OSD3358-512M-BSM vs OSD3358-512M-ISM 对比

详细并排对比 OSD3358-512M-BSM 出自 Octavo Systems 和 OSD3358-512M-ISM 出自 Octavo Systems。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Octavo Systems
OSD3358-512M-BSM OSD3358-512M-BSM - ARM Cortex-A8 SiP, 1GHz, 512MB DDR3 | Octavo

OSD3358-512M-BSM - ARM Cortex-A8 SiP, 1GHz, 512MB DDR3 | Octavo

OSD3358-512M-BSM ✓ 量产中
Octavo Systems
OSD3358-512M-ISM OSD3358-512M-ISM - 1GHz Cortex-A8 SiP SOM, 512MB DDR3 | Octavo Systems

OSD3358-512M-ISM - 1GHz Cortex-A8 SiP SOM, 512MB DDR3 | Octavo Systems

OSD3358-512M-ISM ✓ 量产中

规格对比

参数 OSD3358-512M-BSM OSD3358-512M-ISM
品牌 Octavo Systems Octavo Systems
分类 Microcontrollers Wireless Modules
生命周期状态 有效 有效
库存状态 有库存 有库存
单价(USD) $30.95 $46.80
Module Type System-in-Package (SiP) with AM3358 + DDR3 + PMIC —
Processor Core Texas Instruments Sitara AM3358 ARM Cortex-A8 32-bit —
Maximum CPU Clock 1 GHz (with NEON SIMD and FPU) —
Graphics Accelerator PowerVR SGX530 3D GPU —
System Memory 512 MB 32-bit DDR3 (on-package) —
Memory Bus Width 32-bit + ECC option —
Peripheral Co-Processors 2x PRU-ICSS (Programmable Real-time Unit) —
Ethernet 2x 10/100/1000 industrial Ethernet MAC (MII/RGMii) —
USB 1x USB 2.0 HS Host + 1x USB 2.0 HS Dual-Role —
Other Interfaces 4x UART, 2x I2C, 2x SPI, 2x McASP, McSPI, CAN, ADC —
封装 256-ball BGA 21x21 mm, 1.27 mm pitch 256-ball BGA, 21 mm x 21 mm
工作温度 0 C to +70 C (commercial, BSM grade) -40C to +85C (industrial)
Operating Voltage 5 V single rail via on-board PMIC —
RoHS 状态 Compliant Compliant
安装类型 Surface Mount (BGA reflow) Surface Mount (BGA)
Product Type — System-in-Package (SiP) / System-on-Module (SOM)
Series — OSD3358
Core Processor — Texas Instruments AM3358 ARM Cortex-A8 NEON SIMD
CPU Speed — 1 GHz
RAM Size — 512 MB DDR3
PMIC — TPS65217C
Auxiliary LDO — TL5209
EEPROM — 4 KB
Form Factor — SiP (System-in-Package)
Ball Pitch — [DATA_NEEDED: ball pitch]
电源电压 — [DATA_NEEDED: main rail voltage]
MSL 等级 — [DATA_NEEDED: MSL rating]
Lead-Free — Yes
Tray Quantity — [DATA_NEEDED: tray qty]

数据手册与资源

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