MPX5010GS vs MPX5010GSX Vergleich

Detaillierter Direktvergleich von MPX5010GS von NXP Semiconductors und MPX5010GSX von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
MPX5010GS MPX5010GS - 10kPa Gauge Pressure Sensor, 5V, 6-SIP | NXP

MPX5010GS - 10kPa Gauge Pressure Sensor, 5V, 6-SIP | NXP

MPX5010GS ✓ Aktiv
NXP Semiconductors
MPX5010GSX MPX5010GSX - 10kPa Integrated Pressure Sensor 6-SIP | NXP

MPX5010GSX - 10kPa Integrated Pressure Sensor 6-SIP | NXP

MPX5010GSX ✓ Aktiv

Spezifikationsvergleich

Parameter MPX5010GS MPX5010GSX
Marke NXP Semiconductors NXP Semiconductors
Kategorie Pressure Sensors Pressure Sensors
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $10,85 $10,25
Pressure Type Vented Gauge Vented Gauge
Operating Pressure Range 0 kPa to 10 kPa (0 to 1.45 PSI) 0 kPa to 10 kPa (0 to 1.45 PSI)
Maximum Overpressure [DATA_NEEDED: maximum overpressure rating] —
Betriebsversorgungsspannung 4.75 V to 5.25 V (5 V typical) —
Versorgungsstrom 5 mA typical [DATA_NEEDED: supply current typical]
Ausgangsspannungsbereich 0.2 V to 4.7 V at 5 V supply —
Accuracy +/-2.5% of full-scale span 1.0 % typical (per datasheet)
Response Time 1.0 ms typical [DATA_NEEDED: response time]
Betriebstemperatur 0 C to +85 C (compensated) 0 C to 85 C
Storage Temperature -40 C to +125 C —
Ausgangstyp Analog, ratiometric Analog Voltage
Port Type Male 0.19" (4.93 mm) tube, axial —
Gehäuse 6-SIP Module, Case 867E-03 —
Sensing Technology Piezoresistive (silicon strain gauge) —
Montageart Through-hole, axial tube Through Hole
RoHS-Status [DATA_NEEDED: RoHS status] Compliant
Maximum Overload Pressure — [DATA_NEEDED: maximum overload pressure]
Output Voltage Span — 0.2 V to 4.7 V
Supply Voltage (VCC) — 4.5 V to 5.5 V
Port Size — Male 0.19 inch (4.93 mm) Tube, Side Port
Gehäuse / Bauform — 6-SIP Module (Case 867F)
Termination Style — Through-Hole PCB
Media Compatibility — Dry gases (air, non-corrosive)
Technology — Piezoresistive MEMS with on-chip ASIC

Datenblätter & Ressourcen

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