MPC855TZQ50D4 vs MPC855TVR50D4 Vergleich
Detaillierter Direktvergleich von MPC855TZQ50D4 von NXP Semiconductors und MPC855TVR50D4 von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | MPC855TZQ50D4 | MPC855TVR50D4 |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Obsolete | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $19,50 | $48,10 |
| Manufacturer | NXP Semiconductors (formerly Freescale, Motorola) | — |
| Series | PowerQUICC MPC8xx | PowerQUICC I (MPC8xx) |
| Core Architecture | 32-bit Power Architecture | Power Architecture (PowerPC) 32-bit, 1 core |
| Core Frequency | 50 MHz | 50 MHz |
| Number of Cores | 1 | — |
| Communications Processor Module (CPM) | Yes (RISC-based offload engine) | — |
| Ethernet Support | 10/100 Mbps Fast Ethernet MAC | — |
| ATM Support | Yes (ATM SAR) | — |
| HDLC/SDLC Support | Yes | — |
| PCMCIA Interface | Yes | — |
| Instruction Cache | 4 KB | — |
| Data Cache | 4 KB | — |
| MMU | Yes | — |
| Gehäuse | 357-ball PBGA (25 x 25 mm) | 357-Ball PBGA (25x25 mm) |
| Betriebstemperatur | 0C to +95C | 0 C to +95 C (commercial) |
| Process Technology | 0.32 um CMOS (per FindIC reference data) | — |
| Montageart | Surface Mount | Surface Mount (BGA) |
| RoHS-Status | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS compliance status] |
| Versorgungsspannung | [DATA_NEEDED: core/IO voltage values] | 2.0 V to 3.6 V |
| Integrated Peripherals | — | CPM, ENET, ATM, HDLC, PCMCIA |
| Cache Size | — | 8 KB unified instruction/data |
| Ethernet | — | 10/100 Mbps (FCC/FEC) |
| Memory Controller | — | SDRAM, ROM, Flash, PCMCIA |
| Core Marking Family | — | MPC85xx |
| MSL-Level | — | 3 |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |