RTAX4000SL-CQ352EV vs RTAX4000D-CQ352V Vergleich
Detaillierter Direktvergleich von RTAX4000SL-CQ352EV von Microchip Technology und RTAX4000D-CQ352V von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Microchip Technology
RTAX4000SL-CQ352EV - 4M Gate Rad-Tolerant FPGA | Microchip
RTAX4000SL-CQ352EV ✓ AktivMicrochip Technology
RTAX4000D-CQ352V - 4M-Gate Rad-Tolerant FPGA | Microchip Technology
RTAX4000D-CQ352V ✓ AktivSpezifikationsvergleich
| Parameter | RTAX4000SL-CQ352EV | RTAX4000D-CQ352V |
|---|---|---|
| Marke | Microchip Technology | Microchip Technology |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $10.250,00 | $0,00 |
| Family | RTAX-SL (Radiation-Tolerant FPGA) | RTAX-S/SL and RTAX-DSP radiation-tolerant FPGAs |
| System Gates | 4,000,000 | — |
| Logic Cells (ASIC Gates) | 40,320 | — |
| Process Technology | 0.15 um CMOS antifuse | — |
| Core Supply Voltage | 1.5 V | [DATA_NEEDED: core voltage] |
| Gehäuse | 352-pin CQFP (Ceramic Quad Flat Pack) | CQ352 ceramic column grid array |
| Screening Level | EV (enhanced spaceflight screening) | — |
| Programming Technology | Antifuse (one-time programmable, live at power-up) | — |
| Radiation Tolerance | Radiation-tolerant (TID/SEL/SEU per family datasheet) | [DATA_NEEDED: TID and SEE ratings] |
| Configuration | Single-chip, no external boot memory | — |
| I/O Supply Voltage | [DATA_NEEDED: I/O bank voltage] | — |
| Maximum System Frequency | [DATA_NEEDED: maximum system frequency] | — |
| Betriebstemperatur | [DATA_NEEDED: operating temperature range] | — |
| Package Material | Hermetic ceramic (JESD-30 S-CQFP-F352) | — |
| Montageart | Surface Mount | Surface Mount |
| RoHS-Status | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Typical Application | Space-flight systems, satellites, payload processing | — |
| Equivalent System Gates | — | 4,000,000 gates |
| Logic Cells | — | 55,440 |
| CLB Organization | — | 36,960 CLBs |
| Number of User I/Os | — | 166 |
| Technology | — | Digital, CMOS |
| Programmability Type | — | Antifuse (OTP), live at power-up |
| Embedded Memory | — | Embedded SRAM with built-in FIFO control logic |
| Clocking | — | Segmentable clocks, chip-wide highway routing |
| Operating Temperature Min | — | -55 C |
| Operating Temperature Max | — | +125 C |
| Application Domain | — | Space flight systems (radiation-tolerant) |