MPC8321CVRAFDCA557 vs MPC8321CVRADDC Comparaison
Comparaison détaillée côte à côte de MPC8321CVRAFDCA557 par NXP Semiconductors et MPC8321CVRADDC par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
NXP Semiconductors
MPC8321CVRAFDCA557 - 333MHz PowerQUICC II Pro MPU | NXP | 516-PBGA
MPC8321CVRAFDCA557 ✓ ActifNXP Semiconductors
MPC8321CVRADDC - 266MHz PowerQUICC II Pro MPU, 516-PBGA | NXP
MPC8321CVRADDC ✓ ActifComparaison des spécifications
| Paramètre | MPC8321CVRAFDCA557 | MPC8321CVRADDC |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | Actif | Actif |
| Manufacturer | NXP Semiconductors (formerly Freescale) | NXP Semiconductors (formerly Freescale) |
| Series | PowerQUICC II Pro, MPC83xx | — |
| Core | e300c2 (MPC603e-based) PowerPC | PowerPC e300c2 |
| Core Architecture | 32-bit Power Architecture | 32-bit Power Architecture |
| Core Frequency | 333 MHz | — |
| Number of Cores | 1 | 1 |
| Core Voltage | 950 mV to 1.05 V | — |
| I/O Voltage | 3.0 V to 3.6 V | — |
| Température de fonctionnement | -40 °C to +105 °C | — |
| Boîtier | 516-PBGA (27x27 mm) | — |
| Type de montage | Surface Mount | Surface Mount |
| Memory Controller | DDR1 / DDR2 (16-bit ECC supported) | — |
| Integrated Peripheral Set | PCI 2.3, USB 2.0 (Host/Device), 8x UART, QUICC Engine, Security Engine | — |
| Ethernet | QUICC Engine (multi-protocol: Ethernet, HDLC, ATM) | — |
| Family Prefix (suffix decoding) | CVR = standard; AFD = 333 MHz / 0F lead-free; CA = 516-PBGA; 557 = specific die/firmware mask | — |
| Compliance | RoHS - check suffix code | — |
| Lead-Free / Pb-Free | Suffix-dependent (557/AFD variants lead-free) | — |
| MSL / Reflow | BGA-specific, per JEDEC J-STD-020 | — |
| Product Category | — | Microprocessors (MPU) |
| Processor Series | — | MPC8xxx / MPC83xx |
| Core Clock Speed | — | 266 MHz |
| Process Technology | — | 90 nm CMOS |
| Tension d'alimentation | — | 1.8 V / 2.5 V / 3.3 V |
| Package Type | — | 516-ball TEBGA (Plastic Ball Grid Array) |
| Package Dimensions | — | 27 mm x 27 mm |
| Plage de température de fonctionnement | — | -40C to +105C |
| Integrated Memory Controller | — | DDR1 / DDR2 SDRAM |
| Integrated Peripherals | — | QUICC Engine, PCI, USB 2.0, UART, I2C, GPIO, TDM/HDLC |
| Statut RoHS | — | [DATA_NEEDED: RoHS compliance status] |
| Encryption / SEC Block | — | Not included (non-E variant) |