MPC860TVR80D4 vs MPC860TZQ80D4 Comparación
Comparación detallada lado a lado de MPC860TVR80D4 por NXP Semiconductors y MPC860TZQ80D4 por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | MPC860TVR80D4 | MPC860TZQ80D4 |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Fin de vida | Fin de vida |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $14,85 | $24,40 |
| Processor Type | MPC8xx PowerQUICC, 32-bit RISC | MPC8xx PowerQUICC, 32-Bit |
| Core Architecture | PowerPC + CPM (RISC communications processor) | PowerPC 32-bit |
| Core Frequency | 80 MHz | 80 MHz |
| Operating Voltage | 3.3 V | 3.3 V |
| Encapsulado / Carcasa | 357-BGA (PBGA 25x25 mm) | — |
| Process Technology | 0.32 micrometer CMOS | 0.25 micron CMOS |
| Instruction Cache | 4 KB | — |
| Data Cache | 4 KB | — |
| Communication Controllers | 3 FCC, 4 SCC, 2 SMC | — |
| Ethernet MAC | 10/100 Mbps integrated | — |
| Memory Controller | DRAM, SRAM, Flash, EDO support | — |
| Number of Cores | 1 | 1 |
| Temperatura de funcionamiento | [DATA_NEEDED: operating temperature range] | -40 C to +95 C (industrial grade per suffix T) |
| Packaging | Tray | Tray |
| Lead Free Status | Lead Free | — |
| Estado RoHS | RoHS Compliant | RoHS non-compliant (legacy PBGA, contains lead) |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Bus Width | — | 32-bit |
| Cache Memory | — | [DATA_NEEDED: unified cache size in KB] |
| Serial Communications Controllers (SCC) | — | 4 channels |
| Serial Management Controllers (SMC) | — | 2 channels |
| SPI Controllers | — | 2 |
| I2C Interface | — | 1 |
| Encapsulado | — | 357-BGA (PBGA), 25 x 25 mm |
| Lead Status | — | Contains Lead (legacy PBGA) |