MPX2100DP vs MPX2100GP Comparação
Comparação detalhada lado a lado de MPX2100DP por NXP Semiconductors e MPX2100GP por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Comparação de especificações
| Parâmetro | MPX2100DP | MPX2100GP |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoria | Pressure Sensors | Pressure Sensors |
| Status do ciclo de vida | Ativo | Ativo |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $5,95 | $10,40 |
| Pressure Type | Differential | Vented Gauge |
| Operating Pressure Range | 0 kPa to 100 kPa (0 to 14.5 psi) | 0 to 14.5 psi (0 to 100 kPa) |
| Maximum Overload Pressure | [DATA_NEEDED: maximum overload pressure] | — |
| Full-Scale Span (Typical) | 40 mV (at 10 V excitation) | — |
| Zero Pressure Offset | [DATA_NEEDED: zero pressure offset] | — |
| Linearity | 1% typical | — |
| Tensão de alimentação | 10 V DC typical | 10 V typical (ratiometric) |
| Corrente de alimentação | [DATA_NEEDED: supply current] | — |
| Tipo de saída | Analog mV (Wheatstone Bridge) | Wheatstone Bridge (analog voltage, ratiometric) |
| Temperatura de operação | 0C to +85C (compensated) | [DATA_NEEDED: operating temperature range] |
| Storage Temperature | [DATA_NEEDED: storage temperature] | — |
| Port Configuration | Dual port, axial tube, 4.93 mm (0.19 in) | — |
| Encapsulamento / Caixa | 4-SIP Module (Case 344C-01) | — |
| Tipo de montagem | Through-Hole | Through-Hole |
| Technology | Silicon piezoresistive, on-chip temperature compensation | Silicon piezoresistive, MEMS |
| Status RoHS | Compliant | unknown |
| Nível MSL | [DATA_NEEDED: MSL rating] | — |
| Maximum Overpressure | — | 58.02 psi (400 kPa) |
| Full-Scale Span | — | 40 mV typical at 10 V supply |
| Offset | — | 0 mV minimum at 0 kPa |
| Maximum Operating Current | — | 6 mA |
| Port Size | — | Male 0.19 in (4.93 mm) barbed tube |
| Port Style | — | Barbed |
| Encapsulamento | — | 4-SIP Module (Unibody through-hole) |
| Temperature Compensation | — | On-chip, calibrated |
| Termination Style | — | PCB (SIP pins) |