MPXM2010D vs MPXM2010GS Vergleich

Detaillierter Direktvergleich von MPXM2010D von NXP Semiconductors und MPXM2010GS von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
MPXM2010D MPXM2010D - 10kPa Differential Pressure Sensor | NXP

MPXM2010D - 10kPa Differential Pressure Sensor | NXP

MPXM2010D ✓ Aktiv
NXP Semiconductors
MPXM2010GS MPXM2010GS - 10kPa Vented Gauge Pressure Sensor | NXP/STMicro

MPXM2010GS - 10kPa Vented Gauge Pressure Sensor | NXP/STMicro

MPXM2010GS ✓ Aktiv

Spezifikationsvergleich

Parameter MPXM2010D MPXM2010GS
Marke NXP Semiconductors NXP Semiconductors
Kategorie Pressure Sensors Pressure Sensors
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $4,44 $5,62
Pressure Type Differential Vented Gauge
Operating Pressure 1.45 PSI (10 kPa) —
Accuracy ±1% —
Ausgangstyp Wheatstone Bridge Wheatstone Bridge (analog, differential mV)
Ausgangsspannung 0 mV to 25 mV at 10 V supply —
Versorgungsspannung 10 V to 16 V —
Betriebstemperatur -40 °C to +125 °C -40 °C to +125 °C
Temperature Compensation Range 0 °C to +85 °C —
Gehäuse / Bauform 5-SMD Module —
Montageart Surface Mount (PCB) Surface Mount
Termination Style PCB —
Family Name MPXM2010D (MPX2010 series) —
Technology Piezoresistive silicon, on-chip calibrated —
Port Configuration Dual vertical-port tubing (modular 'M') Top port, male 0.12" (2.97 mm) tube
RoHS-Status [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS status]
Operating Pressure Range — 0 kPa to 10 kPa (0 to 1.45 PSI)
Maximum Overload Pressure — [DATA_NEEDED: max overload pressure]
Output Voltage Span — 0 mV to 25 mV at 10 V excitation
Sensitivity — 2.5 mV/kPa (nominal at 10 V)
Excitation Voltage — 10 V (max 16 V per NXP datasheet)
Versorgungsstrom — 6 mA (typical at 10 V excitation)
Storage Temperature — [DATA_NEEDED: storage temperature]
Linearity — [DATA_NEEDED: linearity %]
Temperature Compensation — On-chip (laser-trimmed thin-film)
Gehäuse — 5-SMD Module, top port
Packing — Reel-Reel 13" Q2 NDP
Min Package Quantity — 400
Min Order Quantity — 400

Datenblätter & Ressourcen

Alle Produkte durchsuchen BOM erstellen Angebot anfordern