MPC8572ECPXAULD vs MPC8572ECVTAVNE Vergleich

Detaillierter Direktvergleich von MPC8572ECPXAULD von NXP Semiconductors und MPC8572ECVTAVNE von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
MPC8572ECPXAULD MPC8572ECPXAULD - PowerQUICC III Dual-Core SoC 1.333GHz | NXP

MPC8572ECPXAULD - PowerQUICC III Dual-Core SoC 1.333GHz | NXP

MPC8572ECPXAULD Nrnd
NXP Semiconductors
MPC8572ECVTAVNE MPC8572ECVTAVNE - 1.5GHz Dual-Core PowerPC e500 SoC | NXP

MPC8572ECVTAVNE - 1.5GHz Dual-Core PowerPC e500 SoC | NXP

MPC8572ECVTAVNE Nrnd

Spezifikationsvergleich

Parameter MPC8572ECPXAULD MPC8572ECVTAVNE
Marke NXP Semiconductors NXP Semiconductors
Kategorie Microcontrollers Microcontrollers
Lebenszyklusstatus NRND NRND
Lagerstatus In Stock In Stock
Stückpreis (USD) $219,80 $308,55
Manufacturer NXP Semiconductors (formerly Freescale) —
Part Family PowerQUICC III (MPC85xx) —
Processor Core PowerPC e500 (dual-core) —
Core Count 2 —
Datenbusbreite 32-bit —
Maximale Taktfrequenz 1.333 GHz —
Betriebsversorgungsspannung 1.1 V core / 1.8 V / 2.5 V / 3.3 V I/O —
Package Type 1023-ball FCBGA (33 x 33 mm) —
Montagestil Surface Mount (BGA) —
Process Technology 90 nm CMOS 0.09 um CMOS
Instruction Set PowerISA 32-bit —
L2 Cache 512 KB (shared) [DATA_NEEDED: L2 cache size]
Ethernet Controllers 4 x 10/100/1000 Mbps tri-speed MACs with SerDes —
Memory Controller DDR2 / DDR3 with ECC DDR2/DDR3 with ECC (per datasheet family)
Betriebstemperaturbereich Industrial (TBD) [DATA_NEEDED: exact -40C/+85C confirmation] —
RoHS-Status Compliant (data-needs verification at supplier page) [DATA_NEEDED: confirm RoHS for this part suffix]
MSL-Level [DATA_NEEDED: moisture sensitivity level] —
Processor Type — MPC85xx PowerQUICC III
Core Architecture — PowerPC e500, dual-core, 32-bit RISC
Maximum CPU Clock — 1.5 GHz
Core Voltage — 1.1 V
I/O Voltage — 1.8 V / 2.5 V / 3.3 V
Number of Cores — 2
Ethernet MACs — 4x 10/100/1000 Mbit
PCI Express — 2x PCIe interfaces
Serial RapidIO — 2x endpoints
Security Engine — SEC 4.0 (IPSec/SSL/Kasumi/Snow 3G)
Gehäuse — 1023-ball FCBGA (33x33 mm)
Montageart — Surface Mount
Betriebstemperatur — [DATA_NEEDED: industrial temp grade]

Datenblätter & Ressourcen

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