RTAX4000SL-CQ352EV vs RTAX2000SL-1CQ352V Comparación
Comparación detallada lado a lado de RTAX4000SL-CQ352EV por Microchip Technology y RTAX2000SL-1CQ352V por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Microchip Technology
RTAX4000SL-CQ352EV - 4M Gate Rad-Tolerant FPGA | Microchip
RTAX4000SL-CQ352EV ✓ ActivoMicrochip Technology
RTAX2000SL-1CQ352V - 2M-Gate Rad-Tolerant FPGA | Microchip
RTAX2000SL-1CQ352V ✓ ActivoComparación de especificaciones
| Parámetro | RTAX4000SL-CQ352EV | RTAX2000SL-1CQ352V |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $10.250,00 | $2.050,00 |
| Family | RTAX-SL (Radiation-Tolerant FPGA) | RTAX-S/SL Radiation-Tolerant FPGA |
| System Gates | 4,000,000 | — |
| Logic Cells (ASIC Gates) | 40,320 | — |
| Process Technology | 0.15 um CMOS antifuse | CMOS, antifuse OTP interconnect |
| Core Supply Voltage | 1.5 V | 1.5 V (1.425 V to 1.575 V) |
| Encapsulado | 352-pin CQFP (Ceramic Quad Flat Pack) | 352-pin ceramic CQFP (CQ352) |
| Screening Level | EV (enhanced spaceflight screening) | — |
| Programming Technology | Antifuse (one-time programmable, live at power-up) | — |
| Radiation Tolerance | Radiation-tolerant (TID/SEL/SEU per family datasheet) | Radiation-tolerant (space flight grade) |
| Configuration | Single-chip, no external boot memory | Live at power-up, single chip (antifuse) |
| I/O Supply Voltage | [DATA_NEEDED: I/O bank voltage] | [DATA_NEEDED: I/O bank voltage] |
| Maximum System Frequency | [DATA_NEEDED: maximum system frequency] | — |
| Temperatura de funcionamiento | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: operating temperature range] |
| Package Material | Hermetic ceramic (JESD-30 S-CQFP-F352) | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Estado RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Typical Application | Space-flight systems, satellites, payload processing | — |
| Equivalent System Gates | — | 2,000,000 |
| CLB Count | — | 21,504 |
| Logic Cells | — | 32,256 |
| Embedded Memory | — | Embedded SRAM with built-in FIFO control |
| Clocking | — | Segmentable clock resources, chip-wide highway routing |
| Application Domain | — | Space flight systems |
| Total Ionizing Dose (TID) | — | [DATA_NEEDED: TID rating] |
| Nivel MSL | — | Not applicable (ceramic package) |