MPC8255AZUPIBB vs MPC8260AZUPIBB Vergleich
Detaillierter Direktvergleich von MPC8255AZUPIBB von NXP Semiconductors und MPC8260AZUPIBB von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MPC8255AZUPIBB - PowerQUICC II 300MHz MPU | NXP | TBGA-480
MPC8255AZUPIBB ✓ AktivNXP Semiconductors
MPC8260AZUPIBB - PowerPC G2 MPU 300MHz 480-TBGA | NXP
MPC8260AZUPIBB ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | MPC8255AZUPIBB | MPC8260AZUPIBB |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Aktiv | Letzte Kaufgelegenheit |
| Manufacturer | NXP Semiconductors | — |
| Series | PowerQUICC II | — |
| Core Architecture | PowerPC G2 | — |
| Core Count | 1 | — |
| Datenbusbreite | 64-bit | 64-bit (external memory bus) |
| Maximum Clock Speed | 300 MHz | — |
| Internal Clock | [DATA_NEEDED: CPM RISC clock frequency] | — |
| Betriebsversorgungsspannung | 1.8 V (core) | — |
| Package Type | TBGA-480 (37.5 x 37.5 mm) | — |
| Montageart | Surface Mount | Surface Mount |
| Pin-Anzahl | 480 | — |
| Ball Pitch | 1.27 mm | — |
| Betriebstemperaturbereich | [DATA_NEEDED: industrial grade range] | — |
| Ethernet | 10/100 Mbps (2x MAC) | — |
| PCI Interface | PCI 2.2 compliant | — |
| RoHS-Status | [DATA_NEEDED] | [DATA_NEEDED: RoHS status not stated in web snippets] |
| Lead Free | [DATA_NEEDED] | — |
| MSL-Level | [DATA_NEEDED] | — |
| Family | — | PowerQUICC II |
| Core Processor | — | PowerPC G2 |
| Number of Cores | — | 1 |
| Bus Width | — | 32-bit |
| Core Speed | — | 300 MHz |
| Co-Processor / DSP | — | Communications; RISC CPM |
| RAM Controllers | — | DRAM, SDRAM |
| Graphics Acceleration | — | No |
| Display & Interface Controllers | — | None |
| Supply Voltage (Core) | — | 1.8 V |
| Supply Voltage (I/O) | — | 3.3 V |
| Process Technology | — | 0.25 um HiP4 |
| Gehäuse | — | 480-TBGA (37.5 x 37.5 mm, 1.55 mm height, 1.27 mm pitch) |
| Betriebstemperatur | — | -40C to +105C (industrial) |