MSC8156TVT1000B vs MSC8157ESVT1000A Comparación
Comparación detallada lado a lado de MSC8156TVT1000B por NXP Semiconductors y MSC8157ESVT1000A por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MSC8156TVT1000B - Six-Core 1 GHz StarCore DSP, 783-FCBGA | NXP
MSC8156TVT1000B ObsoleteNXP Semiconductors
MSC8157ESVT1000A - 6-Core SC3850 DSP 1GHz FCBGA-783 | NXP
MSC8157ESVT1000A ObsoleteComparación de especificaciones
| Parámetro | MSC8156TVT1000B | MSC8157ESVT1000A |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | DSP | DSP |
| Estado del ciclo de vida | Obsolete | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $182,30 | $152,80 |
| Manufacturer | NXP Semiconductors (formerly Freescale) | — |
| Part Status | Obsolete | — |
| Type | SC3850 Six-Core Digital Signal Processor | — |
| Series | StarCore | — |
| Clock Rate | 1 GHz | — |
| Number of Cores | 6 x SC3850 DSP subsystems | — |
| L1 Instruction Cache (per core) | 32 KB | 32 KB |
| L1 Data Cache (per core) | 32 KB | 32 KB |
| Unified L2 Cache | 512 KB (configurable partition) | — |
| On-Chip RAM | 576 KB | — |
| Non-Volatile Memory (ROM) | 96 KB | — |
| Core Voltage | 1.00 V | — |
| I/O Voltage | 2.50 V | — |
| Interfaces | Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART | — |
| Encapsulado / Carcasa | 783-BBGA, FCBGA (29x29 mm) | — |
| Packaging | Tray | — |
| Tipo de montaje | Surface Mount | Surface Mount (FCBGA) |
| Operating Temperature Grade | Industrial | — |
| SVHC | Exceeds threshold (per Freescale datasheet) | — |
| ECCN (US) | 3A991 | — |
| HTS Code | 8542.31.00.01 | — |
| Product Type | — | Multi-core Digital Signal Processor (DSP) |
| DSP Core Architecture | — | StarCore SC3850 (Six cores) |
| Core Clock Speed | — | 1 GHz |
| Performance | — | 1000 MIPS per core / 6000 MIPS aggregate |
| Ancho del bus de datos | — | 32-Bit / 64-Bit |
| Package Type | — | FCBGA-783 (Flip-Chip BGA, 29x29 mm) |
| Pin/Ball Count | — | 783 |
| Tensión de alimentación | — | 1.0 V core (typical) |
| Temperatura de funcionamiento | — | 0C to +105C |
| Process Technology | — | CMOS |
| Lead-Free / RoHS | — | Yes (lead-free) |
| Moisture Sensitivity Level | — | [DATA_NEEDED: MSL rating] |
| High-Speed Interfaces | — | Serial RapidIO, SGMII, PCI Express, Ethernet, I2C, SPI, UART |
| Memory Controller | — | Multi-channel DDR SDRAM controller |
| Estado del ciclo de vida | — | Obsolete (stock available from authorized distributors) |