P2020NSE2HFC vs P2010NSE2HFC Vergleich

Detaillierter Direktvergleich von P2020NSE2HFC von NXP Semiconductors und P2010NSE2HFC von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
P2020NSE2HFC P2020NSE2HFC - QorIQ P2 Dual-Core 1.2GHz SoC | NXP Semiconductors

P2020NSE2HFC - QorIQ P2 Dual-Core 1.2GHz SoC | NXP Semiconductors

P2020NSE2HFC ✓ Aktiv
NXP Semiconductors
P2010NSE2HFC P2010NSE2HFC - QorIQ P2 800MHz Power Arch SoC | NXP | Networking

P2010NSE2HFC - QorIQ P2 800MHz Power Arch SoC | NXP | Networking

P2010NSE2HFC ✗ Abgekündigt

Spezifikationsvergleich

Parameter P2020NSE2HFC P2010NSE2HFC
Marke NXP Semiconductors NXP Semiconductors
Kategorie Microcontrollers Microcontrollers
Lebenszyklusstatus Aktiv Ende des Lebenszyklus
Family QorIQ P2 —
Core Architecture PowerPC e500v2 —
Number of Cores 2 —
Datenbusbreite 32-bit —
Maximum Core Frequency 1.2 GHz —
Betriebstemperaturbereich 0 °C to +125 °C —
Memory Controller DDR2/DDR3 with ECC DDR2/DDR3 with ECC
Co-Processor / Security Engine SEC 3.3 (IPsec/SSL/3GPP) —
Ethernet Interfaces 10/100/1000 Mbps (RGMII), dual GbE —
PCI Express PCIe Gen 1.1 x1/x2/x4 controllers —
Serial RapidIO 2x SRIO ports —
USB USB 2.0 Host/Device USB 2.0
UART 4x UART —
I2C / SPI / SDHC Yes (2x I2C, SPI, SDHC) —
NAND Flash Controller Yes —
L1 Cache (per core) 32 KB I-cache + 32 KB D-cache —
L2 Cache (shared) 512 KB —
Gehäuse 689-TEPBGA II 31x31 mm with exposed pad 689-TEPBGA II (31x31 mm)
Versorgungsspannung [DATA_NEEDED: core voltage] [DATA_NEEDED: core/IO supply voltage]
RoHS-Status Compliant Compliant
Manufacturer — NXP Semiconductors
Product Family — QorIQ P2
Architecture — Power Architecture e500v2
Core Count — 1
Bit Width — 32-bit
CPU Frequency — 800 MHz
Gigabit Ethernet — 3 (10/100/1000 Mbps)
PCIe Controllers — 3 (PCIe 1.0)
Serial RapidIO (SRIO) — 2 lanes
Security Accelerator — SEC (DES/3DES/AES/RSA/ECC)
Process Technology — 45 nm
Betriebstemperatur — 0 to 125 C
Temperature Grade — Commercial (HFC suffix)
Power Dissipation (typ) — [DATA_NEEDED: typical power at 800 MHz]
L1 I-Cache / D-Cache — 32 KB / 32 KB
Montageart — Surface Mount (BGA)
Lead Free — Yes
Packaging — Tray
Revision — Rev 2.1

Datenblätter & Ressourcen

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