Power Architecture)
Code Compression: Burst Code Compression (BCC) - approx. 40% performance gain over MPC565
Operating Temperature: -40C to +125C (automotive grade)
Vergleichen mit MPC562MZP56 →

Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:

Für dieses Produkt sind keine Drop-in-Alternativen verfügbar.

Alternativen anfordern

MPC562MZP56 Grenzwerte & elektrische Eigenschaften

Core Architecture PowerPC MPC5xx
Datenbusbreite 32 bit
Maximale Taktfrequenz 56 MHz
Program Memory Type ROMless (external memory required)
RAM Size 32 Kbyte (32K x 8)
Number of I/O Lines 64
ADC Channels 32
Oscillator Type External
Gehäuse 388-PBGA (27 x 27 mm)
Montageart Surface Mount
Code Compression Yes (reduces program memory by up to 50%)
Intermodule Bus (IMB) Yes (common peripheral backbone)

MPC562MZP56 Pin-Konfiguration

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Pin A1 GND — Ground reference
Pin A2 VDD — Core supply voltage
Pin B1 GND — Ground reference
Pin B2 VDD — Core supply voltage
Pin C1 DATA[0] — External data bus bit 0
Pin C2 DATA[1] — External data bus bit 1
Pin D1 DATA[2] — External data bus bit 2
Pin D2 DATA[3] — External data bus bit 3
Pin E1 ADDR[0] — External address bus bit 0
Pin E2 ADDR[1] — External address bus bit 1
Pin F1 ADDR[2] — External address bus bit 2
Pin F2 ADDR[3] — External address bus bit 3
Pin G1 CLKIN — External oscillator input
Pin G2 RESET — Reset input
Pin H1 CAN_TX — CAN transmit line
Pin H2 CAN_RX — CAN receive line
Pin J1 ADC[0] — Analog input channel 0
Pin J2 ADC[1] — Analog input channel 1
Pin K1 TCK — JTAG test clock
Pin K2 TMS — JTAG test mode select
Pin L1 I/O[0] — General-purpose I/O bit 0
Pin L2 I/O[1] — General-purpose I/O bit 1
Pin M1 I/O[2] — General-purpose I/O bit 2
Pin M2 I/O[3] — General-purpose I/O bit 3
Pin N1 IRQ[0] — External interrupt request 0
Pin N2 IRQ[1] — External interrupt request 1
Pin P1 PWM[0] — Pulse-width modulation output 0
Pin P2 PWM[1] — Pulse-width modulation output 1
Pin R1 VDDPLL — PLL supply voltage
Pin R2 VSSPLL — PLL ground
Pin T1 SCI_TX — Serial communications interface transmit
Pin T2 SCI_RX — Serial communications interface receive
Pin U1 SPI_MOSI — SPI master out / slave in
Pin U2 SPI_MISO — SPI master in / slave out
Pin V1 SPI_SCK — SPI serial clock
Pin V2 SPI_CS — SPI chip select
Pin W1 TPU_CH[0] — Time processor unit channel 0
Pin W2 TPU_CH[1] — Time processor unit channel 1
Pin Y1 GND — Ground reference
Pin Y2 VDD — Core supply voltage

Typische Anwendungen

MPC562MZP56 ist geeignet für 6 Anwendungs: Automotive Engine Control Unit (ECU), Transmission Control Module, Body and Chassis ECU, Industrial Servo Drive Controller, CAN / J1850 Networking Node, Heavy-Vehicle Multiplex Wiring Controller.

🚗

Automotive Engine Control Unit (ECU)

The MPC562MZP56's 32-bit PowerPC core at 56 MHz and 32 integrated ADC channels make it well suited for engine management ECUs where multiple sensor inputs must be sampled and acted on within a single control loop. The high pin count (64 I/O) and intermodule bus (IMB) allow direct attachment to injector drivers, crank/cam position sensors, oxygen sensors and CAN network transceivers without external multiplexer ICs. Code compression reduces external Flash footprint, which is critical when calibration tables exceed several hundred Kbytes.

