MPC855TVR50D4 - PowerQUICC I 50MHz SoC | NXP | 357-PBGA
Teilenummer: MPC855TVR50D4 ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $81.38 | $81,38 |
| 10 | $72.85 | $728,50 |
| 100 | $64.2 | $6.420,00 |
| 500 | $55.4 | $27.700,00 |
| 1.000 | $48.1 | $48.100,00 |
MPC855TVR50D4 Übersicht
A PowerQUICC (Power Architecture with QUICC engine) is a category of integrated communications processors that combines a Power Architecture CPU with dedicated serial-communication peripherals on a single die. It sits at the border between traditional microprocessors and systems-on-chip - earlier PowerQUICC devices typically pair a host CPU with a RISC-based CPM offload engine for TDM/HDLC/Ethernet traffic, allowing wire-speed processing without burdening the main core. The MPC8xx/PowerQUICC I family originated at Motorola (later Freescale, now NXP) and was widely deployed in access equipment, ISDN routers, and industrial control boards.
Key features include a 32-bit Power Architecture core at 50MHz, 8KB unified cache, a CPM with RISC controller supporting HDLC/ATM/Ethernet, dual 10/100 Mbps Fast Ethernet MACs (FCC/FEC), PCMCIA interface, and integrated memory controller for SDRAM, ROM and Flash. The device operates at 2.0V to 3.6V core I/O supply and is qualified over the 0C to +95C ambient temperature range (commercial).
Architecturally, the MPC855T couples a PowerPC-style integer core with a separate RISC-based CPM, letting the host CPU handle control-plane tasks while the CPM engine handles time-critical DMA and serial protocols. This split-engine approach reduces interrupt latency and offloads bit-banging from the main core, which is the defining engineering benefit of the PowerQUICC family.
Typical applications include DSLAM line cards, ISDN routers, low-end ATM switches, industrial gateways, and embedded control with Ethernet connectivity. The integrated PCMCIA interface also supports legacy laptop-style peripherals and CompactFlash storage in industrial designs.
When designing with the MPC855TVR50D4, careful BGA escape routing and a multi-layer (typically 6+ layer) PCB stackup are required to maintain SI on the 50MHz parallel memory bus. Thermal dissipation is modest at 50MHz but the PBGA still requires thermal vias under the die for production reliability.
This page synthesizes distributor inventory across DigiKey, Rochester Electronics, LCSC and Heisener, alongside parametric drop-in alternatives not consolidated on a single manufacturer page, plus practical design notes covering BGA fan-out, memory-controller tuning and CPM programming considerations.
Drop-in-Alternativen für MPC855TVR50D4 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MPC855TVR50D4 (gleiche Bauform und Footprint) – abweichend in Operating Temperature, Package, Core Architecture, Manufacturer, Process Technology.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MPC855TVR66D4
✅ Drop-In✓ Auf Lager
$55.4 / Stück
Datenblatt ansehen →MPC855TCVR50D4
✅ Drop-In✓ Auf Lager
$52.83 / Stück
Datenblatt ansehen →MPC860TCVR50D4
✅ Drop-In✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →MPC860TZQ50D4
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MPC855TVR66D4
✅ Drop-In✓ Auf Lager
$55.4 / Stück
Datenblatt ansehen →MPC855TVR50D4 Grenzwerte & elektrische Eigenschaften
| Core Architecture | Power Architecture (PowerPC) 32-bit, 1 core |
| Core Frequency | 50 MHz |
| Series | PowerQUICC I (MPC8xx) |
| Integrated Peripherals | CPM, ENET, ATM, HDLC, PCMCIA |
| Cache Size | 8 KB unified instruction/data |
| Versorgungsspannung | 2.0 V to 3.6 V |
| Betriebstemperatur | 0 C to +95 C (commercial) |
| Gehäuse | 357-Ball PBGA (25x25 mm) |
| Montageart | Surface Mount (BGA) |
| Ethernet | 10/100 Mbps (FCC/FEC) |
| Memory Controller | SDRAM, ROM, Flash, PCMCIA |
| Core Marking Family | MPC85xx |
| MSL-Level | 3 |
MPC855TVR50D4 357-ball pbga (25x25 mm) Pinbelegungsleitfaden
Pinbelegung für MPC855TVR50D4 (357-ball pbga (25x25 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für MPC855TVR50D4.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
MPC855TVR50D4 ist geeignet für 6 Anwendungs: DSLAM Line Card & ISDN Router, Industrial Ethernet Gateway, Low-End ATM Switch Controller, Embedded Networking Card with PCMCIA Storage, Telecom Multiplexer / TDM Backhaul, Legacy Print Server / Imaging Hub.
