S9S08AW16AE0MLC vs MC9S08DV48AMLH Vergleich
Detaillierter Direktvergleich von S9S08AW16AE0MLC von NXP Semiconductors und MC9S08DV48AMLH von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
S9S08AW16AE0MLC - 8-bit HCS08 MCU, 16KB Flash, CAN, LQFP-32 | NXP
S9S08AW16AE0MLC ✓ Aktiv
Spezifikationsvergleich
| Parameter | S9S08AW16AE0MLC | MC9S08DV48AMLH |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $3,29 | $4,31 |
| Core | HCS08 (enhanced HC08) 8-bit | HCS08 (enhanced 8-bit) |
| CPU Frequency | 40 MHz (20 MHz internal bus) | — |
| Program Flash | 16 KB | — |
| RAM | 1 KB | 2 KB |
| CAN Module | MSCAN (CAN 2.0 A/B) | — |
| ADC | 10-bit, 8-channel | — |
| Timers/PWM | 6-channel 16-bit | — |
| Communication Interfaces | 2x SCI (UART), 1x SPI, 1x I2C | — |
| GPIO (max) | 27 | — |
| Versorgungsspannung | 2.7 V to 5.5 V | 2.7 V to 5.5 V |
| Betriebstemperatur | -40 C to +125 C (automotive AEC-Q100) | -40 C to +125 C (automotive grade) |
| Gehäuse | 32-pin LQFP, 7 x 7 mm | 64-LQFP (10x10 mm) |
| Montageart | Surface Mount (gull-wing) | Surface Mount |
| Debug Interface | Single-wire BDM (background debug mode) | Background Debug Mode (BDM) |
| Instruction Set | HC08 with BGND extension | HC08 with BGND extension |
| CPU Maximum Frequency | — | 40 MHz (20 MHz bus) |
| Program Memory (Flash) | — | 48 KB (48K x 8) |
| Interrupt Sources | — | Up to 32 |
| Pin/Package Count | — | 64 pins |
| Datenbusbreite | — | 8-bit |
| MSL-Level | — | 3 (168 hours) |
| RoHS-Status | — | Compliant |
| Lead-Free | — | Yes |