MPX5010DP vs MPX5500DP Vergleich
Detaillierter Direktvergleich von MPX5010DP von NXP Semiconductors und MPX5500DP von STMicroelectronics. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
STMicroelectronics
MPX5500DP - 500kPa Differential Pressure Sensor | STMicroelectronics
MPX5500DP ✓ AktivSpezifikationsvergleich
| Parameter | MPX5010DP | MPX5500DP |
|---|---|---|
| Marke | NXP Semiconductors | STMicroelectronics |
| Kategorie | Pressure Sensors | Pressure Sensors |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $9,60 | $4,86 |
| Pressure Type | Differential | Differential (Dual Port) |
| Operating Pressure Range | 0 kPa to 10 kPa (0 to 1.45 PSI) | — |
| Maximum Overload Pressure | [DATA_NEEDED: max overload kPa] | — |
| Sensitivity | 450 mV/kPa (typical) | — |
| Ausgangsspannungsbereich | 0.2 V to 4.7 V | 0.2 V to 4.7 V |
| Versorgungsspannung | 4.75 V to 5.25 V (5 V typical) | 5 V (typical) |
| Versorgungsstrom | [DATA_NEEDED: supply current mA] | [DATA_NEEDED: supply current] |
| Linearity | ±1.5% VFSS (typical, 0-85 C) | — |
| Betriebstemperatur | 0 C to +85 C (compensated) | -40C to +125C (per ST datasheet family) |
| Storage Temperature | [DATA_NEEDED: storage temperature C] | — |
| Port Configuration | Dual axial ports, 4.93 mm (0.19 in) tube | — |
| Gehäuse | 6-SIP Module | 6-SIP Module |
| Ausgangstyp | Analog, ratiometric | Analog Voltage |
| Montageart | Through-hole (SIP) | Through-Hole (SIP) |
| Technology | Piezoresistive, monolithic silicon, on-chip signal conditioned | Piezoresistive, Monolithic Silicon |
| RoHS-Status | Compliant | Compliant (per ST/NXP product pages) |
| Operating Pressure Max | — | 500 kPa (72.52 PSI) |
| Operating Pressure Min | — | 0 kPa |
| Accuracy | — | [DATA_NEEDED: accuracy %FS] |
| Compensated Temperature | — | 0 C to 85 C |
| Port Size | — | Male 0.19" (4.93 mm) Tube, Dual |
| Package Dimensions | — | 17.78 mm x 29.48 mm x 10.67 mm |
| Lead Pitch | — | 2.54 mm |
| Signal Conditioning | — | On-chip, Temperature Compensated |