DSLAM Line Card & ISDN Router
The MPC855TVR50D4 is purpose-built for DSLAM line cards and ISDN routers where a single chip must deliver line-card control plus wire-speed HDLC/ATM framing. Its PowerPC core handles protocol-control tasks while the dedicated CPM RISC engine offloads bit-rate HDLC/ATM framing, eliminating a separate framer chip. The 10/100 Ethernet MAC (FEC) lets the line card terminate an uplinks-side Fast Ethernet, while the 2.0-3.6V I/O range directly supports legacy 3.3V DSL front-end ASICs of the era. Use it when you need a proven PowerQUICC I hot-spot controller with deterministic CPM latency rather than the throughput of a later PowerQUICC II/III part.
Empfohlen
Industrial Ethernet Gateway
The MPC855TVR50D4 fits industrial Ethernet gateways that translate serial-fieldbus or RS-485 traffic to TCP/IP over Ethernet. Its PCMCIA interface enables CompactFlash storage for event logging, while the dual 10/100 Ethernet MACs gate two physical uplink ports from a single MPU. The 0C to +95C commercial ambient grade pairs with the on-chip CPM to handle deterministic real-time protocols. For harsh-environment deployments, NXP's extended-grade -40 to +85C MPC855T members share the same 357-BGA footprint and can be substituted without PCB rework.
Empfohlen
Low-End ATM Switch Controller
The MPC855TVR50D4's dedicated ATM support in the CPM is what enables it as a low-end ATM-switch control processor in legacy access networks. The CPM's ATM layer handles AAL5 segmentation/reassembly directly, freeing the PowerPC core to run fabric-management software, allowing a single chip to manage 2-4 UNI/NNI ports at OC-3 speeds. The 357-PBGA footprint is shared across the MPC860 family, making migration to richer ATM channel counts a no-cost PCB change. Use the 855T variant when ATM-port count is small (1-4) and the higher-density 860 family is overkill.
Empfohlen
Embedded Networking Card with PCMCIA Storage
The MPC855TVR50D4's integrated PCMCIA controller makes it ideal for embedded SBCs that boot from CompactFlash or expose a PC-Card slot for field upgrade. The CPM offloads HDLC/Ethernet framing while the PowerPC core runs Linux/uClinux for application logic, eliminating a discrete network processor. The single 3.3V supply rail powers both the core and PCMCIA, simplifying the BOM. Designers can boot kernel+rootfs from a CF card while the CPM handles the deterministic wire-side protocol on the same die.
Empfohlen
Telecom Multiplexer / TDM Backhaul
Telecom multiplexers and TDM backhauls benefit from the MPC855TVR50D4's multiple serial channels (SCCs/SMCs) tied through the CPM time-division-multiplex controller. The chip aggregates E1/T1 streams into HDLC frames for backhauling to a central office, with the host CPU running link-management and OAM tasks. The 50MHz core is sufficient for 2-4 E1 ports of traffic with OAM overhead. For higher port density, the pin-compatible MPC860 family at the same 357-BGA gives more SCCs without changing the PCB.
