MPX5010GP vs MPX5010GSX Vergleich
Detaillierter Direktvergleich von MPX5010GP von NXP Semiconductors und MPX5010GSX von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | MPX5010GP | MPX5010GSX |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Pressure Sensors | Pressure Sensors |
| Lebenszyklusstatus | NRND | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $10,85 | $10,25 |
| Pressure Type | Vented Gauge | Vented Gauge |
| Operating Pressure Range | 0 kPa to 10 kPa (0 to 1.45 PSI) | 0 kPa to 10 kPa (0 to 1.45 PSI) |
| Maximum Overload Pressure | [DATA_NEEDED: maximum overload pressure] | [DATA_NEEDED: maximum overload pressure] |
| Versorgungsspannung | 4.75 V to 5.25 V (typical 5 V) | — |
| Versorgungsstrom | [DATA_NEEDED: supply current] | [DATA_NEEDED: supply current typical] |
| Ausgangstyp | Analog, ratiometric | Analog Voltage |
| Ausgangsspannungsbereich | 0.2 V to 4.7 V | — |
| Full-Scale Span | 4.5 V (typical) | — |
| Zero Pressure Offset | 0.2 V typical at VS = 5 V | — |
| Accuracy | ±1.5% (per datasheet, factory calibrated) | 1.0 % typical (per datasheet) |
| Betriebstemperatur | [DATA_NEEDED: operating temperature range] | 0 C to 85 C |
| Compensated Temperature | 0 °C to 85 °C | — |
| Port Configuration | Male 0.19" (4.93 mm) tube, single vented port | — |
| Gehäuse | 6-SIP module (Unibody) | — |
| Technology | Piezoresistive MEMS with on-chip ASIC | Piezoresistive MEMS with on-chip ASIC |
| Montageart | Through-Hole | Through Hole |
| RoHS-Status | [DATA_NEEDED: RoHS compliance status] | Compliant |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Output Voltage Span | — | 0.2 V to 4.7 V |
| Supply Voltage (VCC) | — | 4.5 V to 5.5 V |
| Response Time | — | [DATA_NEEDED: response time] |
| Port Size | — | Male 0.19 inch (4.93 mm) Tube, Side Port |
| Gehäuse / Bauform | — | 6-SIP Module (Case 867F) |
| Termination Style | — | Through-Hole PCB |
| Media Compatibility | — | Dry gases (air, non-corrosive) |