MPXC2011DT1 vs MPXC2012DT1 Comparação

Comparação detalhada lado a lado de MPXC2011DT1 por NXP Semiconductors e MPXC2012DT1 por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.

NXP Semiconductors
MPXC2011DT1 MPXC2011DT1 - 10kPa Differential Pressure Sensor 4-SSIP | NXP

MPXC2011DT1 - 10kPa Differential Pressure Sensor 4-SSIP | NXP

MPXC2011DT1 ✓ Ativo

Comparação de especificações

Parâmetro MPXC2011DT1 MPXC2012DT1
Marca NXP Semiconductors NXP Semiconductors
Categoria Pressure Sensors Pressure Sensors
Status do ciclo de vida Ativo NRND
Status do estoque In Stock In Stock
Preço unitário (USD) $14,95 $7,40
Pressure Type Differential Differential
Operating Pressure Range 0 kPa to 10 kPa (0 PSI to 1.45 PSI) —
Full-Scale Output 25 mV typical at 10 V excitation 24 mV to 26 mV (typ. 25 mV) at 10 V excitation
Sensitivity 2.5 mV/kPa typical —
Excitation Voltage 3 V DC to 10 V DC (10 V nominal) 10 V DC typical
Tipo de saída Analog Wheatstone bridge (ratiometric) Wheatstone Bridge (analog mV)
Encapsulamento 4-SSIP Chip Pak module, side port —
Port Style Female, 3.25 mm (0.128 in) barbed side port Side port, single barbed inlet
Termination Style Through-hole PCB, 4 leads Through-hole PCB (vertical mount)
Temperatura de operação 0 °C to +85 °C [DATA_NEEDED: operating temperature range]
Compensation On-chip temperature compensated and calibrated —
Technology Piezoresistive silicon strain gauge —
Module Dimensions 7.6 mm x 12.8 mm nominal —
Tipo de montagem Through-hole (PCB mount with side-port tubing) Through-hole, vertical
Status RoHS [DATA_NEEDED: RoHS status not in web data] [DATA_NEEDED: RoHS compliance status]
Operating Pressure — 1.45 PSI (10 kPa)
Maximum Over Pressure — [DATA_NEEDED: maximum overpressure rating]
Offset (Null) — 0 mV nominal at 10 V excitation
Bridge Resistance — [DATA_NEEDED: input/output bridge resistance]
Linearity — [DATA_NEEDED: linearity %FS]
Pressure Port Size — Female, 0.128 in (3.25 mm) side port
Encapsulamento / Caixa — 4-SSIP Module (chip-pak, no gel)
Gel Protection — No (bare die in chip-pak cavity)
Storage Temperature — [DATA_NEEDED: storage temperature range]
Nível MSL — Not applicable (through-hole sensor module)
Manufacturer — NXP Semiconductors (formerly Freescale / Motorola)

Fichas técnicas e recursos

Ver todos os produtos Criar BOM Solicitar cotação