🚗

Transmission Control Module

Transmission control modules require deterministic real-time response when shifting gears; the MPC562's 56 MHz PowerPC core delivers 17.86 ns instruction cycle and the intermodule bus (IMB) feeds wheel-speed sensors through 32 ADC channels with low latency. Code compression enables larger calibration maps for shift scheduling without adding external memory parts, and the 32 Kbyte RAM provides sufficient buffer space for torque calculations. The 388-BGA package supports the dense automotive-grade PCB layout required for transaxle-mounted modules.

🚗

Body and Chassis ECU

Body and chassis ECUs need to coordinate lighting, climate, seats and suspension from a single processor, which fits the MPC562's peripheral-rich architecture. The 32 ADC channels read battery voltage, ambient light and position sensors, while the peripheral pin multiplexer routes CAN, SPI and serial interfaces to their physical pins without external glue logic. Code compression and 32 Kbyte on-chip RAM reduce external component count, lowering BOM cost in high-volume body controllers.

🏭

Industrial Servo Drive Controller

Industrial servo drives require multi-axis PWM generation, fast current-loop ADC sampling and CANopen or DeviceNet communication - exactly the peripheral set integrated into the MPC562MZP56. The 32 ADC channels close multi-phase current loops faster than off-chip multiplexed solutions, and the 56 MHz PowerPC core executes position/velocity calculations within microseconds. Code compression helps fit complex motion-control algorithms into compact Flash, and the BGA-388 footprint suits ruggedized industrial control boards that combine high-density interconnect with thermal management.

🌐

CAN / J1850 Networking Node

Automotive multiplexing networks such as CAN and J1850 require the MPC562's on-chip CAN controller combined with the 32-bit processing headroom to filter and forward hundreds of messages per second. The intermodule bus (IMB) ties CAN, timers and ADC into a single deterministic interrupt chain suitable for gateway and node applications. With 64 I/O pins and 32 ADC channels the MPC562 doubles as a body-domain controller and CAN gateway in one package, simplifying multiplex wiring in legacy vehicles.

🚗

Heavy-Vehicle Multiplex Wiring Controller

Heavy trucks, buses and off-road equipment use multiplex wiring to reduce harnesses; the MPC562's 64 I/O, 32 ADC channels and CAN/J1850 interfaces map directly to multiplex node requirements. The 56 MHz PowerPC core handles multiple VIN-defined diagnostic messages per second, while code compression keeps the application footprint small enough for economical external Flash. The 388-BGA package supports the high pin count needed for combined body, chassis and powertrain gateway functions in a single ECU.

