MPXV5010GC6T1 vs MPX5010GSX Vergleich
Detaillierter Direktvergleich von MPXV5010GC6T1 von NXP Semiconductors und MPX5010GSX von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | MPXV5010GC6T1 | MPX5010GSX |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Pressure Sensors | Pressure Sensors |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $6,85 | $10,25 |
| Manufacturer | NXP Semiconductors | — |
| Pressure Type | Vented Gauge | Vented Gauge |
| Operating Pressure Range | 0 kPa to 10 kPa (0 PSI to 1.45 PSI) | 0 kPa to 10 kPa (0 to 1.45 PSI) |
| Maximum Overload Pressure | [DATA_NEEDED: max overload pressure] | [DATA_NEEDED: maximum overload pressure] |
| Ausgangstyp | Analog Voltage, Ratiometric | Analog Voltage |
| Ausgangsspannungsbereich | 0.2 V to 4.7 V (at VCC = 5 V) | — |
| Supply Voltage (VCC) | 4.75 V to 5.25 V | 4.5 V to 5.5 V |
| Versorgungsstrom | [DATA_NEEDED: typical supply current] | [DATA_NEEDED: supply current typical] |
| Pressure Port | Top-port male 0.13" (3.17 mm) tube | — |
| Gehäuse | 8-SO (Small Outline), Gull-Wing SMD | — |
| Montageart | Surface Mount | Through Hole |
| Betriebstemperatur | 0 C to +85 C | 0 C to 85 C |
| Storage Temperature | [DATA_NEEDED: storage temperature range] | — |
| Linearity | 1.0 % typical (over 0 kPa to 10 kPa) | — |
| Temperature Compensation | On-chip, 0 C to +85 C | — |
| Signal Conditioning | On-chip ASIC, calibrated | — |
| Media Compatibility | Air and non-corrosive gases | Dry gases (air, non-corrosive) |
| RoHS-Status | Compliant | Compliant |
| Output Voltage Span | — | 0.2 V to 4.7 V |
| Accuracy | — | 1.0 % typical (per datasheet) |
| Response Time | — | [DATA_NEEDED: response time] |
| Port Size | — | Male 0.19 inch (4.93 mm) Tube, Side Port |
| Gehäuse / Bauform | — | 6-SIP Module (Case 867F) |
| Termination Style | — | Through-Hole PCB |
| Technology | — | Piezoresistive MEMS with on-chip ASIC |