MSC8156TVT1000B vs MSC8157ESVT1000A Vergleich
Detaillierter Direktvergleich von MSC8156TVT1000B von NXP Semiconductors und MSC8157ESVT1000A von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MSC8156TVT1000B - Six-Core 1 GHz StarCore DSP, 783-FCBGA | NXP
MSC8156TVT1000B ObsoleteNXP Semiconductors
MSC8157ESVT1000A - 6-Core SC3850 DSP 1GHz FCBGA-783 | NXP
MSC8157ESVT1000A ObsoleteSpezifikationsvergleich
| Parameter | MSC8156TVT1000B | MSC8157ESVT1000A |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | DSP | DSP |
| Lebenszyklusstatus | Obsolete | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $182,30 | $152,80 |
| Manufacturer | NXP Semiconductors (formerly Freescale) | — |
| Part Status | Obsolete | — |
| Type | SC3850 Six-Core Digital Signal Processor | — |
| Series | StarCore | — |
| Clock Rate | 1 GHz | — |
| Number of Cores | 6 x SC3850 DSP subsystems | — |
| L1 Instruction Cache (per core) | 32 KB | 32 KB |
| L1 Data Cache (per core) | 32 KB | 32 KB |
| Unified L2 Cache | 512 KB (configurable partition) | — |
| On-Chip RAM | 576 KB | — |
| Non-Volatile Memory (ROM) | 96 KB | — |
| Core Voltage | 1.00 V | — |
| I/O Voltage | 2.50 V | — |
| Interfaces | Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART | — |
| Gehäuse / Bauform | 783-BBGA, FCBGA (29x29 mm) | — |
| Packaging | Tray | — |
| Montageart | Surface Mount | Surface Mount (FCBGA) |
| Operating Temperature Grade | Industrial | — |
| SVHC | Exceeds threshold (per Freescale datasheet) | — |
| ECCN (US) | 3A991 | — |
| HTS Code | 8542.31.00.01 | — |
| Product Type | — | Multi-core Digital Signal Processor (DSP) |
| DSP Core Architecture | — | StarCore SC3850 (Six cores) |
| Core Clock Speed | — | 1 GHz |
| Performance | — | 1000 MIPS per core / 6000 MIPS aggregate |
| Datenbusbreite | — | 32-Bit / 64-Bit |
| Package Type | — | FCBGA-783 (Flip-Chip BGA, 29x29 mm) |
| Pin/Ball Count | — | 783 |
| Versorgungsspannung | — | 1.0 V core (typical) |
| Betriebstemperatur | — | 0C to +105C |
| Process Technology | — | CMOS |
| Lead-Free / RoHS | — | Yes (lead-free) |
| Moisture Sensitivity Level | — | [DATA_NEEDED: MSL rating] |
| High-Speed Interfaces | — | Serial RapidIO, SGMII, PCI Express, Ethernet, I2C, SPI, UART |
| Memory Controller | — | Multi-channel DDR SDRAM controller |
| Lebenszyklusstatus | — | Obsolete (stock available from authorized distributors) |