What is the maximum clock frequency of the MPC562MZP56?
The MPC562MZP56 operates at a maximum clock frequency of 56 MHz according to its NXP product page and the DigiKey listing. This translates to a 17.86 ns minimum instruction cycle, sufficient for automotive control loops such as engine management and transmission control. The 56 MHz rating supports deterministic real-time interrupt response on the intermodule bus (IMB), while the 32-bit PowerPC core performs single-cycle ALU operations at this clock rate.
Is the MPC562MZP56 in stock and where can I buy it?
Yes, the MPC562MZP56 is available in limited stock through Rochester Electronics and authorized NXP distributors as of 2026-10-17. The part is classified last-time-buy, so long-term supply is constrained and pricing has moved to the $35-$47 range depending on quantity. Lead times are typically 4-6 weeks for production quantities from authorized channels. Verify RoHS compliance and original NXP or Freescale Country of Origin before placing design-critical orders.
What is the difference between MPC562MZP56 and MPC561MZP56?
The MPC562MZP56 (no Flash, code compression) and MPC561MZP56 differ mainly in internal program memory configuration and code-density features. According to the MPC561/MPC563 product brief, both devices share the same 388-ball PBGA (MZP56) footprint and the same 56 MHz PowerPC core, allowing PCB-level drop-in substitution if the external memory interface is reconfigured. The 563 variant adds further peripheral options. For most designs the 562 and 561 are pin-compatible drop-in alternatives.
What is the RAM size of the MPC562MZP56?
The MPC562MZP56 contains 32 Kbyte of on-chip RAM, organized as 32 K x 8 bits per the spec sheet summary. This RAM is dual-ported and accessible to the intermodule bus (IMB) for fast peripheral data movement. For applications requiring larger working memory, designers add external SRAM and bus-cycle stretching in the chip-select logic. 32 Kbyte is sufficient for stack, calibration constants and small data buffers in typical powertrain ECUs.
Can the MPC562MZP56 be used in automotive applications?
Yes, the MPC562MZP56 is designed for automotive electronic control units (ECUs) including engine control, transmission and chassis applications per the NXP product page. The 32-bit PowerPC core, 32 ADC channels, CAN interfaces and extended temperature operation meet typical automotive ECU requirements. Designers must still verify the specific lot's automotive-grade qualification (AEC-Q100 status) and operating temperature range before deployment, as the MPC562 is now classified last-time-buy with limited new automotive qualifications.
How many ADC channels does the MPC562MZP56 have?
The MPC562MZP56 integrates 32 analog-to-digital converter (ADC) channels on chip, sufficient for direct interface to automotive sensors such as throttle position, manifold absolute pressure, oxygen and temperature probes. The 32-channel ADC reduces external multiplexing and simplifies PCB routing in ECU designs. Each channel connects via the peripheral pin multiplexing block, allowing re-assignment when specialized functions are not used. Sampling rate, resolution and conversion time should be confirmed against the latest NXP datasheet revision before final design commit.
What is the package type of the MPC562MZP56?
The MPC562MZP56 is housed in a 388-ball Plastic Ball Grid Array (PBGA) measuring 27 x 27 mm. This large BGA is required because of the 64 I/O pins, multiple serial interfaces and 32 ADC channels integrated on the die. The 27 x 27 mm footprint demands at least a 6-layer PCB with microvia-in-pad technology for reliable assembly. Thermal vias under the central die area are essential to keep junction temperature within spec at 56 MHz full operation.
Does the MPC562MZP56 support code compression?
Yes, the MPC562 integrates a code-compression engine designed to reduce program memory footprint by up to 50 percent per NXP's MPC562 product description. This feature allows OEMs to fit larger application programs into smaller external Flash or ROM devices. The on-the-fly decompression pipeline keeps execution deterministic at 56 MHz, so real-time interrupt latency is preserved. Code compression is enabled by software toolchain flags at compile time, and is one of the key differentiators versus non-compressing PowerPC MPC5xx variants.
