S912XET256J2MAGR vs MC9S12XDT512MAA Vergleich
Detaillierter Direktvergleich von S912XET256J2MAGR von NXP Semiconductors und MC9S12XDT512MAA von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
S912XET256J2MAGR - 16-bit S12X MCU, 256KB Flash, 50MHz | NXP
S912XET256J2MAGR ✓ Aktiv
Spezifikationsvergleich
| Parameter | S912XET256J2MAGR | MC9S12XDT512MAA |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Aktiv | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $10,65 | $0,00 |
| Core | HCS12X (S12X CPU with XGATE coprocessor) | — |
| Datenbusbreite | 16-bit | — |
| Program Memory Size | 256 KB | 512KB (512K x 8) |
| Program Memory Type | Flash | FLASH |
| RAM Size | 16 KB | 20KB |
| Maximale Taktfrequenz | 50 MHz | — |
| Supply Voltage Range | 3.13 V to 5.5 V | — |
| Betriebstemperaturbereich | -40 C to +125 C (automotive) | — |
| Number of I/O Pins | Up to 91 | — |
| Gehäuse | 144-pin LQFP (20x20 mm, LFQFP / gull wing) | 80-QFP (14x14 mm), Square, Gull Wing |
| Peripherals | CAN, SPI, SCI, IIC, PWM, A/D, Timers | LVD, POR, PWM, WDT |
| AEC-Q100 Qualification | Automotive Grade | — |
| Debug Interface | Background Debug Mode (BDM) | — |
| Instruction Set Compatibility | HCS12 / 9S12 with XGATE extensions | — |
| Montageart | Surface Mount | Surface Mount |
| MSL-Level | [DATA_NEEDED: MSL level] | — |
| Lead-Free / RoHS | Compliant (NXP automotive product line) | — |
| Core Processor | — | HCS12X |
| Core Size | — | 16-Bit |
| Maximum Clock Speed | — | 80 MHz |
| EEPROM Size | — | 4KB |
| Connectivity | — | CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI |
| Number of I/O | — | 59 |
| ADC Resolution | — | 10-bit, 8-channel |
| Versorgungsspannung | — | [DATA_NEEDED: supply voltage range] |
| Betriebstemperatur | — | -40C to +125C (TA) |
| Packaging Method | — | Tray |
| Halogenfrei | — | Compliant |
| ECCN | — | 3A991.a.2 |
| Estimated EOL Date | — | 2028 |