Empfohlen
Legacy Print Server / Imaging Hub
Office imaging equipment such as print servers and scanners often use the MPC855TVR50D4 for its dual Ethernet MACs (a private LAN and a public-facing LAN) plus the PCMCIA interface for an option-card slot. The dedicated CPM offloads network traffic from the main core, ensuring print-job timing remains unaffected by LAN load. The wide 2.0-3.6V supply range and proven reliability make this part a long-tail choice for industrial imaging OEMs. Same-footprint variants allow end-of-life migration without PCB rework.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MPC855TVR50D4 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MPC855TVR66D4 | MPC855TCVR50D4 | MPC860TCVR50D4 | MPC860TZQ50D4 |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 357-PBGA (25x25) | 357-PBGA (25x25) | 357-PBGA (25x25) | 357-PBGA (25x25) | 357-PBGA (25x25) |
| Core Architecture | Power Architecture 32-bit | Power Architecture 32-bit | Power Architecture 32-bit | Power Architecture 32-bit | Power Architecture 32-bit |
| Core Frequency | 50 MHz | 66 MHz | 50 MHz | 50 MHz | 50 MHz |
| Series / Family | MPC855T / PowerQUICC I | MPC855T / PowerQUICC I | MPC855T / PowerQUICC I | MPC860 / PowerQUICC I | MPC860 / PowerQUICC I |
| Integrated Peripherals | CPM, ENET, ATM, HDLC, PCMCIA | CPM, ENET, ATM, HDLC, PCMCIA | CPM, ENET, ATM, HDLC, PCMCIA | More FCCs/ATM channels, full PowerQUICC I peripherals | More CPM channels, wider memory map |
| Supply Voltage | 2.0 V to 3.6 V | 2.0 V to 3.6 V | 2.0 V to 3.6 V | 2.0 V to 3.6 V | 2.0 V to 3.6 V |
| Operating Temperature | 0 C to +95 C | 0 C to +95 C | 0 C to +95 C (commercial) | 0 C to +95 C | 0 C to +95 C |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND |
Wichtigste Unterscheidungsmerkmale
- Direct-pin-compatible 66MHz upgrade on identical 357-BGA (vs. MPC855TVR66D4)
- Higher-integration PowerQUICC I members share footprint (vs. MPC860TCVR50D4)
- Integrated CPM offloads framing from host CPU (vs. Discrete PowerPC + external framer)
- PCMCIA controller on-chip (vs. External PCMCIA controller devices)
Designhinweise
The 357-PBGA 25x25 mm package at ~1.27 mm ball pitch requires a minimum 6-layer PCB stackup with microvia-in-pad or standard dog-bone fan-out from the BGA perimeter. Use 0.5 oz copper outer layers with 1 oz inner power planes to maintain 50 ohm SE impedance on the memory bus traces; the bus runs at 50MHz with 32-bit data and must be length-matched to within 50 ps to keep skew within the MPC8xx memory controller's spec. Place four ground-referenced signal-via fields adjacent to the BGA corner balls to give the return-current paths an exit without forcing a 4x via stackup.
Decouple the core VDDH and I/O VDD rails with a mixture of 100 nF X7R ceramic caps per nearest pair of balls and 10 uF bulk on each supply island. Place the 100 nF caps on the back side of the BGA with via-in-pad so the parasitic loop to the die is sub-1 nH. The 2.0-3.6V supply range must be sequenced: power up VDD before VDDH to avoid latch-up; many datasheets mandate a soft-start ramp under 1 ms to avoid triggering internal ESD clamps.
Do not assume the 357-PBGA footprint is identical between the MPC855T and MPC860 families without re-validating - in some 860 series, the pin multiplexing of BE[0:7]/PCMCIA pins changes, which can flip unused balls into a conflicting peripheral mode if your firmware configured them unconditionally. Many verifications show that the MPC855TCVR50D4 firmware binaries run unmodified on the MPC855TVR50D4 but not always on the MPC860 family. Use the BSP that explicitly targets your chosen MPC8xx subsystem.
At 50MHz core on 3.3V, the MPC855TVR50D4 dissipates approximately 0.6-0.9W typical and must thermal-via to an inner copper plane under the die. Use a thermal-pad array of 30-50 vias under the central die region tied to the GND inner plane to drop theta_JA below 15 C/W in still air. For sealed enclosures, derate ambient by 10 C above 1 W dissipation or add an aluminum core spreader.
Compliance-Informationen
RoHS/REACH/lead-free status not explicitly published in the verified distributor snippets; check NXP's product-compliance portal for production-bill-of-materials documentation.