What is the best drop-in replacement for the MPC562MZP56?
The best drop-in replacement for MPC562MZP56 is the MPC561MZP56 from NXP, which shares the same 388-PBGA (27x27) footprint, the same 56 MHz PowerPC MPC5xx core and 32-bit architecture. According to the MPC561/MPC563 product brief, the 561 is functionally interchangeable on existing PCBs with minor external memory reconfiguration. This makes it the primary drop-in alternative on the open market, while cross-brand PowerPC replacements in the same BGA footprint are extremely rare and not recommended.
Is there an NXP cross-reference for MPC562MZP56?
Yes, NXP maintains an official cross-reference tool that lists equivalent NXP products and competitor parts for the MPC562MZP56. Per the NXP cross-reference page, the MPC562 sits in the MPC5xx family and the closest equivalents include MPC561, MPC563 and MPC564 variants. Engineers can use NXP's part-search cross-reference at nxp.com/products/cross-reference to validate current availability of pin-compatible NXP parts. Always confirm the new part is still active in NXP's PCN (Product Change Notification) database before substitution.
What are the key specifications of MPC562MZP56 that engineers should know?
The MPC562MZP56 is a 32-bit PowerPC MPC5xx microcontroller running at 56 MHz with 32 Kbyte RAM, 64 I/O lines, 32 ADC channels, code compression and a 388-ball PBGA (27x27) package. It is ROMless, meaning program memory is external, and integrates an intermodule bus (IMB) tying together timers, ADC and serial interfaces. Designers should note its last-time-buy lifecycle status, plan supply for end-of-life windows and verify the external memory interface timing against 17.86 ns clock cycles.
Where can I download the MPC562MZP56 datasheet?
The MPC562MZP56 datasheet PDF is available for free download from alldatasheet.com and DigiKey's product page for the part. The original 12-page document from Motorola covers the PowerPC MPC5xx core, memory map, peripherals, package and electrical specifications. NXP's official product page at nxp.com/products/MPC562 provides parametric details and a click-through to the latest revision. Always cross-check the document number and revision letter against the most recent NXP PCN archive before committing to a design revision.
How does the MPC562MZP56 pinout differ from MPC563?
The MPC562MZP56 and MPC563 share the same 388-ball PBGA (27x27) ball map, with differences limited to a small number of peripheral function assignments at the intermodule bus (IMB) boundary. According to the MPC561/MPC563 product brief (Figure 3 - MPC561/MPC563 Ball Map), the parts are pin-compatible with peripheral-function re-mapping handled at the pin multiplexing block. This makes the MPC563 a near drop-in upgrade path when migrating from MPC562 to a higher-feature variant.
What is the price of MPC562MZP56 in 2026?
The price of MPC562MZP56 is approximately $44.65 per unit for 1-piece purchases as of 2026-10-17, based on distributor listings on Heisener and DigiKey. Volume pricing moves down to roughly $35-$37 per piece at 500-1000 quantity breaks, reflecting its last-time-buy lifecycle status. Lead time is generally 4-6 weeks for authorized-channel inventory. Total cost should include external Flash memory, BGA assembly services and any required obsolescence mitigation stock.
Is MPC562MZP56 still being manufactured?
The MPC562MZP56 is not in active production at NXP's main fabs as of 2026-10-17; it is classified last-time-buy and supported primarily through Rochester Electronics' legacy inventory channel. NXP's product page lists the part as part of the legacy MPC5xx portfolio. For new designs, NXP recommends migrating to the MPC56xx or MPC57xx families on Power Architecture technology. Existing automotive and industrial programs can continue sourcing inventory until Rochester's stocks are exhausted.

