MPX2100DP vs MPX2100GP Vergleich
Detaillierter Direktvergleich von MPX2100DP von NXP Semiconductors und MPX2100GP von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | MPX2100DP | MPX2100GP |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Pressure Sensors | Pressure Sensors |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $5,95 | $10,40 |
| Pressure Type | Differential | Vented Gauge |
| Operating Pressure Range | 0 kPa to 100 kPa (0 to 14.5 psi) | 0 to 14.5 psi (0 to 100 kPa) |
| Maximum Overload Pressure | [DATA_NEEDED: maximum overload pressure] | — |
| Full-Scale Span (Typical) | 40 mV (at 10 V excitation) | — |
| Zero Pressure Offset | [DATA_NEEDED: zero pressure offset] | — |
| Linearity | 1% typical | — |
| Versorgungsspannung | 10 V DC typical | 10 V typical (ratiometric) |
| Versorgungsstrom | [DATA_NEEDED: supply current] | — |
| Ausgangstyp | Analog mV (Wheatstone Bridge) | Wheatstone Bridge (analog voltage, ratiometric) |
| Betriebstemperatur | 0C to +85C (compensated) | [DATA_NEEDED: operating temperature range] |
| Storage Temperature | [DATA_NEEDED: storage temperature] | — |
| Port Configuration | Dual port, axial tube, 4.93 mm (0.19 in) | — |
| Gehäuse / Bauform | 4-SIP Module (Case 344C-01) | — |
| Montageart | Through-Hole | Through-Hole |
| Technology | Silicon piezoresistive, on-chip temperature compensation | Silicon piezoresistive, MEMS |
| RoHS-Status | Compliant | unknown |
| MSL-Level | [DATA_NEEDED: MSL rating] | — |
| Maximum Overpressure | — | 58.02 psi (400 kPa) |
| Full-Scale Span | — | 40 mV typical at 10 V supply |
| Offset | — | 0 mV minimum at 0 kPa |
| Maximum Operating Current | — | 6 mA |
| Port Size | — | Male 0.19 in (4.93 mm) barbed tube |
| Port Style | — | Barbed |
| Gehäuse | — | 4-SIP Module (Unibody through-hole) |
| Temperature Compensation | — | On-chip, calibrated |
| Termination Style | — | PCB (SIP pins) |