MPXV5010GC6T1 vs MPX5010GSX Comparação
Comparação detalhada lado a lado de MPXV5010GC6T1 por NXP Semiconductors e MPX5010GSX por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Comparação de especificações
| Parâmetro | MPXV5010GC6T1 | MPX5010GSX |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoria | Pressure Sensors | Pressure Sensors |
| Status do ciclo de vida | Ativo | Ativo |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $6,85 | $10,25 |
| Manufacturer | NXP Semiconductors | — |
| Pressure Type | Vented Gauge | Vented Gauge |
| Operating Pressure Range | 0 kPa to 10 kPa (0 PSI to 1.45 PSI) | 0 kPa to 10 kPa (0 to 1.45 PSI) |
| Maximum Overload Pressure | [DATA_NEEDED: max overload pressure] | [DATA_NEEDED: maximum overload pressure] |
| Tipo de saída | Analog Voltage, Ratiometric | Analog Voltage |
| Faixa de tensão de saída | 0.2 V to 4.7 V (at VCC = 5 V) | — |
| Supply Voltage (VCC) | 4.75 V to 5.25 V | 4.5 V to 5.5 V |
| Corrente de alimentação | [DATA_NEEDED: typical supply current] | [DATA_NEEDED: supply current typical] |
| Pressure Port | Top-port male 0.13" (3.17 mm) tube | — |
| Encapsulamento | 8-SO (Small Outline), Gull-Wing SMD | — |
| Tipo de montagem | Surface Mount | Through Hole |
| Temperatura de operação | 0 C to +85 C | 0 C to 85 C |
| Storage Temperature | [DATA_NEEDED: storage temperature range] | — |
| Linearity | 1.0 % typical (over 0 kPa to 10 kPa) | — |
| Temperature Compensation | On-chip, 0 C to +85 C | — |
| Signal Conditioning | On-chip ASIC, calibrated | — |
| Media Compatibility | Air and non-corrosive gases | Dry gases (air, non-corrosive) |
| Status RoHS | Compliant | Compliant |
| Output Voltage Span | — | 0.2 V to 4.7 V |
| Accuracy | — | 1.0 % typical (per datasheet) |
| Response Time | — | [DATA_NEEDED: response time] |
| Port Size | — | Male 0.19 inch (4.93 mm) Tube, Side Port |
| Encapsulamento / Caixa | — | 6-SIP Module (Case 867F) |
| Termination Style | — | Through-Hole PCB |
| Technology | — | Piezoresistive MEMS with on-chip ASIC |