MPC875VR133 vs MPC870ZT133 Vergleich
Detaillierter Direktvergleich von MPC875VR133 von NXP Semiconductors und MPC870ZT133 von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | MPC875VR133 | MPC870ZT133 |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Obsolete | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $27,90 | $28,75 |
| Manufacturer | NXP Semiconductors (formerly Freescale Semiconductor) | NXP USA Inc. (formerly Freescale) |
| Series | PowerQUICC, MPC8xx | — |
| Core Architecture | Power Architecture (32-bit RISC) | Power Architecture (G2_LE) |
| Core Count | 1 | — |
| Core Frequency | 133 MHz | 133 MHz |
| Performance | 176 MIPS | — |
| Datenbusbreite | 32 bit | — |
| Process Technology | 0.18 µm CMOS | — |
| Supply Voltage (I/O) | 3.3 V | — |
| Betriebstemperatur | 0 °C to +95 °C | 0C to +95C (commercial) |
| Package Type | 256-PBGA (HBGA), 23x23 mm | — |
| Terminal Pitch | 1.27 mm | — |
| On-chip Communications | CPM (HDLC/Sync UART/I²C/SPI), 2x 10/100 Ethernet MII/RMII | — |
| Memory Controller | SDRAM, Flash, SRAM, ROM support | — |
| PCI Bridge | Integrated (PCI 2.1) | — |
| Montageart | Surface Mount (BGA) | Surface Mount |
| MSL-Level | [DATA_NEEDED: MSL level] | — |
| RoHS-Status | [DATA_NEEDED: RoHS status] | Non-Compliant (legacy part) |
| Product Family | — | PowerQUICC MPC8xx |
| Processor Type | — | MPC8xx PowerQUICC, 32-Bit |
| Number of Cores | — | 1 |
| External Data Bus Width | — | 32-bit |
| Versorgungsspannung | — | 3.3 V I/O, 1.8 V core |
| Gehäuse / Bauform | — | 256-PBGA (23 x 23 mm) |
| Terminal Form | — | BALL |
| Number of Terminals | — | 256 |
| Package Code | — | HBGA |
| Lead Free Status | — | Contains Lead |
| Packaging | — | Tray |