MPC860TVR80D4 vs MPC862TVR80B Comparación
Comparación detallada lado a lado de MPC860TVR80D4 por NXP Semiconductors y MPC862TVR80B por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | MPC860TVR80D4 | MPC862TVR80B |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Fin de vida | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $14,85 | $52,00 |
| Processor Type | MPC8xx PowerQUICC, 32-bit RISC | — |
| Core Architecture | PowerPC + CPM (RISC communications processor) | PowerPC, 32-Bit |
| Core Frequency | 80 MHz | 80 MHz |
| Operating Voltage | 3.3 V | — |
| Encapsulado / Carcasa | 357-BGA (PBGA 25x25 mm) | — |
| Process Technology | 0.32 micrometer CMOS | 0.32 um |
| Instruction Cache | 4 KB | — |
| Data Cache | 4 KB | — |
| Communication Controllers | 3 FCC, 4 SCC, 2 SMC | — |
| Ethernet MAC | 10/100 Mbps integrated | — |
| Memory Controller | DRAM, SRAM, Flash, EDO support | — |
| Number of Cores | 1 | 1 |
| Temperatura de funcionamiento | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: temperature grade] |
| Packaging | Tray | — |
| Lead Free Status | Lead Free | — |
| Estado RoHS | RoHS Compliant | [DATA_NEEDED: RoHS compliance] |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Manufacturer | — | NXP Semiconductors |
| Series | — | PowerQUICC MPC8xx |
| Core Processor | — | MPC8xx |
| Encapsulado | — | 357-PBGA (25x25 mm) |
| Terminal Form | — | Ball |
| Number of Terminals | — | 357 |
| Package Code | — | BGA |
| Package Shape | — | Square |
| Tensión de alimentación | — | [DATA_NEEDED: VDD specifications] |