S9S08DV32F1MLC vs S9S08AW8AE0CLC Vergleich
Detaillierter Direktvergleich von S9S08DV32F1MLC von NXP Semiconductors und S9S08AW8AE0CLC von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
S9S08AW8AE0CLC - 8-bit S08 MCU, 8KB Flash, 40MHz | NXP
S9S08AW8AE0CLC ✗ AbgekündigtSpezifikationsvergleich
| Parameter | S9S08DV32F1MLC | S9S08AW8AE0CLC |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Obsolete | Ende des Lebenszyklus |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $2,74 | $1,35 |
| Core | HCS08 (enhanced HC08, CISC) | — |
| CPU Frequency | 40 MHz (20 MHz bus) | — |
| Program Memory (Flash) | 32 KB (32K x 8) | — |
| RAM | 2 KB (2K x 8) | — |
| Number of I/O | 25 | 22 |
| ADC Resolution | 12-bit | — |
| ADC Channels | 16 / 24 channels | — |
| ADC Conversion Time | 2.5 us | — |
| Interrupt / Reset Sources | Up to 32 | — |
| Versorgungsspannung | 3.3 V / 5 V | — |
| Oscillator Type | External | — |
| Instruction Set | HC08 + BGND | HC08 with added BGND instruction |
| Gehäuse / Bauform | 32-LQFP (7x7 mm) | — |
| Montageart | Surface Mount | Surface Mount |
| Packaging | Tray | — |
| Betriebstemperatur | -40C to +125C (automotive grade) | -40C to +85C |
| RoHS-Status | [DATA_NEEDED: RoHS status] | RoHS Compliant |
| Core Processor | — | S08 (HCS08) |
| Core Size | — | 8-bit |
| CPU Speed | — | 40 MHz |
| Program Memory Size | — | 8 KB (8K x 8) FLASH |
| RAM Size | — | 768 x 8 |
| Supply Voltage Range | — | 2.7 V to 5.5 V |
| Connectivity | — | I2C, SCI, SPI |
| Peripherals | — | LVD, POR, PWM, WDT |
| Qualification | — | Automotive Qualified (AEC-Q100 per distributor data) |
| Gehäuse | — | 32-LQFP (7x7 mm), 0.8 mm pitch, gull-wing terminals |
| Lebenszyklusstatus | — | End of Life (per NXP product page) |