MPX5010GP vs MPVZ5010GW7U Vergleich
Detaillierter Direktvergleich von MPX5010GP von NXP Semiconductors und MPVZ5010GW7U von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | MPX5010GP | MPVZ5010GW7U |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Pressure Sensors | Pressure Sensors |
| Lebenszyklusstatus | NRND | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $10,85 | $8,95 |
| Pressure Type | Vented Gauge | Vented Gauge |
| Operating Pressure Range | 0 kPa to 10 kPa (0 to 1.45 PSI) | 0 kPa to 10 kPa (0 to 1.45 PSI) |
| Maximum Overload Pressure | [DATA_NEEDED: maximum overload pressure] | — |
| Versorgungsspannung | 4.75 V to 5.25 V (typical 5 V) | 4.75 V to 5.25 V |
| Versorgungsstrom | [DATA_NEEDED: supply current] | [DATA_NEEDED: supply current] |
| Ausgangstyp | Analog, ratiometric | Analog voltage, ratiometric |
| Ausgangsspannungsbereich | 0.2 V to 4.7 V | 0.2 V to 4.7 V |
| Full-Scale Span | 4.5 V (typical) | 4.5 V (nominal) |
| Zero Pressure Offset | 0.2 V typical at VS = 5 V | — |
| Accuracy | ±1.5% (per datasheet, factory calibrated) | ±1.5% (typical, full-scale, 0°C to 85°C) |
| Betriebstemperatur | [DATA_NEEDED: operating temperature range] | — |
| Compensated Temperature | 0 °C to 85 °C | — |
| Port Configuration | Male 0.19" (4.93 mm) tube, single vented port | — |
| Gehäuse | 6-SIP module (Unibody) | — |
| Technology | Piezoresistive MEMS with on-chip ASIC | — |
| Montageart | Through-Hole | Through-Hole (vertical SIP) |
| RoHS-Status | [DATA_NEEDED: RoHS compliance status] | Compliant |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Response Time | — | 1.0 ms (typical) |
| Betriebstemperaturbereich | — | 0°C to +85°C |
| Storage Temperature Range | — | [DATA_NEEDED: storage temperature] |
| Port Type | — | Top tube port, 0.22" (5.59 mm) |
| Gehäuse / Bauform | — | 8-DIP Module (SOP-8 with port) |
| Signal Conditioning | — | On-chip, temperature-compensated, laser-trimmed calibration |
| MSL-Level | — | [DATA_NEEDED: MSL] |