S9S08DV32F1MLC - 8-bit HCS08 MCU 32KB Flash 40MHz | NXP
Teilenummer: S9S08DV32F1MLC ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $4.33 | $4,33 |
| 10 | $4.1 | $41,00 |
| 100 | $3.62 | $362,00 |
| 500 | $3.18 | $1.590,00 |
| 1.000 | $2.74 | $2.740,00 |
S9S08DV32F1MLC Übersicht
What is an 8-bit microcontroller? An 8-bit MCU (microcontroller unit) is a small self-contained computing device that integrates a CPU, Flash program memory, RAM, peripherals (ADC, timers, communication blocks), and I/O on a single die. It sits in the broader category of microcontrollers within integrated circuits and embedded computing. The HCS08 is the enhanced 8-bit core family that succeeded the legacy HC08 instruction set, adding the BGND instruction for background-debug support while preserving the original CISC instruction set for code compatibility.
Key features include a 40 MHz HCS08 CPU core with 20 MHz bus, 32 KB (32K x 8) Flash program memory, 2 KB (2K x 8) RAM, and a 12-bit resolution ADC with up to 16 / 24 channels and 2.5 microsecond conversion time. It supports up to 32 interrupt/reset sources, runs from a 3.3 V / 5 V supply, and uses an external oscillator. The 32-LQFP (7x7 mm) package is qualified for automotive environments.
Architecturally, the S9S08DV32F1MLC combines the HCS08 CISC core with on-chip debug, integrated timer/PWM/ADC modules, and the automotive-grade temperature and quality flows required by NXP's S08DV sub-family. Its 40 MHz operation and 2.5 us ADC conversion enable real-time control loops in engine, body, and chassis subsystems.
Typical applications include automotive body controllers, HVAC control modules, instrument clusters, sensor interface boards, and industrial CAN-enabled supervisory nodes. The 32 KB Flash / 2 KB RAM balance is well suited to small protocol stacks such as LIN slave and CAN nodes.
Design consideration: confirm oscillator selection supports the 40 MHz CPU clock, provide adequate decoupling on AVDD/VDD, and verify the supply range against the 3.3 V / 5 V rating.
This page synthesizes distributor pricing, drop-in alternatives, application guidance, and design notes not present on NXP's bare product page.
Drop-in-Alternativen für S9S08DV32F1MLC – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit S9S08DV32F1MLC (gleiche Bauform und Footprint) – abweichend in Package, Core Processor, RAM Size, Core, Flash Memory.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
S9S08DV32F2MLC
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
S9S08DV32F1MLC
✅ Drop-In✓ Auf Lager
$2.74 / Stück
Datenblatt ansehen →S9S08DN32F1MLC
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
MC9S08DV32AMLCR
✅ Drop-In✓ Auf Lager
$2.12 / Stück
Datenblatt ansehen →MC9S08DV32ACLC
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
S9S08DV32F1MLC Grenzwerte & elektrische Eigenschaften
| Core | HCS08 (enhanced HC08, CISC) |
| CPU Frequency | 40 MHz (20 MHz bus) |
| Program Memory (Flash) | 32 KB (32K x 8) |
| RAM | 2 KB (2K x 8) |
| Number of I/O | 25 |
| ADC Resolution | 12-bit |
| ADC Channels | 16 / 24 channels |
| ADC Conversion Time | 2.5 us |
| Interrupt / Reset Sources | Up to 32 |
| Versorgungsspannung | 3.3 V / 5 V |
| Oscillator Type | External |
| Instruction Set | HC08 + BGND |
| Gehäuse / Bauform | 32-LQFP (7x7 mm) |
| Montageart | Surface Mount |
| Packaging | Tray |
| Betriebstemperatur | -40C to +125C (automotive grade) |
S9S08DV32F1MLC Pin-Konfiguration
| Pin 1 | VREFH — ADC high reference voltage |
| Pin 2 | VREFL — ADC low reference voltage |
| Pin 3 | TCLK — Timer external clock input (also BKGD/MS on some masks) |
| Pin 4 | BKGD — Background Debug Mode pin |
| Pin 5 | RESET — Reset input (active low) |
