MPC860TVR80D4 vs MPC862TVR80B Vergleich
Detaillierter Direktvergleich von MPC860TVR80D4 von NXP Semiconductors und MPC862TVR80B von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | MPC860TVR80D4 | MPC862TVR80B |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Ende des Lebenszyklus | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $14,85 | $52,00 |
| Processor Type | MPC8xx PowerQUICC, 32-bit RISC | — |
| Core Architecture | PowerPC + CPM (RISC communications processor) | PowerPC, 32-Bit |
| Core Frequency | 80 MHz | 80 MHz |
| Operating Voltage | 3.3 V | — |
| Gehäuse / Bauform | 357-BGA (PBGA 25x25 mm) | — |
| Process Technology | 0.32 micrometer CMOS | 0.32 um |
| Instruction Cache | 4 KB | — |
| Data Cache | 4 KB | — |
| Communication Controllers | 3 FCC, 4 SCC, 2 SMC | — |
| Ethernet MAC | 10/100 Mbps integrated | — |
| Memory Controller | DRAM, SRAM, Flash, EDO support | — |
| Number of Cores | 1 | 1 |
| Betriebstemperatur | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: temperature grade] |
| Packaging | Tray | — |
| Lead Free Status | Lead Free | — |
| RoHS-Status | RoHS Compliant | [DATA_NEEDED: RoHS compliance] |
| Montageart | Surface Mount (BGA) | Surface Mount |
| Manufacturer | — | NXP Semiconductors |
| Series | — | PowerQUICC MPC8xx |
| Core Processor | — | MPC8xx |
| Gehäuse | — | 357-PBGA (25x25 mm) |
| Terminal Form | — | Ball |
| Number of Terminals | — | 357 |
| Package Code | — | BGA |
| Package Shape | — | Square |
| Versorgungsspannung | — | [DATA_NEEDED: VDD specifications] |