OSD3358-512M-BSM vs OSD3358-512M-ISM Vergleich
Detaillierter Direktvergleich von OSD3358-512M-BSM von Octavo Systems und OSD3358-512M-ISM von Octavo Systems. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Octavo Systems
OSD3358-512M-BSM - ARM Cortex-A8 SiP, 1GHz, 512MB DDR3 | Octavo
OSD3358-512M-BSM ✓ AktivOctavo Systems
OSD3358-512M-ISM - 1GHz Cortex-A8 SiP SOM, 512MB DDR3 | Octavo Systems
OSD3358-512M-ISM ✓ AktivSpezifikationsvergleich
| Parameter | OSD3358-512M-BSM | OSD3358-512M-ISM |
|---|---|---|
| Marke | Octavo Systems | Octavo Systems |
| Kategorie | Microcontrollers | Wireless Modules |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $30,95 | $46,80 |
| Module Type | System-in-Package (SiP) with AM3358 + DDR3 + PMIC | — |
| Processor Core | Texas Instruments Sitara AM3358 ARM Cortex-A8 32-bit | — |
| Maximum CPU Clock | 1 GHz (with NEON SIMD and FPU) | — |
| Graphics Accelerator | PowerVR SGX530 3D GPU | — |
| System Memory | 512 MB 32-bit DDR3 (on-package) | — |
| Memory Bus Width | 32-bit + ECC option | — |
| Peripheral Co-Processors | 2x PRU-ICSS (Programmable Real-time Unit) | — |
| Ethernet | 2x 10/100/1000 industrial Ethernet MAC (MII/RGMii) | — |
| USB | 1x USB 2.0 HS Host + 1x USB 2.0 HS Dual-Role | — |
| Other Interfaces | 4x UART, 2x I2C, 2x SPI, 2x McASP, McSPI, CAN, ADC | — |
| Gehäuse | 256-ball BGA 21x21 mm, 1.27 mm pitch | 256-ball BGA, 21 mm x 21 mm |
| Betriebstemperatur | 0 C to +70 C (commercial, BSM grade) | -40C to +85C (industrial) |
| Operating Voltage | 5 V single rail via on-board PMIC | — |
| RoHS-Status | Compliant | Compliant |
| Montageart | Surface Mount (BGA reflow) | Surface Mount (BGA) |
| Product Type | — | System-in-Package (SiP) / System-on-Module (SOM) |
| Series | — | OSD3358 |
| Core Processor | — | Texas Instruments AM3358 ARM Cortex-A8 NEON SIMD |
| CPU Speed | — | 1 GHz |
| RAM Size | — | 512 MB DDR3 |
| PMIC | — | TPS65217C |
| Auxiliary LDO | — | TL5209 |
| EEPROM | — | 4 KB |
| Form Factor | — | SiP (System-in-Package) |
| Ball Pitch | — | [DATA_NEEDED: ball pitch] |
| Versorgungsspannung | — | [DATA_NEEDED: main rail voltage] |
| MSL-Level | — | [DATA_NEEDED: MSL rating] |
| Lead-Free | — | Yes |
| Tray Quantity | — | [DATA_NEEDED: tray qty] |