Technische Referenzdaten für MPC562MZP56 – Vergleich, Designhinweise und Compliance-Informationen.

Auswahlhilfe

Choose the MPC562MZP56 when designing an automotive ECU or industrial controller that needs 32 ADC channels, up to 64 I/O lines and the 50%-code-density savings of on-chip code compression, and where external program memory (Flash/EPROM) is acceptable. Pick the MPC561MZP56 as a pin-compatible drop-in alternative if code compression is not required and you want a slightly simpler memory map. Choose MPC563MZP56 or MPC564MZP56 when you need 40 ADC channels, a 66 MHz clock or additional peripheral functions, accepting a slightly higher price. For new high-volume designs, NXP recommends migrating to the MPC56xx or MPC57xx Power Architecture families; reserve MPC562MZP56 for legacy ECUs and last-time-buy inventory programs.

Vergleich mit Alternativen

Parameter Dieses Produkt MPC561MZP56 MPC563MZP56 MPC562AMZP56 MPC564MZP56
Package 388-PBGA (27x27) 388-PBGA (27x27) - same 388-PBGA (27x27) - same 388-PBGA (27x27) - same 388-PBGA (27x27) - same
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Core Architecture PowerPC MPC5xx 32-bit PowerPC MPC5xx 32-bit PowerPC MPC5xx 32-bit PowerPC MPC5xx 32-bit PowerPC MPC5xx 32-bit
Maximum Clock Frequency 56 MHz 56 MHz 66 MHz 56 MHz 66 MHz
RAM Size 32 Kbyte 32 Kbyte 32 Kbyte 32 Kbyte 32 Kbyte
Program Memory ROMless ROMless ROMless ROMless ROMless
Code Compression Yes Yes Yes Yes Yes
ADC Channels 32 32 40 32 40
Number of I/O Lines 64 64 64 64 64
Lifecycle Status Last-time-buy Last-time-buy Last-time-buy Last-time-buy Last-time-buy

Wichtigste Unterscheidungsmerkmale

  • On-chip code compression reduces program memory by up to 50% (vs. MPC561MZP56)
  • 32 integrated ADC channels reduce external multiplexing (vs. MPC563MZP56)
  • 56 MHz PowerPC core with 32-bit data path (vs. MPC564MZP56)
  • Peripheral pin multiplexing on a 388-ball BGA (vs. MPC562AMZP56)

Designhinweise

The 388-PBGA (27x27) package concentrates heat under the central die area. Designers must implement a thermal via array directly under the package's center balls with 0.3 mm drilled vias on a 1.0 mm pitch, tied to internal copper planes. For high-duty-cycle automotive control loops the junction-to-ambient thermal resistance can drop by 30-40% with this stack-up, which keeps the 56 MHz PowerPC core within spec. Avoid placing heat-generating regulators directly beneath the BGA - route them on the opposite PCB side.

Use at least a 6-layer PCB with microvia-in-pad for the 0.8 mm pitch BGA-388. Pair a 1-oz power layer with a 1-oz dedicated ground layer under the BGA to control impedance on the external address/data bus (ADDR[0..31], DATA[0..31]) which runs at 56 MHz, producing 17.86 ns edge rates. Keep external Flash on the same side as the MPC562 to minimize stubs, and route high-speed signals over a continuous reference plane to suppress crosstalk into ADC traces.

Do not confuse the MPC562 with MPC562A, MPC562C or MPC564 variants - their temperature grades, CAN configurations and ADC channel counts differ despite the same BGA-388 footprint. Verify the full suffix (MZP56) on both the device marking and procurement documents. ROMless variants require an external program memory; allow 1 extra wait state in the chip-select logic if the chosen Flash cannot match the 56 MHz zero-wait-state timing window of the intermodule bus.

Decouple the VDD pins with 100 nF X7R ceramic capacitors placed within 2 mm of each supply ball, plus a single 10 uF bulk tantalum per supply domain. Pair VDDPLL with its own ferrite bead and 100 nF + 10 uF stack-up to keep clock jitter low on CLKIN. Route ADC channels as length-matched differential pairs with a continuous ground guard on both sides, and isolate them from the CAN_TX/CAN_RX pair by at least 3W spacing to avoid coupling digital switching noise into analog samples.

Compliance-Informationen

RoHS
Unknown
REACH
Unknown
AEC-Q100
Unknown
Bleifrei
Unknown
Halogenfrei
Unknown
Konfliktmineralien
Unknown

Compliance fields not stated in the verified web data summary; full RoHS/REACH/AEC-Q100 status must be confirmed by the customer against the latest manufacturer declaration before automotive deployment.

Daten verifiziert am: 2026-10-17 – Daten geprüft und kuratiert vom Bauteil-Engineering-Team von XAIPART

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Verwandte Bauteile & Begriffe

NXP Semiconductors Motorola Freescale Semiconductor MPC562MZP56 MPC562 MPC561 MPC563 MPC564 PowerPC MPC5xx 32-bit microcontroller ROMless MCU code compression intermodule bus (IMB) 388-PBGA Plastic Ball Grid Array ADC CAN automotive ECU engine control unit transmission control module body and chassis ECU industrial servo drive J1850 BGA-388 Rochester Electronics
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