OSD3358-512M-BAS-XB vs OSD3358-512M-ISM Vergleich

Detaillierter Direktvergleich von OSD3358-512M-BAS-XB von Octavo Systems und OSD3358-512M-ISM von Octavo Systems. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Octavo Systems
OSD3358-512M-BAS-XB OSD3358-512M-BAS-XB - SiP ARM Cortex-A8 1GHz | Octavo Systems

OSD3358-512M-BAS-XB - SiP ARM Cortex-A8 1GHz | Octavo Systems

OSD3358-512M-BAS-XB ✓ Aktiv

Spezifikationsvergleich

Parameter OSD3358-512M-BAS-XB OSD3358-512M-ISM
Marke Octavo Systems Octavo Systems
Kategorie Microcontrollers Wireless Modules
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $67,20 $46,80
Device Type System-In-Package (SiP) —
Integrated Processor TI Sitara AM3358 ARM Cortex-A8 —
Maximum CPU Clock 1 GHz —
Graphics Accelerator SGX530 —
Onboard DDR3 SDRAM 512 MB —
Power Management IC TPS65217C (integrated) —
Betriebstemperaturbereich -40 C to +85 C (industrial) —
Gehäuse 400-ball BGA 256-ball BGA, 21 mm x 21 mm
Montageart Surface Mount Surface Mount (BGA)
PRU-ICSS Subsystems 2 (industrial-grade) —
Ethernet 10/100/1000 Mbps (Gigabit) —
USB USB 2.0 High-Speed PHY —
CAN 2x CAN 2.0B —
SPI 2x SPI —
I2C 3x I2C —
RoHS-Status Compliant Compliant
Product Type — System-in-Package (SiP) / System-on-Module (SOM)
Series — OSD3358
Core Processor — Texas Instruments AM3358 ARM Cortex-A8 NEON SIMD
CPU Speed — 1 GHz
RAM Size — 512 MB DDR3
PMIC — TPS65217C
Auxiliary LDO — TL5209
EEPROM — 4 KB
Form Factor — SiP (System-in-Package)
Ball Pitch — [DATA_NEEDED: ball pitch]
Betriebstemperatur — -40C to +85C (industrial)
Versorgungsspannung — [DATA_NEEDED: main rail voltage]
MSL-Level — [DATA_NEEDED: MSL rating]
Lead-Free — Yes
Tray Quantity — [DATA_NEEDED: tray qty]

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