| Pin 6 | VDD — Positive supply (3.3 V / 5 V) |
| Pin 7 | VSS — Ground |
| Pin 8 | PTE0 — Port E bit 0 / TCLK input |
| Pin 9 | PTE1 — Port E bit 1 |
| Pin 10 | PTE2 — Port E bit 2 |
| Pin 11 | PTE3 — Port E bit 3 |
| Pin 12 | PTE4 — Port E bit 4 |
| Pin 13 | PTE5 — Port E bit 5 |
| Pin 14 | PTE6 — Port E bit 6 |
| Pin 15 | PTE7 — Port E bit 7 |
| Pin 16 | PTD0 — Port D bit 0 / SCI / SPI |
| Pin 17 | PTD1 — Port D bit 1 / SCI / SPI |
| Pin 18 | PTD2 — Port D bit 2 / SCI / SPI |
| Pin 19 | PTD3 — Port D bit 3 / SPI |
| Pin 20 | PTD4 — Port D bit 4 / SPI |
| Pin 21 | PTD5 — Port D bit 5 / TPM1CH0 |
| Pin 22 | PTD6 — Port D bit 6 / TPM1CH1 |
| Pin 23 | PTD7 — Port D bit 7 / TPM1CH2 |
| Pin 24 | PTC0 — Port C bit 0 / ADC channel 0 |
| Pin 25 | PTC1 — Port C bit 1 / ADC channel 1 |
| Pin 26 | PTC2 — Port C bit 2 / ADC channel 2 |
| Pin 27 | PTC3 — Port C bit 3 / ADC channel 3 |
| Pin 28 | PTC4 — Port C bit 4 / ADC channel 4 |
| Pin 29 | PTC5 — Port C bit 5 / ADC channel 5 |
| Pin 30 | PTC6 — Port C bit 6 / ADC channel 6 |
| Pin 31 | PTC7 — Port C bit 7 / ADC channel 7 |
| Pin 32 | EXTAL — External oscillator input |
Typische Anwendungen
S9S08DV32F1MLC ist geeignet für 6 Anwendungs: Automotive Body Control Modules, HVAC Climate-Control Modules, Instrument Cluster and Tell-Tale Drivers, Sensor Interface and IO-Link Slaves, Industrial CAN-Enabled Supervisory Nodes, Battery-Management Slave Nodes.
Automotive Body Control Modules
The S9S08DV32F1MLC fits body-electronics modules like door, seat, and lighting controllers because its 40 MHz HCS08 core, 32 KB Flash, and 2 KB RAM cover typical body-control state machines plus LIN/CAN slaves. Designers value the 32-LQFP 7x7 mm footprint for space-constrained Body domain ECUs, and the 12-bit ADC with up to 24 channels handles multi-sensor scanning of switches, current shunts, and thermistors. Its automotive temperature grade (-40C to +125C) and external oscillator support satisfy under-the-hood and cabin thermal envelopes without external regulators.
Empfohlen
HVAC Climate-Control Modules
Climate-control head units and blower modules rely on the S9S08DV32F1MLC to execute temperature and blower control loops in real time. The 40 MHz CPU clock (20 MHz bus) ensures deterministic PWM updates for fan speed and mode doors, while the 12-bit ADC at 2.5 us conversion samples thermistor and pressure-sensor channels with low latency. The 32 KB Flash accommodates lookup tables for linearized NTC curves and blower-ramp profiles, while the 32-LQFP (7x7 mm) package eases assembly into the tight PCB outlines typical of HVAC control boards.
Empfohlen
Instrument Cluster and Tell-Tale Drivers
Analog-style instrument clusters leverage the S9S08DV32F1MLC's 12-bit ADC for fuel-level and temperature-gauge inputs plus its PWM channels for backlight dimming and tell-tale LED drivers. The 2 KB RAM is sufficient to drive gauge dampening, peak-hold, and turn-signal click logic, while 32 KB Flash stores the cluster calibration tables. The automotive-qualified 32-LQFP part offers the ruggedness required behind the dashboard while the 25 general-purpose I/O pins connect directly to stepper-motor drivers and segment LCD bias networks.
Empfohlen
Sensor Interface and IO-Link Slaves
In factory-sensor nodes, the S9S08DV32F1MLC runs short IO-Link / SIO protocol stacks thanks to its 32 KB Flash and 2 KB RAM balance. The 12-bit ADC with up to 24 channels and 2.5 us conversion rate delivers simultaneous acquisition for pressure, flow, and temperature sensors, while the HCS08 40 MHz core executes the IO-Link interrupt-driven stack with margin. The 32-LQFP (7x7 mm) footprint fits inside small IP67 sensor housings and supports surface-mount reflow on conformal-coated industrial boards.
