MPC860TVR80D4 vs MPC860TZQ80D4 Vergleich
Detaillierter Direktvergleich von MPC860TVR80D4 von NXP Semiconductors und MPC860TZQ80D4 von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | MPC860TVR80D4 | MPC860TZQ80D4 |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Ende des Lebenszyklus | Ende des Lebenszyklus |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $14,85 | $24,40 |
| Processor Type | MPC8xx PowerQUICC, 32-bit RISC | MPC8xx PowerQUICC, 32-Bit |
| Core Architecture | PowerPC + CPM (RISC communications processor) | PowerPC 32-bit |
| Core Frequency | 80 MHz | 80 MHz |
| Operating Voltage | 3.3 V | 3.3 V |
| Gehäuse / Bauform | 357-BGA (PBGA 25x25 mm) | — |
| Process Technology | 0.32 micrometer CMOS | 0.25 micron CMOS |
| Instruction Cache | 4 KB | — |
| Data Cache | 4 KB | — |
| Communication Controllers | 3 FCC, 4 SCC, 2 SMC | — |
| Ethernet MAC | 10/100 Mbps integrated | — |
| Memory Controller | DRAM, SRAM, Flash, EDO support | — |
| Number of Cores | 1 | 1 |
| Betriebstemperatur | [DATA_NEEDED: operating temperature range] | -40 C to +95 C (industrial grade per suffix T) |
| Packaging | Tray | Tray |
| Lead Free Status | Lead Free | — |
| RoHS-Status | RoHS Compliant | RoHS non-compliant (legacy PBGA, contains lead) |
| Montageart | Surface Mount (BGA) | Surface Mount |
| Bus Width | — | 32-bit |
| Cache Memory | — | [DATA_NEEDED: unified cache size in KB] |
| Serial Communications Controllers (SCC) | — | 4 channels |
| Serial Management Controllers (SMC) | — | 2 channels |
| SPI Controllers | — | 2 |
| I2C Interface | — | 1 |
| Gehäuse | — | 357-BGA (PBGA), 25 x 25 mm |
| Lead Status | — | Contains Lead (legacy PBGA) |