RTAX4000SL-CQ352EV vs RTAX2000SL-1CQ352V Vergleich

Detaillierter Direktvergleich von RTAX4000SL-CQ352EV von Microchip Technology und RTAX2000SL-1CQ352V von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Microchip Technology
RTAX4000SL-CQ352EV RTAX4000SL-CQ352EV - 4M Gate Rad-Tolerant FPGA | Microchip

RTAX4000SL-CQ352EV - 4M Gate Rad-Tolerant FPGA | Microchip

RTAX4000SL-CQ352EV ✓ Aktiv
Microchip Technology
RTAX2000SL-1CQ352V RTAX2000SL-1CQ352V - 2M-Gate Rad-Tolerant FPGA | Microchip

RTAX2000SL-1CQ352V - 2M-Gate Rad-Tolerant FPGA | Microchip

RTAX2000SL-1CQ352V ✓ Aktiv

Spezifikationsvergleich

Parameter RTAX4000SL-CQ352EV RTAX2000SL-1CQ352V
Marke Microchip Technology Microchip Technology
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $10.250,00 $2.050,00
Family RTAX-SL (Radiation-Tolerant FPGA) RTAX-S/SL Radiation-Tolerant FPGA
System Gates 4,000,000 —
Logic Cells (ASIC Gates) 40,320 —
Process Technology 0.15 um CMOS antifuse CMOS, antifuse OTP interconnect
Core Supply Voltage 1.5 V 1.5 V (1.425 V to 1.575 V)
Gehäuse 352-pin CQFP (Ceramic Quad Flat Pack) 352-pin ceramic CQFP (CQ352)
Screening Level EV (enhanced spaceflight screening) —
Programming Technology Antifuse (one-time programmable, live at power-up) —
Radiation Tolerance Radiation-tolerant (TID/SEL/SEU per family datasheet) Radiation-tolerant (space flight grade)
Configuration Single-chip, no external boot memory Live at power-up, single chip (antifuse)
I/O Supply Voltage [DATA_NEEDED: I/O bank voltage] [DATA_NEEDED: I/O bank voltage]
Maximum System Frequency [DATA_NEEDED: maximum system frequency] —
Betriebstemperatur [DATA_NEEDED: operating temperature range] [DATA_NEEDED: operating temperature range]
Package Material Hermetic ceramic (JESD-30 S-CQFP-F352) —
Montageart Surface Mount Surface Mount
RoHS-Status [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS status]
Typical Application Space-flight systems, satellites, payload processing —
Equivalent System Gates — 2,000,000
CLB Count — 21,504
Logic Cells — 32,256
Embedded Memory — Embedded SRAM with built-in FIFO control
Clocking — Segmentable clock resources, chip-wide highway routing
Application Domain — Space flight systems
Total Ionizing Dose (TID) — [DATA_NEEDED: TID rating]
MSL-Level — Not applicable (ceramic package)

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