MPXC2011DT1 vs MPXC2012DT1 Vergleich

Detaillierter Direktvergleich von MPXC2011DT1 von NXP Semiconductors und MPXC2012DT1 von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
MPXC2011DT1 MPXC2011DT1 - 10kPa Differential Pressure Sensor 4-SSIP | NXP

MPXC2011DT1 - 10kPa Differential Pressure Sensor 4-SSIP | NXP

MPXC2011DT1 ✓ Aktiv

Spezifikationsvergleich

Parameter MPXC2011DT1 MPXC2012DT1
Marke NXP Semiconductors NXP Semiconductors
Kategorie Pressure Sensors Pressure Sensors
Lebenszyklusstatus Aktiv NRND
Lagerstatus In Stock In Stock
Stückpreis (USD) $14,95 $7,40
Pressure Type Differential Differential
Operating Pressure Range 0 kPa to 10 kPa (0 PSI to 1.45 PSI) —
Full-Scale Output 25 mV typical at 10 V excitation 24 mV to 26 mV (typ. 25 mV) at 10 V excitation
Sensitivity 2.5 mV/kPa typical —
Excitation Voltage 3 V DC to 10 V DC (10 V nominal) 10 V DC typical
Ausgangstyp Analog Wheatstone bridge (ratiometric) Wheatstone Bridge (analog mV)
Gehäuse 4-SSIP Chip Pak module, side port —
Port Style Female, 3.25 mm (0.128 in) barbed side port Side port, single barbed inlet
Termination Style Through-hole PCB, 4 leads Through-hole PCB (vertical mount)
Betriebstemperatur 0 °C to +85 °C [DATA_NEEDED: operating temperature range]
Compensation On-chip temperature compensated and calibrated —
Technology Piezoresistive silicon strain gauge —
Module Dimensions 7.6 mm x 12.8 mm nominal —
Montageart Through-hole (PCB mount with side-port tubing) Through-hole, vertical
RoHS-Status [DATA_NEEDED: RoHS status not in web data] [DATA_NEEDED: RoHS compliance status]
Operating Pressure — 1.45 PSI (10 kPa)
Maximum Over Pressure — [DATA_NEEDED: maximum overpressure rating]
Offset (Null) — 0 mV nominal at 10 V excitation
Bridge Resistance — [DATA_NEEDED: input/output bridge resistance]
Linearity — [DATA_NEEDED: linearity %FS]
Pressure Port Size — Female, 0.128 in (3.25 mm) side port
Gehäuse / Bauform — 4-SSIP Module (chip-pak, no gel)
Gel Protection — No (bare die in chip-pak cavity)
Storage Temperature — [DATA_NEEDED: storage temperature range]
MSL-Level — Not applicable (through-hole sensor module)
Manufacturer — NXP Semiconductors (formerly Freescale / Motorola)

Datenblätter & Ressourcen

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