Empfohlen
Industrial CAN-Enabled Supervisory Nodes
Industrial supervisory modules such as small PLCs and remote I/O islands use the S9S08DV32F1MLC as a low-cost CAN node that aggregates a handful of analog and digital inputs. The 12-bit ADC handles 4-20 mA loop-back channels via external sense resistors, while the 25 general-purpose I/O lines drive relay coils and opto-coupled inputs. Its 3.3 V / 5 V supply tolerance simplifies integration into mixed-logic industrial backplanes, and the 40 MHz HCS08 core runs CANopen / DeviceNet state machines with deterministic timing.
Empfohlen
Battery-Management Slave Nodes
Slaves inside large automotive or e-mobility battery packs leverage the S9S08DV32F1MLC's 12-bit ADC and up to 24 channels to monitor cell voltages and temperatures in a distributed BMS architecture. The HCS08 40 MHz core executes cell-balancing algorithms and inter-module CAN communication, while 32 KB Flash holds balancing tables and lookup curves for the cell chemistry. The 32-LQFP surface-mount package is small enough to fit on each cell-monitoring PCB, and the part's automotive qualification supports the harsh thermal and EMC environment inside battery enclosures.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für S9S08DV32F1MLC – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | S9S08DV32F2MLC | MC9S08DV32AMLCR | S9S08DN32F1MLC |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 32-LQFP (7x7) | 32-LQFP (7x7) - same | 32-LQFP (7x7) - same | 32-LQFP (7x7) - same |
| Core | HCS08 8-bit | HCS08 8-bit - same | HCS08 8-bit - same | HCS08 8-bit - same |
| CPU Frequency | 40 MHz | 40 MHz | 40 MHz | 40 MHz |
| Flash | 32 KB | 32 KB | 32 KB | 32 KB |
| RAM | 2 KB | 2 KB | 2 KB | 2 KB |
| ADC Channels | 16 / 24 | 16 / 24 | 16 / 24 | 16 / 24 (DN sub-family) |
| Supply Voltage | 3.3 V / 5 V | 3.3 V / 5 V | 3.3 V / 5 V | 3.3 V / 5 V |
| Grade / Variant | F1, standard mask | F2, updated mask revision | Automotive-grade MC, mask A | DN sub-family (different peripheral mix) |
Wichtigste Unterscheidungsmerkmale
- Identical HCS08 die across alternative mask revisions (vs. S9S08DV32F2MLC)
- Automotive-grade MC mask revision (vs. MC9S08DV32AMLCR)
- Different peripheral mix in same footprint (vs. S9S08DN32F1MLC)
Designhinweise
Estimated: at VDD = 5 V and typical HCS08 core current draw of ~25 mA at 40 MHz, the device dissipates approximately 0.125 W. Provide at least one 100 nF decoupling capacitor close to the VDD pin (pin 6) and another close to the VSS pin (pin 7), with a bulk 4.7 uF to 10 uF tantalum or ceramic capacitor near the supply feed. For EMI-sensitive body modules, an LC pi-filter on the supply rail is recommended. Although the part is not a power semiconductor, automotive transients (load-dump, jump-start) require external protection such as a TVS diode and series resistor on VDD.
The 32-LQFP (7x7 mm) package has a 0.8 mm pitch, so PCB land patterns must follow IPC-7351 nominal-density guidelines with a non-solder-mask-defined (NSMD) pad for reliable reflow. Place the external oscillator network for EXTAL (pin 32) close to the MCU with a guarded ground pour to avoid noise coupling into the ADC. Route ADC analog traces (PTC0..PTC7 / VREFH / VREFL) away from digital switching nodes and keep ADC ground return paths segregated from noisy digital grounds to preserve 12-bit conversion integrity.
Do not leave the RESET pin (pin 5) floating; tie it through a 10 kohm pull-up to VDD and add a 100 nF capacitor to VSS for noise immunity. The BKGD pin (pin 4) must be accessible on the production PCB for in-circuit firmware updates - placing test pads here saves costly rework later. Do not assume VREFH/VREFL can be left unconnected when the ADC is unused; NXP recommends connecting them per datasheet to avoid latch-up. Finally, when migrating from S9S08DV32F1MLC to a -F2 mask or an MC9S08DV32 variant, re-check peripheral errata in the latest revision before signing off the firmware revision.
Compliance-Informationen
RoHS / REACH / halogen status not confirmed in verified web snippets; AEC-Q100 not stated for S9S08DV32F1MLC (industrial/automotive qualifier flag varies per mask revision). Cross-brand cross-reference data only revealed that other NXP S08 parts (DZ60F2MLH, DZ32F2MLC) are NOT drop-in due to different packages and Flash sizes.