MPC8321CVRAFDCA557 vs MPC8321CVRADDC Vergleich
Detaillierter Direktvergleich von MPC8321CVRAFDCA557 von NXP Semiconductors und MPC8321CVRADDC von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MPC8321CVRAFDCA557 - 333MHz PowerQUICC II Pro MPU | NXP | 516-PBGA
MPC8321CVRAFDCA557 ✓ AktivNXP Semiconductors
MPC8321CVRADDC - 266MHz PowerQUICC II Pro MPU, 516-PBGA | NXP
MPC8321CVRADDC ✓ AktivSpezifikationsvergleich
| Parameter | MPC8321CVRAFDCA557 | MPC8321CVRADDC |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Manufacturer | NXP Semiconductors (formerly Freescale) | NXP Semiconductors (formerly Freescale) |
| Series | PowerQUICC II Pro, MPC83xx | — |
| Core | e300c2 (MPC603e-based) PowerPC | PowerPC e300c2 |
| Core Architecture | 32-bit Power Architecture | 32-bit Power Architecture |
| Core Frequency | 333 MHz | — |
| Number of Cores | 1 | 1 |
| Core Voltage | 950 mV to 1.05 V | — |
| I/O Voltage | 3.0 V to 3.6 V | — |
| Betriebstemperatur | -40 °C to +105 °C | — |
| Gehäuse | 516-PBGA (27x27 mm) | — |
| Montageart | Surface Mount | Surface Mount |
| Memory Controller | DDR1 / DDR2 (16-bit ECC supported) | — |
| Integrated Peripheral Set | PCI 2.3, USB 2.0 (Host/Device), 8x UART, QUICC Engine, Security Engine | — |
| Ethernet | QUICC Engine (multi-protocol: Ethernet, HDLC, ATM) | — |
| Family Prefix (suffix decoding) | CVR = standard; AFD = 333 MHz / 0F lead-free; CA = 516-PBGA; 557 = specific die/firmware mask | — |
| Compliance | RoHS - check suffix code | — |
| Lead-Free / Pb-Free | Suffix-dependent (557/AFD variants lead-free) | — |
| MSL / Reflow | BGA-specific, per JEDEC J-STD-020 | — |
| Product Category | — | Microprocessors (MPU) |
| Processor Series | — | MPC8xxx / MPC83xx |
| Core Clock Speed | — | 266 MHz |
| Process Technology | — | 90 nm CMOS |
| Versorgungsspannung | — | 1.8 V / 2.5 V / 3.3 V |
| Package Type | — | 516-ball TEBGA (Plastic Ball Grid Array) |
| Package Dimensions | — | 27 mm x 27 mm |
| Betriebstemperaturbereich | — | -40C to +105C |
| Integrated Memory Controller | — | DDR1 / DDR2 SDRAM |
| Integrated Peripherals | — | QUICC Engine, PCI, USB 2.0, UART, I2C, GPIO, TDM/HDLC |
| RoHS-Status | — | [DATA_NEEDED: RoHS compliance status] |
| Encryption / SEC Block | — | Not included (non-E variant) |