P2010NSE2HFC vs P2020NSE2HFC Vergleich
Detaillierter Direktvergleich von P2010NSE2HFC von NXP Semiconductors und P2020NSE2HFC von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
P2010NSE2HFC - QorIQ P2 800MHz Power Arch SoC | NXP | Networking
P2010NSE2HFC ✗ AbgekündigtNXP Semiconductors
P2020NSE2HFC - QorIQ P2 Dual-Core 1.2GHz SoC | NXP Semiconductors
P2020NSE2HFC ✓ AktivSpezifikationsvergleich
| Parameter | P2010NSE2HFC | P2020NSE2HFC |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Ende des Lebenszyklus | Aktiv |
| Manufacturer | NXP Semiconductors | — |
| Product Family | QorIQ P2 | — |
| Architecture | Power Architecture e500v2 | — |
| Core Count | 1 | — |
| Bit Width | 32-bit | — |
| CPU Frequency | 800 MHz | — |
| Memory Controller | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC |
| Gigabit Ethernet | 3 (10/100/1000 Mbps) | — |
| PCIe Controllers | 3 (PCIe 1.0) | — |
| Serial RapidIO (SRIO) | 2 lanes | — |
| USB | USB 2.0 | USB 2.0 Host/Device |
| Security Accelerator | SEC (DES/3DES/AES/RSA/ECC) | — |
| Process Technology | 45 nm | — |
| Gehäuse | 689-TEPBGA II (31x31 mm) | 689-TEPBGA II 31x31 mm with exposed pad |
| Betriebstemperatur | 0 to 125 C | — |
| Temperature Grade | Commercial (HFC suffix) | — |
| Versorgungsspannung | [DATA_NEEDED: core/IO supply voltage] | [DATA_NEEDED: core voltage] |
| Power Dissipation (typ) | [DATA_NEEDED: typical power at 800 MHz] | — |
| L1 I-Cache / D-Cache | 32 KB / 32 KB | — |
| Montageart | Surface Mount (BGA) | — |
| Lead Free | Yes | — |
| RoHS-Status | Compliant | Compliant |
| Packaging | Tray | — |
| Revision | Rev 2.1 | — |
| Family | — | QorIQ P2 |
| Core Architecture | — | PowerPC e500v2 |
| Number of Cores | — | 2 |
| Datenbusbreite | — | 32-bit |
| Maximum Core Frequency | — | 1.2 GHz |
| Betriebstemperaturbereich | — | 0 °C to +125 °C |
| Co-Processor / Security Engine | — | SEC 3.3 (IPsec/SSL/3GPP) |
| Ethernet Interfaces | — | 10/100/1000 Mbps (RGMII), dual GbE |
| PCI Express | — | PCIe Gen 1.1 x1/x2/x4 controllers |
| Serial RapidIO | — | 2x SRIO ports |
| UART | — | 4x UART |
| I2C / SPI / SDHC | — | Yes (2x I2C, SPI, SDHC) |
| NAND Flash Controller | — | Yes |
| L1 Cache (per core) | — | 32 KB I-cache + 32 KB D-cache |
| L2 Cache (shared) | — | 512 KB |