MPC860TVR50D4 vs MPC860DTVR50D4 Vergleich
Detaillierter Direktvergleich von MPC860TVR50D4 von NXP Semiconductors und MPC860DTVR50D4 von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | MPC860TVR50D4 | MPC860DTVR50D4 |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Obsolete | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $58,00 | $59,80 |
| Core Architecture | PowerPC 32-bit | 32-bit PowerPC |
| Core Count | 1 | — |
| Maximale Taktfrequenz | 50 MHz | — |
| Operating Supply Voltage (Core) | 3.3 V | — |
| Operating Supply Voltage (I/O) | 3.3 V | — |
| Gehäuse / Bauform | 357-PBGA (25x25 mm) | 357-PBGA (25 x 25 mm) |
| Process Technology | 0.32 µm CMOS | 0.32 um CMOS |
| Instruction Cache | 4 Kbyte | — |
| Data Cache | 4 Kbyte | — |
| Integrated Communications Module (CPM) | Yes (SCC, SMC, SPI, I²C, UART) | — |
| PCMCIA Interface | Yes (Type I/II) | — |
| Memory Controller | DRAM, SRAM, EPROM, Flash | — |
| Betriebstemperaturbereich | -40°C to +95°C | — |
| Montageart | Surface Mount (BGA) | Surface Mount |
| Series | MPC8xx PowerQUICC | — |
| RoHS-Status | [DATA_NEEDED: rohs compliance] | RoHS Compliant |
| Lead-Free / Reflow Profile | [DATA_NEEDED: reflow profile] | — |
| Processor Type | — | MPC8xx PowerQUICC |
| Number of Cores | — | 1 |
| Speed | — | 50 MHz |
| Versorgungsspannung | — | 3.3 V |
| Packaging | — | Tray |
| Lead Free Status | — | Lead Free |
| Communications Processor Module (CPM) | — | Integrated (RISC-based) |
| DMA Channels | — | 4 |
| Betriebstemperatur | — | 0C to +95C |
| External Memory Bus | — | 32-bit (single/dual bus) |