RTAX4000SL-CQ352EV vs RTAX4000D-CQ352V Comparaison

Comparaison détaillée côte à côte de RTAX4000SL-CQ352EV par Microchip Technology et RTAX4000D-CQ352V par Microchip Technology. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.

Microchip Technology
RTAX4000SL-CQ352EV RTAX4000SL-CQ352EV - 4M Gate Rad-Tolerant FPGA | Microchip

RTAX4000SL-CQ352EV - 4M Gate Rad-Tolerant FPGA | Microchip

RTAX4000SL-CQ352EV ✓ Actif
Microchip Technology
RTAX4000D-CQ352V RTAX4000D-CQ352V - 4M-Gate Rad-Tolerant FPGA | Microchip Technology

RTAX4000D-CQ352V - 4M-Gate Rad-Tolerant FPGA | Microchip Technology

RTAX4000D-CQ352V ✓ Actif

Comparaison des spécifications

Paramètre RTAX4000SL-CQ352EV RTAX4000D-CQ352V
Marque Microchip Technology Microchip Technology
Catégorie FPGA & CPLD FPGA & CPLD
Statut du cycle de vie Actif Actif
Statut du stock In Stock In Stock
Prix unitaire (USD) $10 250,00 $0,00
Family RTAX-SL (Radiation-Tolerant FPGA) RTAX-S/SL and RTAX-DSP radiation-tolerant FPGAs
System Gates 4,000,000 —
Logic Cells (ASIC Gates) 40,320 —
Process Technology 0.15 um CMOS antifuse —
Core Supply Voltage 1.5 V [DATA_NEEDED: core voltage]
Boîtier 352-pin CQFP (Ceramic Quad Flat Pack) CQ352 ceramic column grid array
Screening Level EV (enhanced spaceflight screening) —
Programming Technology Antifuse (one-time programmable, live at power-up) —
Radiation Tolerance Radiation-tolerant (TID/SEL/SEU per family datasheet) [DATA_NEEDED: TID and SEE ratings]
Configuration Single-chip, no external boot memory —
I/O Supply Voltage [DATA_NEEDED: I/O bank voltage] —
Maximum System Frequency [DATA_NEEDED: maximum system frequency] —
Température de fonctionnement [DATA_NEEDED: operating temperature range] —
Package Material Hermetic ceramic (JESD-30 S-CQFP-F352) —
Type de montage Surface Mount Surface Mount
Statut RoHS [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS status]
Typical Application Space-flight systems, satellites, payload processing —
Equivalent System Gates — 4,000,000 gates
Logic Cells — 55,440
CLB Organization — 36,960 CLBs
Number of User I/Os — 166
Technology — Digital, CMOS
Programmability Type — Antifuse (OTP), live at power-up
Embedded Memory — Embedded SRAM with built-in FIFO control logic
Clocking — Segmentable clocks, chip-wide highway routing
Operating Temperature Min — -55 C
Operating Temperature Max — +125 C
Application Domain — Space flight systems (radiation-tolerant)

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