MPC875VR133 vs MPC870ZT133 Comparaison
Comparaison détaillée côte à côte de MPC875VR133 par NXP Semiconductors et MPC870ZT133 par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | MPC875VR133 | MPC870ZT133 |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | Obsolete | Obsolete |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $27,90 | $28,75 |
| Manufacturer | NXP Semiconductors (formerly Freescale Semiconductor) | NXP USA Inc. (formerly Freescale) |
| Series | PowerQUICC, MPC8xx | — |
| Core Architecture | Power Architecture (32-bit RISC) | Power Architecture (G2_LE) |
| Core Count | 1 | — |
| Core Frequency | 133 MHz | 133 MHz |
| Performance | 176 MIPS | — |
| Largeur du bus de données | 32 bit | — |
| Process Technology | 0.18 µm CMOS | — |
| Supply Voltage (I/O) | 3.3 V | — |
| Température de fonctionnement | 0 °C to +95 °C | 0C to +95C (commercial) |
| Package Type | 256-PBGA (HBGA), 23x23 mm | — |
| Terminal Pitch | 1.27 mm | — |
| On-chip Communications | CPM (HDLC/Sync UART/I²C/SPI), 2x 10/100 Ethernet MII/RMII | — |
| Memory Controller | SDRAM, Flash, SRAM, ROM support | — |
| PCI Bridge | Integrated (PCI 2.1) | — |
| Type de montage | Surface Mount (BGA) | Surface Mount |
| Niveau MSL | [DATA_NEEDED: MSL level] | — |
| Statut RoHS | [DATA_NEEDED: RoHS status] | Non-Compliant (legacy part) |
| Product Family | — | PowerQUICC MPC8xx |
| Processor Type | — | MPC8xx PowerQUICC, 32-Bit |
| Number of Cores | — | 1 |
| External Data Bus Width | — | 32-bit |
| Tension d'alimentation | — | 3.3 V I/O, 1.8 V core |
| Boîtier / Format | — | 256-PBGA (23 x 23 mm) |
| Terminal Form | — | BALL |
| Number of Terminals | — | 256 |
| Package Code | — | HBGA |
| Lead Free Status | — | Contains Lead |
| Packaging | — | Tray |